microTCA规范
PICMG microTCA.0 Specification RC1.0ContentsIntroduction and objectives1.1 Overview1.2 Introduction1.2.1S1.2.2 MicroTCa implementation options1画1-21.2.3 Design goals1-21.2.4 Elements of microtca1-312.5 Theory of operation……着1国面1面日正1-81.3 Micro TCA enclosure types191.3.1 Single Shelf implementation191.3.2 TWo Tier mⅸ ed Width Shelf implementation.…….….….….….….….…....1-101.3.3 Two-Tier fixed Single Width Shelf implementation ....................1-101.3.4 Back-to-Back Shelf implementation.1-101.3.5 Cube Shelf implementation..1-101.3.6 Pico Shelf implementations1111.3.7 Other implementation options1111.4 Application examples1-1114.1 Base station…1-111.42 Router1-121.4.3∨ olP node.….1-121.4.4 Other Telecom Network applicationsE画1-121.4.5 Enterprise applications1-131.4.6 Other applications.....1-131.4.7 Consumer applications1-131.5 Special word usage1-131.6 Conformance1-141.7 Dimensions1-141.8 Regulatory guidelines1-141.9 Reference specifications1.10 MicroTCA0 Specification contributor……1-151-161.11 Name and logo usage1-161.12 Intellectual property……1-171.12.1 Necessary claims1,,面,国国,,国面正∴1-181.12.2 Unnecessary claims11181.12. 3 Third party disclosures1-181.13 Glossary1-192Mechanical2-12.1 Mechanical overview∴………….2-12.1.1 Terminology…2-22.1.2 Typical arrangement examples2-22.2 Dimensions, tolerances, drawing symbols, and nomenclature2-62.3 Mechanical concept2-82.4 AdvancedMC Module orientation, location, and positioning2-1624.1 Module orientation.2-162.4.2 Module positioning, horizontal--mandatory2-172.4.3 Module positioning, vertical-mandatoryU.882-192. 4. 4 Module positioning, depth--mandatory,.42-21PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification2.5 Slot detail dimensions2-222.5.1S|ot..2-222.5.2 Slot configurations, subdividing Slots2-222.5.3 Card guide, Strut, and Card Guide Support Plate(CGSP)…………2232.5.4 Optional Subrack attachment plane2-322.5.5 AdvancedMC Module--optional locking………………………2-342.6 Backplane2-3627 Subrack dimensions2-412.7.1 Mandatory Subrack2-422.8 Shelf2-472.8. 1 Shelf types.2-482.8.2 Shelf width and height…...…2-492.8.3 Shelf depth2-492.8.4 Air filter provision2-502.8.5 ESD wrist strap interface2-502.8.6 Shelf alarm LEDs2-512.9 Cable management2-522. 10 Power entry /Power Module2-562.10.1 Power Module pcb dimensions2-582.10.2 Power Module component height1·面2-632.10.3 Power module face plate2-642.10. 4 Power Module handle/Latch mechanism.2672.10.5 Power module lEDs2-672. 10.6 Power Module EMc gasketing2-672.10.7 Power Module satety covers2-672.10 8 Power module labels2-682.10. 9 Power Module Backplane Connector2-682.11 MCH Module2-692.11.1 Module types2-692.11.2 MCH PCB dimensions.2-702.11.3 MCH Subrack slot details2-772.11. 4 Plug Connector.2-792.11.5 Sequencing and contact area2-812.11.6 MCH positioning2-812. 12 Air flow management面2-822.13 Auxiliary Connector(Zone 2 and zone 3)keying2-832.13.1 Component keep- in height2-842.13.2 Connector keep-in height2-842.133 Keying block…2-852.13.5 AMC0 electrically compatible keying block2.13. 4 Keying block with electrical connections2-86.2-872.14 MicroTCa cube2892.15 MicroTCA Pico2.16 Microtca filler pane的∵面1面面,面2-902-902.17 Cooling Units(CUs)2-912.18 Subrack/Shelf/Cube/Pico performance.2922. 18.1 Load carrying2-922.18.2 Insertion cycles2922.18.3ESD2-922.18.4EMC2-93PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification2. 18.5 Safety2-932.18.6 Physical Slot and Tier numbering2932.19 Subrack/Shelf environmental2-962.19. 1 Subrack shock and vibration2-962.19.2 Earthquake.........2-962.19.3 Flammability2-962.19.4 Atmospheric2-962. 19.5 Thermal2-972.19.6 Acoustic∴…………………2972.19.7 Surface temperatures2-972.20 References2-973 Hardware platform management3-13.1 Overview3.1.1 Micro Tca Carrier model3-13.1.3 Relationship with IPMI, AdvancedMC, and AdvancedTCA.3.1.2 MicroTCA management architecture3-23-73.1.4 Key differences from PICMG 3.0 and AMC.0 specifications..........3-73.1.5 PICMG properties and FRU Device ID assignments3-93.2 Management-related interconnects3-113.2.1 AdvancedMc interconnects3-113.2.2 Power Module and Cooling Unit interconnects3.2.3 Guidelines for OEM Module interconnects and management3-133-143.2.4 Carrier FRU Information device requirements.3-153.25 Microtca carrier interconnects3-193.3 Carrier Manager.…….…..…...…3-203.3.1 MCH Face Plate indicators3-223.3.2 Payload Interface3-223.3.3 Carrier Manager IP address3-223.3.4 IPM event support∴3-243.3.5 Redundant MCH operation3-253.3.6 Addressing3-263.3.7 Carrier number3-293.3.8 Location information34 Shelf Manager…3-383. 4.1 Shelf Manager configuration options383.4.2 Differences from the AdvancedTca shelf Manager3-403.4.3 Shelf-Carrier Manager Interface翻套国画1面,国面,1面D国画面国3-423.4.4 Shelf Manager IP addre3-433.5 MCMC requirements3453.6 EMMC requirements3-463.7 Operational state management3-483.7.1 Carrier Manager start up……….….….….………..……3483.7.2 Shelf Manager actions on Carrier detection3-483.7.3 Normal Shelf operation1B面面国B3-483.7.4 Abnormal situation handling3-4938 Power management.……3-493.8.1 Power clapping国面3-503.8.2 Micro T CA Carrier Power Management records.3-513.8.3 Early power management356PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification3.8.4 Normal power management.3-573.8.5 Power management commands and sensors3-593.8.6 Abnormal power condition handling3-673.9 Cooling management3-693.9.1 Fan geography.…3-703.9.2 Cooling control…3-713.9.3 Normal cooling operation3-723.9.4 Abnormal cooling operation3-733.9.5 Fan tachometer sensors3-733.9.6 Temperature sensors翻画1国翻B1B…3-733.10 Electronic Keying3-743.10.1 Micro TCA Carrier point-to-point connectivity information3-753.10.2 Module point-to-point connectivity information.3-773.10.3 AMC Port state commands3-783.10.4 Clock b- Keying……3-783.11 Telco alarm management3-73. 12 System Event log…………3-863.13 Sensor management3-863.13.1 Guidelines and requirements for fru sensor events3-863.13.2 MCMC SDR requirements.3-873.13.3 EMMC SDR requirements3-883.13.4 Carrier Manager SDR requirements3-883.14 fru Information.3-913. 14.1 EMMC FRU Information3-913. 14.2 MCMC FRU Information3-913.143 Carrier FRu Information3-923. 14.4 Shelf fru information面国面国面3-923.15 PMI message bridging……….3-933.15.1 Message bridging process3-933.16 PMI functions and command3-943. 16.1 Required IPMI functions..3-953.16.2 Command assignments3-973.17 FRU records, sensors and entity Ids∴3-1084 Power…4-14.1 Overview4-14.2 Loads on the Power Subsystem4-24.2.1 Microtca carrier hub(MCH),………,………………………24-24.2.2 Cooling Units4-74.2.3 Advanced mezzanine cards4-104.3 Power architecture4-134.3.1 Basic functionality4-134.3.2 Partitioning of the Power Subsystem:.::a:.4-154.3.3 Power sources4-154.3. 4 Power Subsystem redundancy4-164.3.5 System Grounding considerations4-214.3.6 Power distribution and backplane considerations4-234.4 Control and monitoring of the Power Subsystem4-2444.1 PM-EMMCs4-244.4.2 Geographic Address4-24PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification4.4.3|PMB-04-2444.4Ps1[S|o#4-254.4.5EN[Slof]#,…4-2544.6 PWRON_[Sot]…4-254.4.7PSPM#4-2644.8 PM-EMMC watchdog timer……4264.4.9 Power Module oK4-2744.10 Power module reset4-274.4.11 System power-up4-274.4.12 Input voltage sensors1国面面量面1国面4-294.4.13 Temperature sensors4-294414 Power module extraction switch4-304,415 Blue lED4-304.4.16LED14-314 4.17 Other leds4-314.5 Connectors4-314.5. 1 Power Module Output Connector4-324.5.2 Power Module Input Connectors81国面面4-324.6 Single-Width,Fu‖- Height Power Module…∴4-334.6.1 Inputs4-344.6.2 Outputs4-354.6.3 Bulk supply current limit4-384.6.4 Control and monitoring………………………4-384.6.5 Redundancy4-384.6.6 Mechanical4-4546.7 Thermals.8...8.88.84-45画·面4.6.8 Regulatory.4-4547 Other mechanical considerations…4-464.7.1 Double-Width form factor4-464.7.2 Form factors other than Full-Height4-464.8 Power source considerations.4-464.8.1 DC power feeds4-474.8.2 AC power feeds4-554.9 References4-605 Thermal5.1 Overview5-15.2 AMC. 0 Modules and microtCa国着画5-15.3 AMC.0 Carriers and microtca5.4 Subrack slot5-25.5 Airflow path5.6 AMC.0 Modules and power dissipation.5-35-35.7 MicroTCA system cooling configuration……….….….…....545. 8 Air distribution in a slot5-45.9 Air inlet and exhaust5-55. 10 Slot cooling capability5-55. 11 Module cooling requirements●5.12 Standard air.5-75.12.1 Derivatie5.122 Barometric changes due to weather....…...……….57PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification5.13 Slot impedance curve.5-85.14 Slot fan flow curve5.15 Cooling Unit failure5-85.16 Filters5.17 System sensors….…….….……5-95.18 Thermal and operating environment5-105.19 Thermal and cabling5-105.20 Simulation and impedance testing5-105.20.1 AdvancedMC/MCH reference Module..5-115.20.2 Power Unit reference module∴5-125.21 Simulation environment5.22 Thermal dynamic modeling5-135.23 Fluid networking modeling5.24 Acoustic noise5-135.25 Surface temperature5-145.26 Design recommendations5-155.27 Cooling limitations and examples..5-175.28 References1面5-226 Interconnect6-16.1 Introduction.…6-16.2 Fabric interface6.2.1 Backplane fabric interface support requirements6-26.2.2 MCH fabric interface support requirements6.3 MCH Specific Interfaces6-46.3.1 MCH update Channel interface6-46.3.2 MCH cross-over Channel interface.6-56. 3. 3 MCH PWR ON interface6-66.3.4 Inter-MCH IPMB-L interface6.4 Synchronization clock interface6.4.1 Signal descriptions6-86. 4.2 Clock architectures6-96.4.3 Non-Telecom and Telecom clocks6-136.5 JTAG interface.…6-136.5.1 JSM Overview6-146.5.2 JSM Signaling Overview6-166.5.3 JSM Interface to mch16.54 JSM Interface to mch2.……6-186.5.5 JSM Interface to Advancedmcs.6-196.5.6 JSM Interface to Power modules.6-226.5.7 JSM Master mode selection6-236.5.8 JSM Interface to External tester..6-246.5.9 MCH JTAG6-266.5. 10 Power module jtAG6-276.6 MicroTCA Interface topologies1画6-276.6. 1 Topology models6-286.6.2 Correlation to AdvancedMc fabric regions6-296.7 MCH Connector pin allocation6-306.7.1 Pin naming conventions6-316.7.2 Fabric interface naming conventions6-31PICMG MicroTCA. 0 Specification Draft RC1.o, May 26, 2006Do not specify or claim compliance with this Draft Specification6.7.3 Synchronization clock interface naming convention6-316.7.4 MCH Connector pin list……………6-326.8 System examples.6-386.8. 1 Redundant MicroTCA system6-386.8.2 Variant redundant microtca interconnect6-416.8.3 Non-redundant MicroTCA system6-45Connectors7-17.1 General information7-17.2 AdvancedMC Backplane Connectors7-17.2.1 AdvancedMC Backplane Connector pin list7-27.2.2 AdvancedMC Backplane Connector dimensions7-27.2.3 Advancedmc backplane connector pcb layout∴7-67. 2. 4 AdvancedMC Backplane Connector electrical characteristics7-107.2.5 AdvancedMC Backplane Connector high-speed characteristics7-147.2.6 AdvancedMC Backplane Connector mechanical characteristics7-187.3 Micro TCa Carrier hub connectors7-197.3.1 Micro TCA Carrier Hub Connector pin list7-197.3.2 Micro TCA Carrier Hub mating interface design7-207.3.3 Micro TCA Carrier Hub backplane connector7-227.3. 4 Micro TCA Carrier Hub Connector Backplane PCB layout7-237. 3.5 Micro tca Carrier Hub connector electrical characteristics7-247.3.6 Micro TCA Carrier Hub Connector high-speed characteristics7-2573.7 Micro tCa Carrier hub connector mechanical characteristics7-297.4 Power Module Output Connector7.4.1 Power Module Output Connector pin list and mating sequence7-317.4.2 Power Module Output Connector dimensions7-327. 4.3 Power Module Output Connector Backplane PCb layout7-347.4.4 Electrical characteristics for power Module output connector.7-367.4.5 Power Module Output Connector mechanical characteristics7-397.5 Power Module Input Connector7.5.1 Power Module Input Connector pin list and mating sequence7-417.5.2 Power Module Input Connector dimensions7-427.5.3 Electrical characteristics for Power Module Input Connector7-477.5.4 Power Module Input Connector mechanical characteristics7-517.6 AdvancedMC Auxiliary Connector7-537.7 Test schedule7-547.7.1 Specimen measurement arrangements7-547.7.2 Test schedule tables.7-647. 8 References.7-798 Regulatory requirements and industry standard guidelines8-18.1 Regulatory……8-18.1.1 Safety8-18.1.2 Electromagnetic compatibility..……………8-28.1.3 Ecology standards.8-28.2 Telecommunications industry standards requirements8-38. 2. 1 EMC/safety requirements for the telecommunications industry.......8-38.2.2 Environmental requirements for the telecommunications industry ..............8-48.3 Reliability/MTBF standards8-7PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification8.4 Cross reference list8.5 FRU test guidelines∴8-78.5. 1 FRU safety test8-88.5.2 FRU EMC testing.8-88.5.3 FRU environmental testing8-9a Module mis-insertion considerationsA-1A 1 MCH Module mis-insertion combinationsA-2A 2 AdvancedMc module mis-insertion combinationsA-5A3 Power management implicationsA-8A 4 System management implicationsA-8A.4.1 Optional MMC instance on MCH ModuleA-9A.4.2 Using an AdvancedMC in an MCH SlotA-13A.4.3 Using an mch in an AdvancedMc SlotA-15A.4.4 Detecting mis-insertionsA-16A.5 Hardware implicationsA-1A. 5. 1 GNd pins at same locations........A-20A.5.2 PSO# and PS1# pins at same locationsA-23A.5.3 PWR and MP pins at same locationsA27A.5. 4 PWR ON pinA-29A.5.5 Ga[2: 0] pins at same locations道1面4…A-31A.5.6 ENABLE# pin at same locationA-35A.5.7 SDA L and SCL L pinsA-37A 5.8 JTAG pinsA-38A 5.9 Cross-over pinsA-39A.5. 10 TMREQ#, 12C SDA, and I2C SCL pins…A-39B Requirement list….B-1PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification
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利用Hilbert变换提取信号瞬时特征的算法实现
研究了在工程中如何通过算法来实现利用 Hilbert 变换提取信号的瞬时特征。深入地分析了如何利用数值微分法提高提取瞬时频率特征的精度。最后,给出了一种可行的算法,并通过实验验证了这种方法可以在工程中有效地提取信号的瞬时频率特征。84微机发展第13卷①H(x)=y;H(x)=y;(i=0,1,…n)(j=0,1(11)②在每个小区间/x1,x1+17i=0,1,…,n-1)上由相关定理知:当划分的小区间的长度趋于零时H(x)是三次多项式。s(x)及其一至三阶导数分别一致收敛到f(x)及其一至可以写出分段三次 Hermite插值函数的分段表达式:三阶导数。所以用三次样条插值函数去近似表达用离散值(x)=(1+2x-x过+)2v;+表示的原函数,具有较高的可靠性。3)两种插值的比较挨尔米特 Hermite插值较三次样I-i,1+2条插值具有较好的稳定性与收敛性,但它只能休让各段曲线在连接点上的连续性,而不能保证整条曲线在这些点上y+1Ditl的光滑性。而有时不仅要求曲线连续,而且要求曲线的曲X/(i=0,18)率也连续即要求分段插值函数具有连续的一阶导数,埃H(x)的导数为尔米特 Hermite插值此时就不能满足上述要求6次样条插值较埃尔米特 Hermite插值具有较好的H(x光滑程度,用三次样条插值函数求数值导数比用埃尔米特+2(x-x2(xHermite插值可靠性大,但计算比较复杂,二者的区别见图h2yV+17, h(i-0,12)三次样条插值。已知函数y=f(x)在区间/a,b上的n+1个节点上的值y=f(x;)(i=0,1,…m),求插值函数s(x),使(i=0,1图4 Hermite插值与三次样条插值的比较图2在每个小区间x,x+1(=0.1.…n-1)上利用埃尔米特 Hermite插值得到的2FSK信号的瞬时s(x是三次多项式,记为s(x频率见图5,利用二次样条插值得到的该信号的瞬时频率③3(x)在la,b/上二阶连续可徵。见图6。数s(x)称为f(x)的三次样条插值函数可以利用节点处的二阶导数值为参数,也可以利用节点处的导数值为参数求三次样条插值涵数的表达式。若利用节点处的一阶导数值为参数,求得的三次样条插值函数的表达式为(x)=M-1x-x-)36 h6 hMihi5 DEMeN5a亩pai66hx∈[x;,x+17,b-x+1-x,S"(x)=M图5由 Hermite插值提取图6由三次样条插值提取(j=0,1的2FSK信号的瞬时频率的2FSK信号的瞬时频率对s(x)进行求导,利用S(x)在节点处一阶导数连从图5、图6可以看出利用三次样条插值得到的瞬时续的性质结合边界条件求解出参数M,把求得的参数代频率可以准确反映出信号具有的的摒时频率特征而利用入公式(10),即得三次样条插值函数的s(x)分段表示式。埃尔米特 Hermite插值得到的瞬时频率与信号具有的瞬s;(x)的导数为时频率特征不符。这是因为利用数值微分法求瞬时频率插值以后喫进行求导。三次样条插值函数具有连续的二阶M2 hiM; 2 hj导数,因而具有较好的光滑程度,符合求导条件,所以可以J+1-h(M2+1-M/)准确求出信号的瞬时频率;而埃尔米特 Hernite插值.不够光滑,虽能保证插值多项式收敛于原函数,但不能保证插x Elx,x;+1 h,=xi+I-x, S(xj )=M;值多顷式的导数收敛于原函数的导数,所以求得的值与信o1994-2010ChinaAcademicJournalElectronicPublishingHouse.Allrightsreservedhttp://www.cnki.net第6期刘慧婷等:利用 Hilbert变提取信号瞵时特征的算法实现号实际的瞬时频率值不符。实验结果和理论分析结果是(1) Hilbert变换只能近似应用于窄带信号,即形如纹的(t)=a(1)cosu+6(1)),其中>>B(B为信号带2.3.3结论宽)的信号。但实际应用中,存在许多非窄带信号, Hilbcrt利用数值微分法求瞬时频率ω(t)的步骤可以归纳变换对这些信号无能为力为:首先通过三次样条插值得到分段多项式p(1),(2)对于任意给定时刻,通过 Hilbert变换运算后的结pp(抄);然后分别对分段多项式p(t),Pp()关于变量t果只能存在一个频率值,即只能处理任何时刻为单一频率进行求导,得到pd(,ppd(t);最后求出每一时刻t所对的信号。这显然不合理,因为在实东中同一信号会含有多应的导数值,即求得t(t,u(t)。再把求得的值代入公种频率成分式(6)就完成了提取瞬时频率ω(1)的过程。求解结果见(3)对信号进行 Hilbert变换时,信号的两端会出现严图7重的端点效应。提取某些信号瞬时特征所得的瞬时频率在局部出现了负数,端点效应是造成负频率的一个原因而端点效应可以通过利用特征波对原有数据序列进行延拓的方法来解决,具体解决办法将在今后讨论。尽管目前出现了EMD担论4,其目的是将不满足Hibt变换的信号进行分解得到若干个IMF( intrinsic mode function),然后进行 Hilbert运算,达到提取信号瞬时特征的目的。该理论开辟了信号处理的新空间。但它还不够成熟还需喫进一步的完善和研究图7利用数值微分法提取信号的瞬时频率特征参考文献从图7可以看出,以三次烊条指值进行的数值微分可[]黄长蓉. Hilbert变换及其应用[J].成都气象学院学报以准确岀提取岀信号的瞬时频率特征。199,14(3):273-276.[2]杨小牛,楼A义,徐建良.软件无线电原理与应用[M].北3结束语京:电子工业出版社,2001在工程中, Hilbert变换使得我们对短信号和复杂信号[3]丁丽妤.数值计算方法[M].北京:北京理工大学出版社,的摒时特征的提取成为可能特别是对瞬时频率特征提1997取,在工程中具有十公重要的意义。文中讨论的利用三次[4] Huang N e. The empirical mode decomposition and the hilbert样条插值进行数值徵分以提取瞬时特征的方法是可行的,spectrum for nonlinear and nor stationary time series anal ysis但还存在着如下问题。[].Proc.R.soc.Lond.A,1998,454:903-995(上接第81页)218994。例22(x)=(1-2siny=223101075一般的(A算法计算了120代,求到的最大值为454176.219。154370083改进的α算法计算了34代,求到的最大值为1048575.875。改进后的αA算法收敛速度(指迭代次数)比一般GA算法几乎快了一个数量级,精度也提高了不少,特别是例2的最大值提高一倍多,速度提高这么快是未曾料到的y=74958参考文献+4X Axl Thla[1]陈国良.遗传算法及其应用[M]·北京:人民邮电出版社,图2函数2的图像1996一般GA算法计算了20代,求到的最大值为[2]袁亚湘,孙文瑜.最优化理沦与方法[M]北京:科学出版社,19991.218983[3]张铃,张钹·遗传算法杋理的硏究[J]·软件学报,改进(A算法计算了5代,求到的最大值为2000,11(7):945952o1994-2010ChinaacAdemicJournalElectronicPublishingHouse.Allrightsreservedhttp://www.cnki.net
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