索尼 imx274 datesheet
imx274 datesheet，可以对接Hi3519V101，4K，分享一下SONYIMX274LQC-CAbsolute Maximum RatingsItemSymbolRatingsUnitSupply voltage(Analog)1ADD0.3to+3.3VSupply voltage(Digital 1)-0.5to+2.0Supply voltage(Digital 2)DDD20.5to+3.3VInput voltage(Digital)0.3toV。Dp+0.3VOutput voltage(Digital)-0.3toVD2+0.3Guaranteed operating temperature TOPR-30to+75°CStorage guarantee temperatureTSTG30to+80CPerformance guarantee temperature TsPEC10to+60Recommended Operating ConditionsItemSymbolRatingSupply voltage(Analog)VADD2.8±0.1Supply voltage(Digital 1)1.2±0.1VSupply voltage(Digital 2)1.8±0.1Input voltage(Digital)-0.1 to Vopp2+0.11 VADD: VDDSUB, VoDHCM, VoDHPX, VDDHDA, VDDHCP (2.8V power supplyVDDD1: VDDLCN, VDDLSC1 to 2, VDDLPA, VDDLPL1, VoDLPL2 to 3. VDDLIF (1.2V power supply)VDDD2: VDDMIO, VDDMIF (1.8V power supply)SONYIMX274LQC-CUSE RESTRICTION NOTICEThis USE RESTRIC TION NOTICE (Notice )is for customers who are considering or currently using theimage sensor products("Products")set forth in this specifications book. Sony Corporation Sony")mayat any time, modify this Notice which will be available to you in the latest specifications book for theProducts. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has itsown use restriction notice on the Products, such a use restriction notice will additionally apply betweerou and the subsidiary or distributor. You should consult a sales representative of the subsidiary ordistributor of sony on such a use restriction notice when you consider using the ProductsUse restrictionsThe Products are intended for incorporation into such general electronic equipment as office productscommunication products, measurement products, and home electronics products in accordance withthe terms and conditions set forth in this specifications book and otherwise notified by sony from timeYou should not use the Products for critical applications which may pose a life-or injury-threateningrisk or are highly likely to cause significant property damage in the event of failure of the products. Youshould consult your sales representative beforehand when you consider using the products for suchcritical applications. In addition, you should not use the products in weapon or military equipmentSony disclaims and does not assume any liability and damages arising out of misuse improper usemodification, use of the Products for the above-mentioned critical applications, weapon and militaryequipment, or any deviation from the requirements set forth in this specifications booklesign for SafetySony is making continuous efforts to further improve the quality and reliability of the products howeverfailure of a certain percentage of the products is inevitable. Therefore, you should take sufficient careto ensure the sate design of your products such as component redundancy, anti-contlagration featuresand features to prevent mIs-operation in order to avoid accidents resulting in injury or death fire orother social damage as a result of such failureExport ControlIf the Products are controlled items under the export control laws or regulations of various countriesapproval may be required for the export of the products under the said laws or regulationsYou should be responsible for compliance with the said laws or regulationsNo License Impliedo The technical information shown in this specifications book is for your reference purposes only. theavailability of this specifications book shall not be construed as giving any indication that sony and itscensors will license any intellectual property rights in such information by any implication or otherwiseSony will not assume responsibility for any problems in connection with your use of such information orfor any infringement of third-party rights due to the same. It is therefore your sole legal and financialresponsibility to resolve any such problems and infringementGoverning lawThis notice shall be governed by and construed in accordance with the laws of Japan, without referenceto principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relatingto this Notice shall be submitted to the exclusive jurisdiction of the Tokyo district Court in Japan as thecourt of first instanceOther Applicable Terms and ConditionsThe terms and conditions in the Sony additional specifications, which will be made available to you whenyou order the Products, shall also be applicable to your use of the Products as well as to thisspecifications book. You should review those terms and conditions when you consider purchasingand/or using the ProductsGeneral-0.0. 8SONYIMX274LQC-CContentsDescription---FeaturesDevice structureOptical Black Array and Readout Scan Direction---Absolute Maximum Ratings2233Recommended Operating Conditions---------------USE RESTRICTION NOTICEContentsOptical CePin Configuration------------------Pin description-------------------------458899hen using csl-2When using Sub-LVDS1210 Equivalent Circuit Diagram15Peripheral Circuit19System OutlineWhen using CSl-2When using Sub-LVDSElectrical Characteristics when using cs1-2--------------------------m---------------------------------21. DC Characteristics(CS1-2)a.8..4Current Consumption and Gain Variable Range(CSl-2Supply Voltage and l/O Voltage(CS1-2)2. AC Characteristics(CS1-222INCK, XCLR(CSl-2)22XHS, XVS(Output)(CSI-2)22IC Communication (CSI-2)23DMCKP/DMCKN, DMO(CSl-2Electrical Characteristics When Using Sub-LVDs-------------------m--------------------------1. DC Characteristics(Sub-LVDs)……Current Consumption and gain Variable Range sub-LVDS24Supply Voltage and l/o Voltage(Sub-LVDSLVDS Output DC Characteristics(Sub-LVDS2. AC Characteristics ( Sub-LVDS).........25INCK, XCLR, XVS(input), XHS (input)(Sub-LVDS25Serial Communication(Sub-LVDS)Sub-LVDS Output(Sub-LVDS)26Spectral Sensitivity Characteristics(CS1-2 and Sub-LVDS27Image Sensor Characteristics(CSl-2 and Sub-LVDS)-281. Zone Definition of Image Sensor Characteristics28mage Sensor Characteristics Measurement Method(CSl-2 and Sub-LVDS)1. Measurement conditions2. Color Coding of this Image Sensor and Readout..293. Definition of Standard Imaging Conditions29Setting Registers Using I"C Communication(When Using CSl-2Description of Setting Registers When Using I C communication31Pin Connection of Serial Communication Operation Specifications When Using I"C CommunicationRegister Communication Timing When Using I-C Communication12C Communication Protocol32Register Write and Read33Single Read from Random Location33Single read from current location; iidaiaii:;aaaa“Sequential Read Starting from Random LocationSequential Read Starting from Current Location34Single Write to Random Location35Sequential Write Starting from Random Location35Register Value Reflection Timing to Output Data(CSl-2)36SONYIMX274LQC-CSetting Registers Using Serial Communication (When Using Sub-LVDS)----------------37Setting Registers Using Serial Communication(Sub-LVDS).37Register Value Reflection Timing to Output Data( Sub-LVDS38Register Map…391. Description of Register2. Register Setting for Each Readout Drive Modeeadout Drive Modes( csl-2 and Sub-LVDS)---------------------551. Readout drive modes552. Relationship between Arithmetic Processing and the Number of Output bits in Each Readout Drive ModeImage Data Output Format When Using CSI-2--------------------------58Frame Format (CSI-2)58Frame Structure(CSl-258Embedded Data Line(CSl-2)59CSl-2 serial Output Setting(CSl-2)MIPI Transmitter(CSl-2)62Detailed Specification of Each Mode(CSl-2)---------------631. Horizontal/ Vertical Operation Period in Each Readout Drive Mode(CSl-22. Frame Rate Adjustment(CSl-23. Image Data Output Format CSl-265Vertical Arbitrary Cropping Function(CSl-2)-69Horizontal Arbitrary Cropping Function(CSl-272Electronic Shutter Timing When Using CSI-2------741. SHR, SVR, SMD Setting When Using CSl-2741-1. SHR, SVR Setting(CSl-2)741-2. Electronic Shutter Drive Mode(Csl-2)752. Integration Time in Each Readout Drive Mode and Mode Changes When Using CSl-2762-1. Integration Time in Each Readout Drive Mode(CSl-2762-2. Operation when Changing the Readout Drive Mode(CSl-2772-3. Low Power Consumption Drive in Integration Time When Using Roll ing Shutter Operation(CSl-2)78Image Data Output Format When Using Sub-LVDS--791. Sync Signals and Data Output Timing(Sub-LVDS)““792. Output Range of LVDS Output Data(Sub-LVDS)Detailed Specification of Each Mode(Sub-LVDS)删mHorizontal/Vertical Operation Period in Each Readout Drive Mode(sub-LVDs)..........2. Frame Rate Adjus咖ment(Sub-LVDS)……3. Image Data Output Format ( Sub-LVDS)Vertical Arbitrary Cropping(Sub-LVDS)Horizontal arbitrary cropping function(Sub-LVDS)----m94Electronic Shutter Timing When Using Sub-LVDS961. SHR, SVR Setting(Sub-LVDS)...962. SVR Operation (Sub-LVDS3. Electronic Shutter Drive Mode( Sub-LVDS)974. Integration Time in Each Readout Drive Mode and mode changes When Using Sub-LVDS984-1. Integration Time in Each Readout Drive Mode(Sub-LVDS984-2. Operation when Changing the Readout Drive Mode(Sub-LVDS994-3. Recommended Global Reset Shutter Operation Sequence(Sub-LVDS)1004-4. Interruptive Mode Change(Sub-LVDS4-5. Low Power Consumption Drive in Exposure Time (Sub-LVDS)…102Power-on/off Sequence when using CSI-2---1031. Power-on Sequence(CS2)……1032. Slew Rate Limitation of Power-on Sequence( CSI-21033. Power-off Sequence(CSl-2104Standby cancel sequence when using csl-2--------------------------105Power-on/off Sequence when using Sub-LVDS1161. Power-on Sequence(Sub-LVDS)1062. Slew Rate Limitation of Power-on Sequence(Sub-LVDS).........1063. Power-off Sequence(Sub-LVDS)107Standby Cancel Sequence(Sub-LVDs)------------108SONYIMX274LQC-CSpot Pixel specifications--109Spot Pixel Zone Definition109Notice on White Pixels SpecificationsMeasurement Method for Spot Pixels1111. Black or white pixels at high light1112. White pixels in the dark.3. Black pixels at signal saturated111Spot Pixel Pattern Specifications----------------m---------------------------------------------------112Stain Specifications---113Stain Zone definition113Stain Measurement method.113Relation between Image height and target Cra-----Marking---------mm---------------115Notes on Handling116Package outline ---118List of Trademark Logos and Definition Statements-------------119SONYIMX274LQC-COptical Center(Top View)Package outline10.70±0.1mmPKG lpinM1A1Optical centerM1010See page TBD Package Outl ine" for detailsOptical CenterPin ConfigurationBottom View)lpin index6666δ画δ尚画○●Bottom viewQ§③¤¤意○○○○○○○○10○o⑦A b CE F GMPin configurationSONYIMX274LQC-CPin DescriptionWhen using CS1-2Pin descriptionState inSymbolOADRemarks(CS|-2Standby modeLeave openA2TEST4ATest(No connectionA3VDDHDa Power a Analog power supply (2.8V)A4VDD SUB PowerAnalog power supply(2.8VA5VDDLSC1PowerD Digital power supply(1.2v)A6VssLSC1GNDDDigital GND(1.2V)A7VDDLPL3 Power D Digital power supply (1.2 V)A8VDDLIFowerDigital power supply(1.2v)Leave openB1TEST5ATest(No connectionB2ssHDA GND A Analog GND (2.8V)B3BIASRESResister connectionB4/BGRCapacitor connectionB5GNDD Digital GND (1B6XCLRReset pulse inputB7VssLPL3GNDDigital GND (1.2VB8 VsSLIF1 GND D Digital GND (1.2V)B9DMO4NDigital MiPl outputLow LevelData lane 4connectionB10DMO4P。DDigital MIPl outputLow LevelData lane 4connectionC1TESt3TestLeave open(No connectionC2XCECannect to 1.8 V power supplyLeave openC3TEST1D(No connectionC4TEST2estLeave open(No connectionC5VDDLPAPowerDDigital power supply(1.2v)C6 VDDLPL2 Power D Digital power supply (1.2V)C7 VssLPL2 GND D Digital GND(1.2V)c9DMO2NDigital MIPl outputLow LevelData lane 2connectionData lane 2C10DMO2PDigital MIPl outputLow LevelconnectionD1XHSDDDDHorizontal sync signal outputIf unused xHsleave openD2SDOlest outputLow Leve/ Leave openNo connectionVertical sync signal outpuf unusedⅩVSDleave openD9DMCKND Digital MIPl outputLow LevelClock laneconnectionD10DMCKPDigital MIPl outputLow levelClock LaneconnectionE1SCLDDDc communication clock inputC communication dataE2SDAOinput/outputSONYIMX274LQC-CPinPin descriptionSymbolADState inRemarksNoCS-2Stand by modeE3VSSLCBGNDDigital GND(1.2 V)E8VssLlF2GNDDigital GND(1.2 V)E9DMO1NE10DMO1POFVDDLSC2 PowerF2VssLSC3 PowerDDDDDDADData lane 1Digital MIPl outputLow LevelconnectionData lane 1Digital MIPI outputLow LevelconnectionDigital power supply (1.2 V)Digital power supply (1.2 v)F3VopHCMPowerAnalog power supply(2.8 V)F8INCKInput clockDMO3NDigital MIPl outputData lane 3Low LevelconnectionF10 DMO3PData lane 3Digital MIPI outputLow LevelconnectionG3VssHCPGNDAAnalog GND (2.8V)G8VssLSC2 GND D Digital GND(1.2V)G9VssMIF2 GNDD Digital GND (1.8VG10VoDMIFPowerDDigital power supply (1.8V)H1VDDLCN GND D Digital GND(1.2V)VsSLCNGNDDigital GND (1.2 VH3VopHCPPowerAnalog power supply(2.8VDLO2P( Pin for Sub-LVDS)Leave open(No connectionH9DLO2M000(Pin for Sub-LVDS)Leave open(No connectiH10DLOOP(Pin for Sub-LVDS)Leave open(No connection)VssHPX3 GND AAnalog GND(2.8 V)J3VoDHPXPowerDLO3PADDDAADDAnalog power supply(2.8 V)(Pin for Sub-LVDS)Leave open(No connectionDLO3MO00(Pin for Sub-LVDS)Leave open(No connection)J10DLOOMD(Pin for Sub-LVDS)eave open(No connection)K2VssLPL 1GNDDDigital GND(1.2V)K3 VDDLPL1 Power D Digital power supply(1.2V)K4VoDMIO Power D Digital power supply(1.8V)K5DLO1M(Pin for Sub-LVDS)Leave open(No connectionDLCKM0b「(Pin for Sub-LVDS)Leave open(No connection)Leave openK7DLCKPD(Pin for Sub-LVDS(No connectionLeave openK8DLO9PD(Pin for Sub-LVDS)(No connectionLeave openK9DLO9M(Pin for Sub-LVDS)(No connectionK10DLO5P(Pin for Sub-LVDS)Leave openNo connection
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警用数字集群（PDT）通信系统总体技术要求
警用数字集群（PDT）通信系统总体技术要求9电气安全,2410电源适应性2411机械结构安全241.1结构..·.·2411.2表面温度.2412环境和电磁兼容要求·鲁专2512.1环境适应性2512.2电磁兼容性要求.13可靠性要求13.1信道设备可靠性55513.2控制和链路设备的可靠性.14运输和包装要求,,。非2图1网络基础设备示意图图2完全对等的系统互联网络架构。。。19图3 PDT-MPTI1327互联结构···.········,,,,.20图4安全机制示意图24表1PDT设备主要功能要求,。10表2信道设备总体性能指标表3基地台的发射机和接收机的射频指标.·非·静·着·非。章申·21表4手持台的发射机和接收机的射频指标。鲁表5车载台的发射机和接收机的射频指标1范围本技术要求规定了警用数字集群(PD)通信系统的技术特性、系统构成和功能要求作频段、网络管理、信道设备基本性能指标、交流供电系统、信息安仝和保密、环境和电磁兼容、可靠性等总体性要求。木技术要求适用」警用数字集群(PDT)通信系统的总体规划、网络设计、设备开发、生产、工程建设和验收2系统技术特性2.1基本技术体制2.1.1技术体制2.1.1.1信道划分米用频率和时间分割的方法划分信道。频率分割是在给定的350MHz到390Mz频段内按12.5kz信道间隔和10Ⅷz收发间隔划分载波信道。其他频段按照国家无线电管理部门的有关规定执行。时间分割时釆用时分复用/时分多址(TDMA)技术划分时隙信道。规定每载波时隙为两个,即物理信道为两个,再根据需要设置务和控制逻辑信道。2.1.1.2区域覆盖对于无线服务区的覆盖采用下列技术:大区制覆盖;频率复用;准同步发射;分时共享发射;直通模式⑩)/中转模式(RMO)/集群模式(TMO2.1.2射频调制方式射频调制方法采用四电平频移键控(4『SK)。2.1.3调制速率调制发送4800符号/秒,每个符号由两个比特信息组成。2.1.4语音编码语音编码速率应不低于2kbps,语音编码加上信道编码后的速率应为3.6kbpS2.2系统基本业务2.2.1用户终端业务用户终端业务是为用户终端之间提供完整通信能力的业务,系统应提供下列用户终端业务:语音和数据业务电话互联业务。2.2.2承载业务承载业务是在用户终端与网终接口之间提供信号传输能力的电信业务系统应提供下列承载业务:语音和电路数据传输业务短数据传输业务;分组数据传输业务2.3基本协议和信令基本协议和信令应符合警用数字集群(PDT)通信系统系列技术标准中所规定的有关协议和信令。2.4系统工作方式集群工作方式移动台在集群控制设备管理下的信道共享工作方式。2.4.2直通工作方式移动台之间直接互通的工作方式。2.4.3中转工作方式移动台通过中转台进行通信的工作方式2.4.4故障弱化工作方式基站和交换节点之间的链路或交换节点发生故障时,基站仍能以集群方式继续工作,支持本基站基本呼叫业务(单呼、组呼等)2.5呼叫建立时间同一交换局内组呼建立时间应不大」300ms。3系统构成和功能要求3.1系统构成3.1.1网络基础设备网络基础设备包括交换机、网关、网络管理设备、基站控制设备和基地台等,见图1。网关交换机网络管理设各基站基站基地台基地台基地台基地台图1网络基础设备示意图3.1.2用户终端设备用户终端设备包括移动台、有线台和调度台3.1.2.1移动台通过空屮接口和网络基础设备相连的普通用户终端设备,包括车载台、手持台等3.1.2.2有线台通过有线方式和网络基础设备相连的普通用户终端设备3.1.2.3调度台具有调度功能的用户终端设备,包括有线调度台和无线调度台。有线调度台通过有线方式和网络基础设备相连的调度台。无线调度台通过空中接口和网络基础设备相连的调度台3.2功能要求3.2.1功能定义3.2.1.1登记登记是移动台向集群系统发起入网请求及确认的过程,登记时必须要求进行鉴杈3.2.1.2去登记去登记是移动台向集群系统发出退出系统的通知过程。3.2.1.3漫游在由多个基站联网的系统中,移动台在归属基站以外的基站进行登记和继续使用系统提供的业务的功能3.2.1.4语音单呼语音单呼是移动台与其它用户终端之间建立的一种点对点的双冋语音呼叫,呼叫的参与方只有主叫和被叫两方。移动台之间的语音单呼分为 TOACSU和OACS两种。3.2.1.5语音组呼语音组呼是由·个移动台或者调度台发起的,多个移动台参与的点对多点的语音呼叫。3.2.1.6组呼迟入某个组呼建立后至结束之前,控制信道冑期广播该组呼的建立信息,以保证刚开机或刚从其他基站漫游到该基站或刚从其他通话组释放出来的移动台能参与这个尚未结束的组呼。3.2.1.7组呼并入个组呼建立后至结束之前,某移动台呼叫这个已经建立的通话组,系统将该移动台作为被叫并入到已经建立的组呼。3.2.1.8广播呼叫播呼叫是一种特殊的语音组呼,呼叫建立后在业务信道上只有主叫具备发射权限,被叫用户只有接收权限,可以有效防止被叫用户干扰主叫的发射过程。3.2.1.9紧急呼叫紧急呼叫是用户在紧急情况下发起的一种特殊呼叫,具有最髙优先级,当无信道资源时,系统会释放其他低级别呼叫的信道资源来给紧急呼叫使用。3.2.1.10优先呼叫优先呼叫是指系统繁忙时优先获取资源的呼叫,获取资源的方式可以是抢占低优先级呼叫的信道,也可以是在排队队列中插队3.2.1.11报警报警是在紧急情况下用户通过操作移动台设备上的特姝按钮,在系统控制信道上向预先设冒的目的(移动台或者调度台)发送预定义的状杰消息,通知其他移动台或者调度台,该用户正处于紧急危险的状态。3.2.1.12环境侦听环境侦听是调度台向移动台发起的一种特姝呼叫,用于监听移动台周边的环境声音。被叫移动台在系统指定的业务信道上自动打开发射机和MIC,将环境声音发送给调度台。在整个环境侦听过程中(侦听建立、侦听发射、侦听结朿),移动台的显示、扬声器、提示音、指小灯等人杋芥面状态应与空闲待机时完全相冋。环境侦听过程中,如果移动台用户进行呼岀操作(包括发短消息等),环境侦听都应自动结束,)返冋控制信道。调度台可以随时结宋·个由其建立的环境侦听呼叫3.2.1.13监听监听是指授权用户终端获取指定的移动台、通话组或者信道上的语音的过程。3.2.1.14插话插话是指调度台在监听或参与语音通话的过程中,强制中断正在进行的讲话,夺取话权进行讲话;3.2.1.15强拆强拆是指系统强制中断正在进行的呼叫并释放所占的相应资源的过程3.2.1.16越区切换越区切换是指移动台在语吝通话的过程中切换基站而不闩断止在进行的业务的过程3.2.1.17通话限时通话限时是系统控制用户进行语音呼叫时允许的最大持续时间的功能,包括单次按讲限时和单次呼叫总时长限时3.2.1.18讲话方身份识别讲话方身份识别是指在语音呼叫的过程中,语音接听方利用随路信令或者嵌入信令识别当前讲话方身份的功能3.2.1.19PTT授权PTˆ授权是为了避免语音碰撞而规定的讲话权申请、分配控制过稈,只有获得讲话权的移动台才能发射语音。3.2.1.20遥毙遥毙是系统利用空∏信令禁用移动台的过程,被遥毙的移动台将失去所有操作功能,只有利用授权的编稈设备才能将被遥毙的移动台激活3.2.1.21遥晕遥晕是利用空口信令禁用移动台的过程,授权的网管终端或调度台可将目标移动台遥晕。被遥晕的移动台不能发起或者接收仼何网络的服务(包括各类呼叫、短消息等业务),但应保留登记、去登记、鉴权、复活和数据上拉服务(如玊星定位信息上拉服务等),用来帮助寻找丢失移动台。被遥晕的移动台可以通过空凵复活。3.2.1.22复活复活是利用空∏信令解禁被遥晕移动台的过程,授杖网管终端或调度台可以进行复活操作,使移动台恢复到正常工作状态3.2.1.23动态重组动态重组是授权网管终端或调度台利用空口信令向目标移动台临时增加通话组(动态组)的过程,移动台新增加的动态组在收到删除该动态组的信令前一直有效。授权的网管终端或调度台也可以利用空口信令将日标移动台中的动态组删除。3.2.1.24呼叫限制呼叫限制是系统对移动台的呼叫权限的控制,通过设置,限制其呼叫功能。移动台只能进行权限范围内的呼叫,超过权限范围的呼叫将被系统拒绝。3.2.1.25状态消息状态消息是指移动台之间或者移动台与调度台之间,利用控制信道传递7比特消息编码的过程。状态消息可以是点到点的单呼,也可以是点对多点的组呼。3.2.1.26短消息短消息是移动台之间或移动台与调庋台之间,利用控制信道传递有限长度消息的过程短消息可以是点到点的单呼,也可以是点对多点的组呼。PDT系统中,单条短消息的长度为23个汉字。3.2.1.27卫星定位信息传输卫星定位信息传输是指移动台利用空∏信令上传该移动台卫星定位信息的过程。3.2.1.28网络管理网络管理是为了保证系统的正常运行而进行的一些参数配置、运行状态监控、用户档案管理等操作。网络管理至少应具备用户管理、配置管理、故障管理、性能管理和安全管理等功能集。3.2.1.29安全功能安全功能包括鉴权、端到端加密和空口加密3.2.1.30PDT系统之间的互联PDT系统之闫的互联是利用规定的互联协议完成PD交换控制中心之间的信息交互,实现系统间漫游及呼叫控制等功能。3.2.1.31有线电话呼叫有线电话呼叫是移动台利用空口及系统网关设备与PAB、PSTN等有线电话之问进行的呼3.2.1.32功率控制系统利用空口信令调整移动台的发射功牽,达到保障通信效果和降低移动台功耗日的。3.2.1.33包容呼叫包容呼叫是移动台在已经建立呼叫的业务信道上发起的,将其他目标移动台拉入当前业务信道通话的呼叫。3.2.1.34呼叫转移呼叫转移是指把来电转栘到预先设定的其他号码上的业务。呼叫转移叮由自身或第三方设置和取消,转移的条件分为无条件转移和有条件转移。3.2.1.35繁忙排队繁忙排队是当系统业务信道资源全忙时,系统将新发起的呼叫排入呼叫等待队列,待系统有空闲资源时对等待队列中的呼叫进行处理的过程。3.2.1.36分组数据分组数据是利用系统的业务信道,遵循分组数据传输协议实现多用户共享业务信道,进行数据传输的业务过程。3.2.1.37空口加密空∏加密是对移动台与基站之问空∏信令和语音、数据等业务信息的加密。3.2.1.38限定基站呼叫限定基站呼叫是指系统可以利用参数配置限定呼叫参与基站的范围,配置范围外的基站不参与该呼叫。3.2.2PDT设备主要功能要求PDT设备主要功能要求见表1。表1PDT设备主要功能要求编号功能网络基础设备移动台调度台1登记、去登记、鉴权、漫游单呼组呼4组呼迟入组呼并入6广播呼叫紧急呼叫789报警环境侦听监听、插话、强拆越区切换12通话限时13讲话方身份识别14PTT授权遥毙16遥晕、复活
- 2020-12-10下载
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