microTCA规范
PICMG microTCA.0 Specification RC1.0ContentsIntroduction and objectives1.1 Overview1.2 Introduction1.2.1S1.2.2 MicroTCa implementation options1画1-21.2.3 Design goals1-21.2.4 Elements of microtca1-312.5 Theory of operation……着1国面1面日正1-81.3 Micro TCA enclosure types191.3.1 Single Shelf implementation191.3.2 TWo Tier mⅸ ed Width Shelf implementation.…….….….….….….….…....1-101.3.3 Two-Tier fixed Single Width Shelf implementation ....................1-101.3.4 Back-to-Back Shelf implementation.1-101.3.5 Cube Shelf implementation..1-101.3.6 Pico Shelf implementations1111.3.7 Other implementation options1111.4 Application examples1-1114.1 Base station…1-111.42 Router1-121.4.3∨ olP node.….1-121.4.4 Other Telecom Network applicationsE画1-121.4.5 Enterprise applications1-131.4.6 Other applications.....1-131.4.7 Consumer applications1-131.5 Special word usage1-131.6 Conformance1-141.7 Dimensions1-141.8 Regulatory guidelines1-141.9 Reference specifications1.10 MicroTCA0 Specification contributor……1-151-161.11 Name and logo usage1-161.12 Intellectual property……1-171.12.1 Necessary claims1,,面,国国,,国面正∴1-181.12.2 Unnecessary claims11181.12. 3 Third party disclosures1-181.13 Glossary1-192Mechanical2-12.1 Mechanical overview∴………….2-12.1.1 Terminology…2-22.1.2 Typical arrangement examples2-22.2 Dimensions, tolerances, drawing symbols, and nomenclature2-62.3 Mechanical concept2-82.4 AdvancedMC Module orientation, location, and positioning2-1624.1 Module orientation.2-162.4.2 Module positioning, horizontal--mandatory2-172.4.3 Module positioning, vertical-mandatoryU.882-192. 4. 4 Module positioning, depth--mandatory,.42-21PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification2.5 Slot detail dimensions2-222.5.1S|ot..2-222.5.2 Slot configurations, subdividing Slots2-222.5.3 Card guide, Strut, and Card Guide Support Plate(CGSP)…………2232.5.4 Optional Subrack attachment plane2-322.5.5 AdvancedMC Module--optional locking………………………2-342.6 Backplane2-3627 Subrack dimensions2-412.7.1 Mandatory Subrack2-422.8 Shelf2-472.8. 1 Shelf types.2-482.8.2 Shelf width and height…...…2-492.8.3 Shelf depth2-492.8.4 Air filter provision2-502.8.5 ESD wrist strap interface2-502.8.6 Shelf alarm LEDs2-512.9 Cable management2-522. 10 Power entry /Power Module2-562.10.1 Power Module pcb dimensions2-582.10.2 Power Module component height1·面2-632.10.3 Power module face plate2-642.10. 4 Power Module handle/Latch mechanism.2672.10.5 Power module lEDs2-672. 10.6 Power Module EMc gasketing2-672.10.7 Power Module satety covers2-672.10 8 Power module labels2-682.10. 9 Power Module Backplane Connector2-682.11 MCH Module2-692.11.1 Module types2-692.11.2 MCH PCB dimensions.2-702.11.3 MCH Subrack slot details2-772.11. 4 Plug Connector.2-792.11.5 Sequencing and contact area2-812.11.6 MCH positioning2-812. 12 Air flow management面2-822.13 Auxiliary Connector(Zone 2 and zone 3)keying2-832.13.1 Component keep- in height2-842.13.2 Connector keep-in height2-842.133 Keying block…2-852.13.5 AMC0 electrically compatible keying block2.13. 4 Keying block with electrical connections2-86.2-872.14 MicroTCa cube2892.15 MicroTCA Pico2.16 Microtca filler pane的∵面1面面,面2-902-902.17 Cooling Units(CUs)2-912.18 Subrack/Shelf/Cube/Pico performance.2922. 18.1 Load carrying2-922.18.2 Insertion cycles2922.18.3ESD2-922.18.4EMC2-93PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification2. 18.5 Safety2-932.18.6 Physical Slot and Tier numbering2932.19 Subrack/Shelf environmental2-962.19. 1 Subrack shock and vibration2-962.19.2 Earthquake.........2-962.19.3 Flammability2-962.19.4 Atmospheric2-962. 19.5 Thermal2-972.19.6 Acoustic∴…………………2972.19.7 Surface temperatures2-972.20 References2-973 Hardware platform management3-13.1 Overview3.1.1 Micro Tca Carrier model3-13.1.3 Relationship with IPMI, AdvancedMC, and AdvancedTCA.3.1.2 MicroTCA management architecture3-23-73.1.4 Key differences from PICMG 3.0 and AMC.0 specifications..........3-73.1.5 PICMG properties and FRU Device ID assignments3-93.2 Management-related interconnects3-113.2.1 AdvancedMc interconnects3-113.2.2 Power Module and Cooling Unit interconnects3.2.3 Guidelines for OEM Module interconnects and management3-133-143.2.4 Carrier FRU Information device requirements.3-153.25 Microtca carrier interconnects3-193.3 Carrier Manager.…….…..…...…3-203.3.1 MCH Face Plate indicators3-223.3.2 Payload Interface3-223.3.3 Carrier Manager IP address3-223.3.4 IPM event support∴3-243.3.5 Redundant MCH operation3-253.3.6 Addressing3-263.3.7 Carrier number3-293.3.8 Location information34 Shelf Manager…3-383. 4.1 Shelf Manager configuration options383.4.2 Differences from the AdvancedTca shelf Manager3-403.4.3 Shelf-Carrier Manager Interface翻套国画1面,国面,1面D国画面国3-423.4.4 Shelf Manager IP addre3-433.5 MCMC requirements3453.6 EMMC requirements3-463.7 Operational state management3-483.7.1 Carrier Manager start up……….….….….………..……3483.7.2 Shelf Manager actions on Carrier detection3-483.7.3 Normal Shelf operation1B面面国B3-483.7.4 Abnormal situation handling3-4938 Power management.……3-493.8.1 Power clapping国面3-503.8.2 Micro T CA Carrier Power Management records.3-513.8.3 Early power management356PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification3.8.4 Normal power management.3-573.8.5 Power management commands and sensors3-593.8.6 Abnormal power condition handling3-673.9 Cooling management3-693.9.1 Fan geography.…3-703.9.2 Cooling control…3-713.9.3 Normal cooling operation3-723.9.4 Abnormal cooling operation3-733.9.5 Fan tachometer sensors3-733.9.6 Temperature sensors翻画1国翻B1B…3-733.10 Electronic Keying3-743.10.1 Micro TCA Carrier point-to-point connectivity information3-753.10.2 Module point-to-point connectivity information.3-773.10.3 AMC Port state commands3-783.10.4 Clock b- Keying……3-783.11 Telco alarm management3-73. 12 System Event log…………3-863.13 Sensor management3-863.13.1 Guidelines and requirements for fru sensor events3-863.13.2 MCMC SDR requirements.3-873.13.3 EMMC SDR requirements3-883.13.4 Carrier Manager SDR requirements3-883.14 fru Information.3-913. 14.1 EMMC FRU Information3-913. 14.2 MCMC FRU Information3-913.143 Carrier FRu Information3-923. 14.4 Shelf fru information面国面国面3-923.15 PMI message bridging……….3-933.15.1 Message bridging process3-933.16 PMI functions and command3-943. 16.1 Required IPMI functions..3-953.16.2 Command assignments3-973.17 FRU records, sensors and entity Ids∴3-1084 Power…4-14.1 Overview4-14.2 Loads on the Power Subsystem4-24.2.1 Microtca carrier hub(MCH),………,………………………24-24.2.2 Cooling Units4-74.2.3 Advanced mezzanine cards4-104.3 Power architecture4-134.3.1 Basic functionality4-134.3.2 Partitioning of the Power Subsystem:.::a:.4-154.3.3 Power sources4-154.3. 4 Power Subsystem redundancy4-164.3.5 System Grounding considerations4-214.3.6 Power distribution and backplane considerations4-234.4 Control and monitoring of the Power Subsystem4-2444.1 PM-EMMCs4-244.4.2 Geographic Address4-24PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification4.4.3|PMB-04-2444.4Ps1[S|o#4-254.4.5EN[Slof]#,…4-2544.6 PWRON_[Sot]…4-254.4.7PSPM#4-2644.8 PM-EMMC watchdog timer……4264.4.9 Power Module oK4-2744.10 Power module reset4-274.4.11 System power-up4-274.4.12 Input voltage sensors1国面面量面1国面4-294.4.13 Temperature sensors4-294414 Power module extraction switch4-304,415 Blue lED4-304.4.16LED14-314 4.17 Other leds4-314.5 Connectors4-314.5. 1 Power Module Output Connector4-324.5.2 Power Module Input Connectors81国面面4-324.6 Single-Width,Fu‖- Height Power Module…∴4-334.6.1 Inputs4-344.6.2 Outputs4-354.6.3 Bulk supply current limit4-384.6.4 Control and monitoring………………………4-384.6.5 Redundancy4-384.6.6 Mechanical4-4546.7 Thermals.8...8.88.84-45画·面4.6.8 Regulatory.4-4547 Other mechanical considerations…4-464.7.1 Double-Width form factor4-464.7.2 Form factors other than Full-Height4-464.8 Power source considerations.4-464.8.1 DC power feeds4-474.8.2 AC power feeds4-554.9 References4-605 Thermal5.1 Overview5-15.2 AMC. 0 Modules and microtCa国着画5-15.3 AMC.0 Carriers and microtca5.4 Subrack slot5-25.5 Airflow path5.6 AMC.0 Modules and power dissipation.5-35-35.7 MicroTCA system cooling configuration……….….….…....545. 8 Air distribution in a slot5-45.9 Air inlet and exhaust5-55. 10 Slot cooling capability5-55. 11 Module cooling requirements●5.12 Standard air.5-75.12.1 Derivatie5.122 Barometric changes due to weather....…...……….57PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification5.13 Slot impedance curve.5-85.14 Slot fan flow curve5.15 Cooling Unit failure5-85.16 Filters5.17 System sensors….…….….……5-95.18 Thermal and operating environment5-105.19 Thermal and cabling5-105.20 Simulation and impedance testing5-105.20.1 AdvancedMC/MCH reference Module..5-115.20.2 Power Unit reference module∴5-125.21 Simulation environment5.22 Thermal dynamic modeling5-135.23 Fluid networking modeling5.24 Acoustic noise5-135.25 Surface temperature5-145.26 Design recommendations5-155.27 Cooling limitations and examples..5-175.28 References1面5-226 Interconnect6-16.1 Introduction.…6-16.2 Fabric interface6.2.1 Backplane fabric interface support requirements6-26.2.2 MCH fabric interface support requirements6.3 MCH Specific Interfaces6-46.3.1 MCH update Channel interface6-46.3.2 MCH cross-over Channel interface.6-56. 3. 3 MCH PWR ON interface6-66.3.4 Inter-MCH IPMB-L interface6.4 Synchronization clock interface6.4.1 Signal descriptions6-86. 4.2 Clock architectures6-96.4.3 Non-Telecom and Telecom clocks6-136.5 JTAG interface.…6-136.5.1 JSM Overview6-146.5.2 JSM Signaling Overview6-166.5.3 JSM Interface to mch16.54 JSM Interface to mch2.……6-186.5.5 JSM Interface to Advancedmcs.6-196.5.6 JSM Interface to Power modules.6-226.5.7 JSM Master mode selection6-236.5.8 JSM Interface to External tester..6-246.5.9 MCH JTAG6-266.5. 10 Power module jtAG6-276.6 MicroTCA Interface topologies1画6-276.6. 1 Topology models6-286.6.2 Correlation to AdvancedMc fabric regions6-296.7 MCH Connector pin allocation6-306.7.1 Pin naming conventions6-316.7.2 Fabric interface naming conventions6-31PICMG MicroTCA. 0 Specification Draft RC1.o, May 26, 2006Do not specify or claim compliance with this Draft Specification6.7.3 Synchronization clock interface naming convention6-316.7.4 MCH Connector pin list……………6-326.8 System examples.6-386.8. 1 Redundant MicroTCA system6-386.8.2 Variant redundant microtca interconnect6-416.8.3 Non-redundant MicroTCA system6-45Connectors7-17.1 General information7-17.2 AdvancedMC Backplane Connectors7-17.2.1 AdvancedMC Backplane Connector pin list7-27.2.2 AdvancedMC Backplane Connector dimensions7-27.2.3 Advancedmc backplane connector pcb layout∴7-67. 2. 4 AdvancedMC Backplane Connector electrical characteristics7-107.2.5 AdvancedMC Backplane Connector high-speed characteristics7-147.2.6 AdvancedMC Backplane Connector mechanical characteristics7-187.3 Micro TCa Carrier hub connectors7-197.3.1 Micro TCA Carrier Hub Connector pin list7-197.3.2 Micro TCA Carrier Hub mating interface design7-207.3.3 Micro TCA Carrier Hub backplane connector7-227.3. 4 Micro TCA Carrier Hub Connector Backplane PCB layout7-237. 3.5 Micro tca Carrier Hub connector electrical characteristics7-247.3.6 Micro TCA Carrier Hub Connector high-speed characteristics7-2573.7 Micro tCa Carrier hub connector mechanical characteristics7-297.4 Power Module Output Connector7.4.1 Power Module Output Connector pin list and mating sequence7-317.4.2 Power Module Output Connector dimensions7-327. 4.3 Power Module Output Connector Backplane PCb layout7-347.4.4 Electrical characteristics for power Module output connector.7-367.4.5 Power Module Output Connector mechanical characteristics7-397.5 Power Module Input Connector7.5.1 Power Module Input Connector pin list and mating sequence7-417.5.2 Power Module Input Connector dimensions7-427.5.3 Electrical characteristics for Power Module Input Connector7-477.5.4 Power Module Input Connector mechanical characteristics7-517.6 AdvancedMC Auxiliary Connector7-537.7 Test schedule7-547.7.1 Specimen measurement arrangements7-547.7.2 Test schedule tables.7-647. 8 References.7-798 Regulatory requirements and industry standard guidelines8-18.1 Regulatory……8-18.1.1 Safety8-18.1.2 Electromagnetic compatibility..……………8-28.1.3 Ecology standards.8-28.2 Telecommunications industry standards requirements8-38. 2. 1 EMC/safety requirements for the telecommunications industry.......8-38.2.2 Environmental requirements for the telecommunications industry ..............8-48.3 Reliability/MTBF standards8-7PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification8.4 Cross reference list8.5 FRU test guidelines∴8-78.5. 1 FRU safety test8-88.5.2 FRU EMC testing.8-88.5.3 FRU environmental testing8-9a Module mis-insertion considerationsA-1A 1 MCH Module mis-insertion combinationsA-2A 2 AdvancedMc module mis-insertion combinationsA-5A3 Power management implicationsA-8A 4 System management implicationsA-8A.4.1 Optional MMC instance on MCH ModuleA-9A.4.2 Using an AdvancedMC in an MCH SlotA-13A.4.3 Using an mch in an AdvancedMc SlotA-15A.4.4 Detecting mis-insertionsA-16A.5 Hardware implicationsA-1A. 5. 1 GNd pins at same locations........A-20A.5.2 PSO# and PS1# pins at same locationsA-23A.5.3 PWR and MP pins at same locationsA27A.5. 4 PWR ON pinA-29A.5.5 Ga[2: 0] pins at same locations道1面4…A-31A.5.6 ENABLE# pin at same locationA-35A.5.7 SDA L and SCL L pinsA-37A 5.8 JTAG pinsA-38A 5.9 Cross-over pinsA-39A.5. 10 TMREQ#, 12C SDA, and I2C SCL pins…A-39B Requirement list….B-1PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification
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电子噪声与低噪声设计
本书致力于利用随机噪声理论分析和解释电子系统中噪声的产生和传播问题，介绍各种噪声源相关的机制和模型，说明不同噪声的特性和传播方式，以及线性电路中的噪声分析方法和噪声特性测量方法，并详细介。。。内容简介电子噪声包括内部固有噪声和外部干扰噪声。电子噪声是影响检测系统性能的主要因素之一。在通信系统中,噪声可能导致信息传输错误本书致力于利用随机噪声理论分析和解释电子系统中噪声的产生和传播冋题,介绍各种噪声源相关的机制和模型,说明不同噪声的特性和传播方式,以及线性电路中的噪声分析方法和噪声特性测量方法,并详细介绍各种不同噪声的抑制方法,给出大量实例,总结出低噪声设计的规则和要点。木书可用作电子工程、自动化、测试技术与仪器等专业的本科生或研究生教材,也可供涉及电子噪声和电磁兼容性的工程技术人员参考。本书封面贴有清华大学出版社防伪标签,无标签者不得销售版权所有,侵权必究。侵权举报电话:010-6278298913701121933图书在版编目(CIP)数据电子噪声与低噪声设计/高晋占编著.一北京:清华大学出版社,2016ISBN978-7302-43559-4I.①电…Ⅱ.①高…Ⅲ.①电子系统一噪声②电子系统一低噪声一设计ⅣN.①TN911.4②TN722.3中国版本图书馆CIP数据核字(2016)第081960号责任编辑:王一玲封面设计:常雪影责任校对:梁毅责任印制:沈露出版发行:清华大学出版社pogtlt:http://www.tup.com.cn,http://www.wqbook.com地址:北京清华大学学研大厦A座邮编:100084社总机:010-62770175邮购:010-62786544投稿与读者服务:010-62776969,c-service(@tup.tsinghua.edu.cn质量反馈:010-62772015, zhiliang tup. tsinghua.edu.cn印装者:清华大学印刷厂经销:全国新华书店开本:185mm×260mm印张:21字数:522千字版次:2016年6月第1版印次:2016年6月第1次印刷印数:1~1500定价:59.00元产品编号:06269401在电子电路和系统中,噪声是个重要问题。噪声污染有用信号,并使信号包含的信息增加了不确定性。电子噪声是影响检测系统性能的主要因素之一。在通信系统中,噪声可能导致信息传输错误。即使在噪声阈值较高的数字电路和计算机系统中,严重的噪声可能造成存储位的变化和程序运行混乱噪声包括内部固有噪声和外部干扰噪声。内部固有噪声是由载流子的随机运动引起的,有些固有噪声源可以通过在制造过程中提高加工质量加以控制,但其中大多数是基础噪声,不取决于技术。而外部干扰噪声是由外部噪声源发岀,经过某种耦合渠道对电路污染的结果。这两种噪声具有不同原因,它们需要不同的处理方法,在多数书籍和文献中,这两种噪声都是分别对待的,外部干扰噪声通常是电磁兼容性(EMC)相关书籍的主题。但是,这两种噪声引起的问题是类似的,应该综合在一起考虑。在处理其中的一种噪声时,有理由必须把另一种噪声也考虑在内。例如,当处理弱信号的电路无法正常工作时,污染了有用信号的噪声是源自于该电路本身还是从外部拾取的,从用户的角度来看都是无关紧要的。在这两种情况下噪声都会掩盖信号,在最坏的情况下则不能恢复信息内容。因此,只努力抑制电路的固有噪声,但缺乏抵御干扰噪声的保护手段,电路的噪声特性就会大打折扣。另外,在设计屏蔽措施时,努力把干扰噪声降低到固有噪声幅度之下,往往没有多大意义。本书涵盖上述两种噪声,致力于分析和解释电子系统中各种噪声的来源和性质,介绍各种噪声源的机制和模型,说明不同噪声的特性和耦合方式,以及线性电路中的噪声分析方法和噪声特性测量方法,介绍各种噪声的抑制措施,给出低噪声设计的规则和方法。许多种噪声具有随机性,其描述方式和分析方法不同于确定性信号,不太容易理解,本书第1章首先介绍随机噪声的基本原理和特性,这是后续各章及延续阅读的理论基础。第2~5章致力于固有噪声,这种噪声取决于电子器件和电路设计。第2章介绍各种固有噪声源的特性和描述方法;第3章介绍各种噪声参数和噪声分析方法;第4章介绍电子系统中常见的电子器件的噪声源、噪声模型和噪声特性;第5章介绍常用的噪声性能测量方法。前言第6~8章致力于外部干扰噪声,这种噪声受设备的物理结构和电路布局的影响很大。第6章介绍各种干扰噪声源和干扰耦合途径,除电磁噪声外,还特别介绍机械原因或温度扰动引起的噪声;第7章介绍干扰噪声抑制方法,重点是屏蔽和接地;第8章介绍常见干扰噪声源的噪声产生机制和预防措施。第9章介绍低噪声电路设计的方法和技术,包括选择低噪声有源器件,确定电路组态和工作点,噪声匹配的实现等,特别分析了反馈对噪声性能的影响。本书可用作电子、通信、自动化、测试技术与仪器等专业的高年级本科生或研究生教材,也可供涉及电子噪声和电磁兼容性的工程技术人员参考。由于作者水平所限,书中难免存在缺点和错误,恳请广大读者批评指正高晋占2015年10月于清华园符号說明1.基本符号X电抗的通用符号,单位为Ω频率通用符号,单位为Hz导纳的通用符号,单位为Sfo中心频率,单位为Hz阻抗的通用符号,单位为Ω截止频率,单位为Hz角频率通用符号,单位为rad/s电流通用符号,单位为A2.线性系统符号距离或长度,单位为mA(t)幅度函数电压通用符号,单位为V)相位函数器件内部的等效电阻,单位为9G(a)幅频特性函数B系统频带宽度,单位为Hz相频特性函数B电纳的通用符号,单位为Sh(t)冲激响应函数C电容的通用符号,单位为FH(j)频率响应函数E数学期望运算子H()传递函数电导的通用符号,单位为SH(x1)离散传递函数电流的有效值,单位为A3.随机噪声符号平均直流电流,单位为A噪声电压L电感的通用符号,单位为H噪声电流互感的通用符号,单位为H噪声电压的均方值P功率的通用符号,单位为W噪声电流的均方值R电阻或等效电阻,单位为ΩE电路的输入电阻,单位为Ω噪声电压的有效值,En=√eR电路的输出电阻,单位为噪声电流的有效值,n=√R负载电阻,单位为Ω噪声电压的平方根谱密度,单位R信号源内阻,单位为Ω为V/√Hz电压的有效值,单位为V噪声电流的平方根谱密度,单位热力学温度(旧称绝对温度),单为A/√Hz位为K热噪声电压符号说明热噪声电流共射接法下集射极之间的微变电散弹噪声电压阻散弹噪声电流场效应管漏源之间的等效电阻1/f噪声电压导通电阻1/f噪声电流二极管,场效应管的漏极F噪声系数( noise factor)场效应管的栅极噪声因数( noise figure),单位为dBS场效应管的源极S信噪比二极管电流,漏极电流B等效噪声带宽共射接法下的基极电流△f窄带宽度共射接法下的集电极电流p(x)x的概率密度函数共射接法下的发射极电流x的均值共基接法下的电流放大倍数,a=x的方差△Ic/△Ix的标准差共射接法下的电流放大倍数,B=x的均方值△Ic/△IBC2(x)x的自协方差函数共射接法下的直流电流放大倍Cx(x)x的归一化自协方差函数数,B=Ic/IBCx(z)x和y的互协方差函数5.其他符号Cx(x)x和y的归一化互协方差函数电磁辐射速度,c=2.998×10m/sR2(r)x的自相关函数h普朗克( Planck)常数,h=6.62R2(x)x和y的互相关函数1034JsS(f)噪声的功率谱密度函数k玻耳兹曼( Boltzmann)常数,k=S2(f)噪声电压的功率谱密度函数1.38×1023J/K(f)噪声电流的功率谱密度函数电子电荷,q=1.602×10-°C2(f)x的功率谱密度函数波长,mS2(f)x和y的互功率谱密度函数介质的介电常数p(x)x的归一化自相关函数自由空间的介电常数,Eo=8.85×(x)x和y的归一化互相关函数10 pF/mmJ|雅可比( Jacobi)行列式对自由空间的相对介电常数,En=4.半导体器件参数符号基极介质的磁导率C集电极自由空间的磁导率,A0=4x发射极10Hm1=4x×10pH/mmfr晶体管的特征频率,即共射接法对自由空间的相对磁导率,=下电流放大倍数为1的频率,单/0位为Hz介质的电导g跨导铜的电导,=5.82×107S/m基区体电阻对铜的相对电导,01=a/0rb’e发射结的微变等效电阻CMRR共模抑制比第1章随机噪声基础1.1随机噪声概述…………1.1.1噪声定义与分类1111.1.2内部固有噪声和外部干扰噪声比较1.1.3噪声的影响1.2随机噪声的概率分析方法…3471.3随机噪声的统计特征…1.3.1均值、方差与均方值········,····,·,,··,,,,,,······,·······,·,,1.3.2相关函数与协方差函数…1.3.3功率谱密度函数151.4常见随机噪声171.4.1白噪声与有色噪声171.4.2窄带噪声………………………………………………………191.5随机噪声通过电路系统的响应…211.5.1随机噪声通过线性系统的响应……………………………211.5.2随机噪声通过非线性系统的响应24第2章电子系统中的固有噪声源……………………………………………………292.1热噪声302.1.1热噪声的起源…302.1.2热噪声的特性……………………302.2扩散噪声……………………………………352.3散弹噪声362.4量子噪声………………………………………………………………………………39Ⅵ目录2.5产生-复合噪声(G-R噪声)…………………………………………………………402.61/f噪声…422.7爆裂噪声……………………………………………………………………452.8雪崩噪声…第3章噪声参数与噪声分析503.1.功率和增益3.1.1功率的各种常用定义513.1.2资用功率和资用功率增益…3.1.3可交换功率和可交换功率增益553.2等效噪声带宽…563.3线性一端口的噪声参数……603.3.1等效噪声电阻…………………………………613.3.2等效噪声温度623.3.3其他噪声参数……633.4线性二端口的噪声模型与噪声参数653.4.1E-Ⅰ噪声模型及等效输入噪声电阻…………………3.4.2等效输入噪声温度………693.4.3工作噪声温度……………723.4.4噪声系数……733.4.5噪声测度………………………………………………………………813.5二端口噪声分析………833.5.1二端口的噪声模型变换…………………………………………………833.5.2等效噪声源相关时二端口的噪声分析…………84第4章电子器件噪声884.1电阻噪声………884.1.1电阻的噪声机制与噪声指标…………………………894.1.2低噪声电阻的选择4.2电容、电感和电池噪声934.3半导体二极管的噪声特性…………………………………………………………954.4双极型晶体管(BJT)的噪声特性……994.4.1BJT的结构、等效电路和噪声源………………………………………994.4.2BJT的噪声参数1024.4.3BJT噪声的频率分布……………………………………………………1044.5场效应管(FET)的噪声特性1075.1FET的结构与噪声源…………1074.5.2FET的噪声等效电路与噪声参数1104.6运算放大器的噪声特性………………………………………………………113目录4.6.1运算放大器的等效输入噪声模型………………………………1134.6.2运算放大器噪声性能计算1164.7传感器电路噪声分析………………………………………………………122第5章噪声性能测量1335.1噪声测量常用方法……1335.2噪声测量中的检波器和平均器………………………………………………………1365.3噪声功率和有效值的测量误差1404噪声功率谱密度测量………………………………………………………1425.5二端口等效输人噪声测量1465.6噪声系数测量…………………………………………………………………1475.7噪声温度测量……1545.8其他噪声性能的测量和计算………………………………………………1575.9噪声发生器160第6章干扰噪声1666.1外部噪声源………………………………………1676.1.1自然噪声源…1686.1.2电磁噪声源1706.1.3静电噪声源…1736.1.4非电起源的干扰噪声源………………………………………………1746.1.5干扰噪声的频谱分布1766.2干扰噪声耦合途径……………………………………………………………1776.2.1传导耦合…1796.2.2电场耦合………………………………………………………1836.2.3磁场耦合………1866.2.4电磁辐射耦合………1916.2.5耦合模式……………………………193第7章干扰噪声抑制方法…1967.1电磁屏蔽………………………………………………………………………1967.1.1场传播与波阻抗1977.1.2屏蔽层的吸收损耗……………………………………………………2007.1.3屏蔽层的反射损耗2027.1.4屏蔽层中的多次反射…………………………………………2067.1.5屏蔽效能分析与综合2087.1.6影响屏蔽效能的其他因素…………………………………2117.1.7屏蔽总结2147.2电缆屏蔽层接地216
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