pspice编程技术
学习pspice的入门资料，很适合初学者。EDA工具应用丛书Spice/ PSpice绵程技术高燕梅房蔓楠编A995B9電子工業出版Publishing House of Electronics industry北京· BEIJIⅠNG内容简介在众多的计算机辅助设计(CAD〕工具软件中,pie程序是精度最高、最受欢迎的软件丁具许多EDA系统软件的电路模我都分都是用ice序来完成的。本书系统讲述spie/ PSpice編程技术,并提供大量的编程仿良实例。全书分为7章1第1章介绍Spie程序的功能和特点;第2章和第3章分别介绍 PSpice Is版和wnws版的编程电路图绘制电路分析及波形处理方法;第4章介绍元器件的spce模型及参数;第5章介绍各种spre数学宏模型和系统宏模型;第6章绘出常用电路的仿真实例;第7章讲述运行 Spice序时可能出现的不收敛现象以及克服不收敛问题的方法本书可作为大中专院校电子类专业的教材或实验考书,也可供屯了系统设计、开发人员和电路设计爱好者参考a未经许叮,个得以任何方式复制或抄袋本书之部分或全内容。版权所有,侵权必究图书在版编目【CP}数据Spic:e/FSpice编釋技术/高燕悔房蔓楠编著.—北京:电子工业出版社,2002.6(EDA|县应用丛书sN7553691RI.S…〗.①高…②房…Ⅲ.电子电路一计算机辅助设计一应用软件, pice/Pspice-程序设计tY. TNI02屮国版本图书馆CP数据核字(2002)第035519号责任編辑:张来盛印刷:北京大宇星印圳出版发行:电了工业出版社htp://ww.phei. Com.cn引京市海淀区万寿路173信箱邮编100035经销:各地新华书店于本:787×10921/16印张:1925字数:4928千字版次:2002年6月第1版2002年6月第1次印刷印数:6000册定价:2800元凡购买旦子L业出版社的至书,如有缺损问题请向购买书店调换。若书店售缺请与本社发行部联系联系电话:(C0)68279077臃着计箅机技术的飞速发展,计算杋辅助设计(CA门)技术已成为屯路设计工程师不吁缺少的有力工具。国内外电子线路CA软件的相继推出与版本更新,使CA技术的应用渗透到电子线路与系统设计的各个领域,如电路图的绘制、模拟电路仿真、逻辑电路分析、优化设计、印刷电路版的布线等。CAD技术的发展使得电子线路设计的速度、质量和精度得以保证在众多的CAD工具软件中,Spce程序是精度最高最受欢迎的软件T具,许多EDA系统软件的电路模拟部分是应用 Spice程序来完成的。Ppie是Spce程序应用在P!上的程序,它的主要算法与 pire相同。由于 PSpice A/程序集成了模拟与数字电路的仿真运算法,它不仅订以仿真单一的模拟电路或数字电路,而H可以有效、完善地仿真模拟和数字混合电路。经过多年的改版, PSpice AD以其强大的功能炇高度的集成性而成为现今最受欢理的电路仿真软件。 PSpice程序已被另一家在FDA领哦的大公司 OCAD并购,更名为 OrAD PSpice A/D,版本升级为v。根据多件来对 Spice程序的学习和讲究我们认为,然pice程序不断升级,各种版本的编辑窗口变化多端而豆新功能不断发展,令初学者眼花缭乱,但如果能首先掌握Spie程序的基本编程语言,即 pice pos版的編程方法,了解Spi程序的基木计算方法和常用模型,就掌握了pice程序的真谛,任何版本的pice程序都能轻松驾驭。基于这一点,衣编群本书时,我们以 PSpice的0s版为例,详细讲解 Spice的基本编程语言,由浅入深,求消晰易懂。这是本书与其他Psce程序书籍不同的重要特点,希望读者在使用木书时会有深刻体径杯书内容分为7章。第1章概要介绍$pe序的功能和特点;第2章详细介绍PpieDOS版的编程方法和各种分析功能对各种元器件及电路给出了编程示例使得初学者很容易掌握;第3章洋细介绍 ISpice Windows版应用轶件的电路图绘制和电路分析、数据波形处理方法;第4章详细介绍二极管丑r晶体管、MOS场效应管等器件的模型电路及参数,并有详尽的图形公式讲解;第5章介绍应用 PSpice程序编程功能实现的各种数学宏模型和系统宏模型,这些宏模型可以内置于电路系统中,代替部分电路模块的功能或作为测试源,乜可以代替不需设计的屯路部介,使得电系统的分析测试简化,精度提髙;第6章给出·些常用电路的仿真实例;第7章介绍运行spie程序时可能出现的不收敛现象和克服不收敛问题的方法本书的主要特点(1)适用于初学者。本书对DO版的ppie程序作了详细约介绍,给出了各种电路的编程举例;对 Windows版 PSpice程序的各种菜单命令给出了详细的说明,使初学者能很快学会绘制电路图的方法,并应用各种指令进行分析,打印输出结果。(2)适用干木科、专科学牛和电路设计爱好者。学优布学会应用spic程序后,可以随时方使地利用 Spice软件检查作业,完成电路设计编程和课程设计任务如果他们对电路的基木理论不清楚,就不会有正确的运算步骤也不能从程序中得到正确的解答,这时学生就需要修改稆序。这种反复运算的过程是教会学生本理论的有效方法。电路教学实践表明,孜科书中的与颞没钌作一的题,最好的解答往社是越出常规的。理论学习好的学生,往往不一定能解决实际的工程问题,从而不能话应激烈的市场竞争的需要。实际的工程问题必狐通过反复设计实践来解决。应用 spice程进行设计,能够培养学竺的创造性思绁。(3)Spie序是实验师的好帮手。粗通计算机技术的教帅可以通过本迅速地掌握ice编程技术将其应川于实验教学,既可以鼓助学牛进行创造性的实验活动,可以桰助学生加深理解理论分析的步骤和结果。在应用实际元器件和仪表进行实验时,由于元器件、设备和时间的限制,学生只能徹一些确定的实验:而应用spce教件进行设计,学生可以进行多种电路实验,将多种设计方案输入计算机,用 Spice软件调测设计电路,比较改进设计结果些实际也路的成功设计,可以更加激发同学们的创造热情,迅速提高他们的电路设计能力(4)为1程技术人员提供了详尽的模型资料和有效的宏模型。读者在设计电路时,可根楞设计需要选定模型参数,在调测屯电路时可以通过修改模型参数来得到最设计结果。由于编著者水平有限加之吋问仓促;书中难免有不妥之处,敬请读者批评指正:。编著者202年1月目录第1章论…(l)第2章 PSpice DOS版编程…看司即甲4p■即甲p甲唱自即看■口口申d『p自11■■督會血血血11■2.概述111……………,……………………(4)版 PSpice的组成2.]2 PSpice的装与运行翻山酯■口鲁鲁■一口即……………(5)2.2屯路描述…………(5)221电路描述语句自■中中■山2.2.2分柝指令格式………2.2.3输出指令格式中·中·P…(10)2.24简单程序举例…………(10)2.3元器件描述………(11)23.1元件描述语付………23.2器件描述语句……………………………………………………………………(20)2.3.3屯源描述语句■■L■昌L山昌山▲(49)4分析指令(55)4.1直流分忻指令……■■卜■P■鲁■自曾血自自血自血自■自血■■血■■血自鲁自■血b曲會血………(55242交流分析指令(57)24.3噪声分析指令57)244膦态分析指令………………亠郾·■·▲·↓↓↓↓中·dpc+■鲁■q(582.4.5傅里叶分析■■■58)2.5输出指令■日「■■■早,■■『卩q卜■↓■4晋b量b………(59)2.s.1数据打印评句……………………(59)2.5.2文本绘图语句…………………f6l2.5.3图形后处理程序(62)2.5.4打印宽枣话何62)2.6其他功能描述语句P·14昌山如■+--中『甲中即『『日『日4d『‘(63)2.0.1任选唤培句4聊ψψ■中φPp中p白pq◆F(63)26,2结束语句……(64)2.6.3包含话句………………………(64)2.7子电路与库函数日申曾·曾平4甲·個■■冒PPPP■宁■4■b■個自自■鲁血自鲁d咖·■卩聊即p聊(64)2.7.l器件模型语句 MODEL〔65)2.7.2库函数调用语句UIB65)2..3子电路调用语句SHKT…………s…………*(66)28数字电路模拟■■■■冒P冒4bb■凸山……………………(6)8.1概述662.8.2数字电路器件………………678.3数宁信号游72)2.8,4数电路的 P=pice分析·督■■『■冒?冒■會4會■1■■■■‘‘■t76第3章 PSpice Windows版编程833.1概述(833.2绘制电路原理图■■冒冒冒■1冒冒■■■『■冒■■■曾■■■■■■■833.2.1打开 Schematics程序项3.22绘图窗计的址能建84)3.2.3绘图常用命令顶853.3电路分析司口■■■◆■●■血曲(92)3.3.1打开Fps耙序项鲁血■923.3.2 PSpic:e常用角令项…923.4杳看输出波形…………………………………(933.4.1打开Prb程序项(933.42Pmhe窗冂的功能键…(3343Prhe常用命令项■■■■■■P■血l自自■L自·_甲■唱司·■■……………(953.5建立元件库……9?3.5.L打开Pats程予项……;………3.52元件库窗口的功能键冒士14■+■b93.5.3Pars常用命仝项……甲甲郾·!···』■▲--rT……(99)3,6激励源编辑器……(1033.6.1打开激励源绢辑窗口,……s"…""………(1033.6.2激源编辑窗口的功能键(104)激动源编器常用命令项3.7设汁举例卜:4幽■山■■■▲甲曾番甲晋P晋量青↓dd画晶1103.7.谩计一个数字电路……(LlO3.7.2温度分析实例………■音鲁白中中P中甲甲P『TPP■個◆自冒t(1I537.3噪声分析实例…(1203.7.4傅甲叶分析实例…;;…7.5多数分析实例………………(124)3.7.6 Mante Carlo分析与性能分析…………………(127)37.7最荣悟况分析;q■■T■■■■(l3第4章Spce元件模型与模型参数…………………(1344. I Spice二极管模刑■冒■1■■中1344.1.Ⅰ大注人电流的-极管静态DC模型(]364.1.2极管信号模型…■■■■■■■I38极管的温度模型1384.2双极型晶体管模型和参数提取……(1394.2.上BT模型慨述∴……………………"…(l39)4.2.2lrs-M钏l模型…(14l)4.2.3 Gummel-Pon模型p:4日由·亠‘(1454.3MGS场效应管(MOET)模型参数和提取(150)4.3.1 MOSFET的Sice一级静态镆型(150)4.3.2 MOSFET_·级静态模型·(1524.3.3M0SFET_级静态模型·A.·.日.B4L日.BB昌吾4↓bh如昌4吾山聶如亠↓4亠(154)4.3.4 MOSFET Spice棋型的比较■1■‘』中中中中中中中山十啬4鲁山平『■+一(155)44结型场效应晶体管(JFFT)模型和参数提取………………………………(157)4.4]N沟道JFF静态模型…■血■函■幽血………(158)4.4.2JEY大信号模型(159)4.5砷化镓金属≯导体场效应晶体管( GaAs mesfet)模型1自中……(160)4.6数字器件模型(161)4.6.l逻辑门电路………………………………**……(1614.6.2融漫平卩■甲P甲↓甲罾↓晋甲■■!甲青罾晉甲■■『卜鲁昏■晋}■_■■d晋d矗啬(16446.3可编程逻辑器件(PLA……(167)4.6.4数字UO接口子电路……………………………;……"(]70)4.6.57400系列TT和CMOS模型库(173)4.66CM84000系列模型库(184)4.6.7数字器件型举例………r…………………(187)第5章Spce数学宏横型(192)5.1数学功能宏模型……………………………………………………(192)5.L.电压加法器太模型T平■■『冒■■■■■■■■昌…(192)5.1.2电压乘法器宏模型…■甲qF『冒PP■曾………s…s……s………:(193)5.1.3电生除状器宏模型(195)5L4电压平方室模型(196)5..5理想变压宏模型h■甲甲普平罾甲甲■p■■b▲pt(197)5.L.6电压求平主根宏模型………………(198)5..7三角波/弦波转换器(20)5..8电压柑移电路(202)5l.9电压积分器宏模型看号『冒晋■■血dq·号司鲁■■■唱自血◆血■■自■■■p甲聊要L4↓(204)s.上,10电压徽分宏模型…;(206)5.].1电压绝对连宏模型…■■■矗■bt(207)5.].12电压峰值深测器宏模型LL山L山(2105.1.13频率乘法………………∴…(2lt)s.1.14频率除法据……(213)5.1.15频率加法据减法器……(215)5.].16相泣探测器(217)5.1.17传输线宏嫫型…号P■甲↓【■冒h219)5.1.18施密特触发器宏模型……;………………………………………(220)5.1.19电压取样一保持电路宏模型4■郾司郾■4L晶………………………(223)5.].2咏冲宽变调制器宏模芈…………(2245.1.21电压填度调制器宏模型……(226)5.L.22电压对数放大器宏模型■■■(228)5.1,23N次根提取电路宏模型…(229)5.1.24拉氏变换宏模型…………………(232)5.2系统方程去模型…(232)52.]微分方程纤的积分型模拟法……………………………(232)5.2.2微分方程组的微分型模拟法………(236)5.23网络函数的Sice电路模型…(238)53非线性器件的Srie模型…………………,…………(246)5.3.1传感器件的Sice瞬念分析…:(246)5.3.2负值电慼和电容的Spie宏模型T?冒■T冒P250533运算放大器的Spe宏模型…………………(252第6章常用电路编程实刨…………………………………………………………(259)第7章 Spice的收斂问题(290)7.1什么是收敛问题鱼山d山血d血血dp血■■p甲1甲4·甲"qP+P290)7.2如何解决收敛问题……bdd■d…(290)7.2.]解次不收敛问题的思路……(290)7,2.2解决不收敛问题的可行力法…………(291)7.2-3解袂不收问题的条件参数和指令…(2927.3常见的错误信息…………甲甲司罪郾甲【即着L着4■■d·4画斗香山4·…(293)參考文献………………………(299)
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microTCA规范
PICMG microTCA.0 Specification RC1.0ContentsIntroduction and objectives1.1 Overview1.2 Introduction1.2.1S1.2.2 MicroTCa implementation options1画1-21.2.3 Design goals1-21.2.4 Elements of microtca1-312.5 Theory of operation……着1国面1面日正1-81.3 Micro TCA enclosure types191.3.1 Single Shelf implementation191.3.2 TWo Tier mⅸ ed Width Shelf implementation.…….….….….….….….…....1-101.3.3 Two-Tier fixed Single Width Shelf implementation ....................1-101.3.4 Back-to-Back Shelf implementation.1-101.3.5 Cube Shelf implementation..1-101.3.6 Pico Shelf implementations1111.3.7 Other implementation options1111.4 Application examples1-1114.1 Base station…1-111.42 Router1-121.4.3∨ olP node.….1-121.4.4 Other Telecom Network applicationsE画1-121.4.5 Enterprise applications1-131.4.6 Other applications.....1-131.4.7 Consumer applications1-131.5 Special word usage1-131.6 Conformance1-141.7 Dimensions1-141.8 Regulatory guidelines1-141.9 Reference specifications1.10 MicroTCA0 Specification contributor……1-151-161.11 Name and logo usage1-161.12 Intellectual property……1-171.12.1 Necessary claims1,,面,国国,,国面正∴1-181.12.2 Unnecessary claims11181.12. 3 Third party disclosures1-181.13 Glossary1-192Mechanical2-12.1 Mechanical overview∴………….2-12.1.1 Terminology…2-22.1.2 Typical arrangement examples2-22.2 Dimensions, tolerances, drawing symbols, and nomenclature2-62.3 Mechanical concept2-82.4 AdvancedMC Module orientation, location, and positioning2-1624.1 Module orientation.2-162.4.2 Module positioning, horizontal--mandatory2-172.4.3 Module positioning, vertical-mandatoryU.882-192. 4. 4 Module positioning, depth--mandatory,.42-21PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification2.5 Slot detail dimensions2-222.5.1S|ot..2-222.5.2 Slot configurations, subdividing Slots2-222.5.3 Card guide, Strut, and Card Guide Support Plate(CGSP)…………2232.5.4 Optional Subrack attachment plane2-322.5.5 AdvancedMC Module--optional locking………………………2-342.6 Backplane2-3627 Subrack dimensions2-412.7.1 Mandatory Subrack2-422.8 Shelf2-472.8. 1 Shelf types.2-482.8.2 Shelf width and height…...…2-492.8.3 Shelf depth2-492.8.4 Air filter provision2-502.8.5 ESD wrist strap interface2-502.8.6 Shelf alarm LEDs2-512.9 Cable management2-522. 10 Power entry /Power Module2-562.10.1 Power Module pcb dimensions2-582.10.2 Power Module component height1·面2-632.10.3 Power module face plate2-642.10. 4 Power Module handle/Latch mechanism.2672.10.5 Power module lEDs2-672. 10.6 Power Module EMc gasketing2-672.10.7 Power Module satety covers2-672.10 8 Power module labels2-682.10. 9 Power Module Backplane Connector2-682.11 MCH Module2-692.11.1 Module types2-692.11.2 MCH PCB dimensions.2-702.11.3 MCH Subrack slot details2-772.11. 4 Plug Connector.2-792.11.5 Sequencing and contact area2-812.11.6 MCH positioning2-812. 12 Air flow management面2-822.13 Auxiliary Connector(Zone 2 and zone 3)keying2-832.13.1 Component keep- in height2-842.13.2 Connector keep-in height2-842.133 Keying block…2-852.13.5 AMC0 electrically compatible keying block2.13. 4 Keying block with electrical connections2-86.2-872.14 MicroTCa cube2892.15 MicroTCA Pico2.16 Microtca filler pane的∵面1面面,面2-902-902.17 Cooling Units(CUs)2-912.18 Subrack/Shelf/Cube/Pico performance.2922. 18.1 Load carrying2-922.18.2 Insertion cycles2922.18.3ESD2-922.18.4EMC2-93PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification2. 18.5 Safety2-932.18.6 Physical Slot and Tier numbering2932.19 Subrack/Shelf environmental2-962.19. 1 Subrack shock and vibration2-962.19.2 Earthquake.........2-962.19.3 Flammability2-962.19.4 Atmospheric2-962. 19.5 Thermal2-972.19.6 Acoustic∴…………………2972.19.7 Surface temperatures2-972.20 References2-973 Hardware platform management3-13.1 Overview3.1.1 Micro Tca Carrier model3-13.1.3 Relationship with IPMI, AdvancedMC, and AdvancedTCA.3.1.2 MicroTCA management architecture3-23-73.1.4 Key differences from PICMG 3.0 and AMC.0 specifications..........3-73.1.5 PICMG properties and FRU Device ID assignments3-93.2 Management-related interconnects3-113.2.1 AdvancedMc interconnects3-113.2.2 Power Module and Cooling Unit interconnects3.2.3 Guidelines for OEM Module interconnects and management3-133-143.2.4 Carrier FRU Information device requirements.3-153.25 Microtca carrier interconnects3-193.3 Carrier Manager.…….…..…...…3-203.3.1 MCH Face Plate indicators3-223.3.2 Payload Interface3-223.3.3 Carrier Manager IP address3-223.3.4 IPM event support∴3-243.3.5 Redundant MCH operation3-253.3.6 Addressing3-263.3.7 Carrier number3-293.3.8 Location information34 Shelf Manager…3-383. 4.1 Shelf Manager configuration options383.4.2 Differences from the AdvancedTca shelf Manager3-403.4.3 Shelf-Carrier Manager Interface翻套国画1面,国面,1面D国画面国3-423.4.4 Shelf Manager IP addre3-433.5 MCMC requirements3453.6 EMMC requirements3-463.7 Operational state management3-483.7.1 Carrier Manager start up……….….….….………..……3483.7.2 Shelf Manager actions on Carrier detection3-483.7.3 Normal Shelf operation1B面面国B3-483.7.4 Abnormal situation handling3-4938 Power management.……3-493.8.1 Power clapping国面3-503.8.2 Micro T CA Carrier Power Management records.3-513.8.3 Early power management356PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification3.8.4 Normal power management.3-573.8.5 Power management commands and sensors3-593.8.6 Abnormal power condition handling3-673.9 Cooling management3-693.9.1 Fan geography.…3-703.9.2 Cooling control…3-713.9.3 Normal cooling operation3-723.9.4 Abnormal cooling operation3-733.9.5 Fan tachometer sensors3-733.9.6 Temperature sensors翻画1国翻B1B…3-733.10 Electronic Keying3-743.10.1 Micro TCA Carrier point-to-point connectivity information3-753.10.2 Module point-to-point connectivity information.3-773.10.3 AMC Port state commands3-783.10.4 Clock b- Keying……3-783.11 Telco alarm management3-73. 12 System Event log…………3-863.13 Sensor management3-863.13.1 Guidelines and requirements for fru sensor events3-863.13.2 MCMC SDR requirements.3-873.13.3 EMMC SDR requirements3-883.13.4 Carrier Manager SDR requirements3-883.14 fru Information.3-913. 14.1 EMMC FRU Information3-913. 14.2 MCMC FRU Information3-913.143 Carrier FRu Information3-923. 14.4 Shelf fru information面国面国面3-923.15 PMI message bridging……….3-933.15.1 Message bridging process3-933.16 PMI functions and command3-943. 16.1 Required IPMI functions..3-953.16.2 Command assignments3-973.17 FRU records, sensors and entity Ids∴3-1084 Power…4-14.1 Overview4-14.2 Loads on the Power Subsystem4-24.2.1 Microtca carrier hub(MCH),………,………………………24-24.2.2 Cooling Units4-74.2.3 Advanced mezzanine cards4-104.3 Power architecture4-134.3.1 Basic functionality4-134.3.2 Partitioning of the Power Subsystem:.::a:.4-154.3.3 Power sources4-154.3. 4 Power Subsystem redundancy4-164.3.5 System Grounding considerations4-214.3.6 Power distribution and backplane considerations4-234.4 Control and monitoring of the Power Subsystem4-2444.1 PM-EMMCs4-244.4.2 Geographic Address4-24PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification4.4.3|PMB-04-2444.4Ps1[S|o#4-254.4.5EN[Slof]#,…4-2544.6 PWRON_[Sot]…4-254.4.7PSPM#4-2644.8 PM-EMMC watchdog timer……4264.4.9 Power Module oK4-2744.10 Power module reset4-274.4.11 System power-up4-274.4.12 Input voltage sensors1国面面量面1国面4-294.4.13 Temperature sensors4-294414 Power module extraction switch4-304,415 Blue lED4-304.4.16LED14-314 4.17 Other leds4-314.5 Connectors4-314.5. 1 Power Module Output Connector4-324.5.2 Power Module Input Connectors81国面面4-324.6 Single-Width,Fu‖- Height Power Module…∴4-334.6.1 Inputs4-344.6.2 Outputs4-354.6.3 Bulk supply current limit4-384.6.4 Control and monitoring………………………4-384.6.5 Redundancy4-384.6.6 Mechanical4-4546.7 Thermals.8...8.88.84-45画·面4.6.8 Regulatory.4-4547 Other mechanical considerations…4-464.7.1 Double-Width form factor4-464.7.2 Form factors other than Full-Height4-464.8 Power source considerations.4-464.8.1 DC power feeds4-474.8.2 AC power feeds4-554.9 References4-605 Thermal5.1 Overview5-15.2 AMC. 0 Modules and microtCa国着画5-15.3 AMC.0 Carriers and microtca5.4 Subrack slot5-25.5 Airflow path5.6 AMC.0 Modules and power dissipation.5-35-35.7 MicroTCA system cooling configuration……….….….…....545. 8 Air distribution in a slot5-45.9 Air inlet and exhaust5-55. 10 Slot cooling capability5-55. 11 Module cooling requirements●5.12 Standard air.5-75.12.1 Derivatie5.122 Barometric changes due to weather....…...……….57PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification5.13 Slot impedance curve.5-85.14 Slot fan flow curve5.15 Cooling Unit failure5-85.16 Filters5.17 System sensors….…….….……5-95.18 Thermal and operating environment5-105.19 Thermal and cabling5-105.20 Simulation and impedance testing5-105.20.1 AdvancedMC/MCH reference Module..5-115.20.2 Power Unit reference module∴5-125.21 Simulation environment5.22 Thermal dynamic modeling5-135.23 Fluid networking modeling5.24 Acoustic noise5-135.25 Surface temperature5-145.26 Design recommendations5-155.27 Cooling limitations and examples..5-175.28 References1面5-226 Interconnect6-16.1 Introduction.…6-16.2 Fabric interface6.2.1 Backplane fabric interface support requirements6-26.2.2 MCH fabric interface support requirements6.3 MCH Specific Interfaces6-46.3.1 MCH update Channel interface6-46.3.2 MCH cross-over Channel interface.6-56. 3. 3 MCH PWR ON interface6-66.3.4 Inter-MCH IPMB-L interface6.4 Synchronization clock interface6.4.1 Signal descriptions6-86. 4.2 Clock architectures6-96.4.3 Non-Telecom and Telecom clocks6-136.5 JTAG interface.…6-136.5.1 JSM Overview6-146.5.2 JSM Signaling Overview6-166.5.3 JSM Interface to mch16.54 JSM Interface to mch2.……6-186.5.5 JSM Interface to Advancedmcs.6-196.5.6 JSM Interface to Power modules.6-226.5.7 JSM Master mode selection6-236.5.8 JSM Interface to External tester..6-246.5.9 MCH JTAG6-266.5. 10 Power module jtAG6-276.6 MicroTCA Interface topologies1画6-276.6. 1 Topology models6-286.6.2 Correlation to AdvancedMc fabric regions6-296.7 MCH Connector pin allocation6-306.7.1 Pin naming conventions6-316.7.2 Fabric interface naming conventions6-31PICMG MicroTCA. 0 Specification Draft RC1.o, May 26, 2006Do not specify or claim compliance with this Draft Specification6.7.3 Synchronization clock interface naming convention6-316.7.4 MCH Connector pin list……………6-326.8 System examples.6-386.8. 1 Redundant MicroTCA system6-386.8.2 Variant redundant microtca interconnect6-416.8.3 Non-redundant MicroTCA system6-45Connectors7-17.1 General information7-17.2 AdvancedMC Backplane Connectors7-17.2.1 AdvancedMC Backplane Connector pin list7-27.2.2 AdvancedMC Backplane Connector dimensions7-27.2.3 Advancedmc backplane connector pcb layout∴7-67. 2. 4 AdvancedMC Backplane Connector electrical characteristics7-107.2.5 AdvancedMC Backplane Connector high-speed characteristics7-147.2.6 AdvancedMC Backplane Connector mechanical characteristics7-187.3 Micro TCa Carrier hub connectors7-197.3.1 Micro TCA Carrier Hub Connector pin list7-197.3.2 Micro TCA Carrier Hub mating interface design7-207.3.3 Micro TCA Carrier Hub backplane connector7-227.3. 4 Micro TCA Carrier Hub Connector Backplane PCB layout7-237. 3.5 Micro tca Carrier Hub connector electrical characteristics7-247.3.6 Micro TCA Carrier Hub Connector high-speed characteristics7-2573.7 Micro tCa Carrier hub connector mechanical characteristics7-297.4 Power Module Output Connector7.4.1 Power Module Output Connector pin list and mating sequence7-317.4.2 Power Module Output Connector dimensions7-327. 4.3 Power Module Output Connector Backplane PCb layout7-347.4.4 Electrical characteristics for power Module output connector.7-367.4.5 Power Module Output Connector mechanical characteristics7-397.5 Power Module Input Connector7.5.1 Power Module Input Connector pin list and mating sequence7-417.5.2 Power Module Input Connector dimensions7-427.5.3 Electrical characteristics for Power Module Input Connector7-477.5.4 Power Module Input Connector mechanical characteristics7-517.6 AdvancedMC Auxiliary Connector7-537.7 Test schedule7-547.7.1 Specimen measurement arrangements7-547.7.2 Test schedule tables.7-647. 8 References.7-798 Regulatory requirements and industry standard guidelines8-18.1 Regulatory……8-18.1.1 Safety8-18.1.2 Electromagnetic compatibility..……………8-28.1.3 Ecology standards.8-28.2 Telecommunications industry standards requirements8-38. 2. 1 EMC/safety requirements for the telecommunications industry.......8-38.2.2 Environmental requirements for the telecommunications industry ..............8-48.3 Reliability/MTBF standards8-7PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification8.4 Cross reference list8.5 FRU test guidelines∴8-78.5. 1 FRU safety test8-88.5.2 FRU EMC testing.8-88.5.3 FRU environmental testing8-9a Module mis-insertion considerationsA-1A 1 MCH Module mis-insertion combinationsA-2A 2 AdvancedMc module mis-insertion combinationsA-5A3 Power management implicationsA-8A 4 System management implicationsA-8A.4.1 Optional MMC instance on MCH ModuleA-9A.4.2 Using an AdvancedMC in an MCH SlotA-13A.4.3 Using an mch in an AdvancedMc SlotA-15A.4.4 Detecting mis-insertionsA-16A.5 Hardware implicationsA-1A. 5. 1 GNd pins at same locations........A-20A.5.2 PSO# and PS1# pins at same locationsA-23A.5.3 PWR and MP pins at same locationsA27A.5. 4 PWR ON pinA-29A.5.5 Ga[2: 0] pins at same locations道1面4…A-31A.5.6 ENABLE# pin at same locationA-35A.5.7 SDA L and SCL L pinsA-37A 5.8 JTAG pinsA-38A 5.9 Cross-over pinsA-39A.5. 10 TMREQ#, 12C SDA, and I2C SCL pins…A-39B Requirement list….B-1PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification
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