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新版glut带滚轮前移后移.zip
新版glut带滚轮旋转，GLUT_WHEEL_UP和GLUT_WHEEL_DOWN，直接用if判断 void mouse(int button, int state, int x, int y) { if (button == GLUT_WHEEL_UP) {函数体} }
- 2019-09-09下载
- 积分：1
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5G技术与标准介绍----第6部分：5G组网考虑之SA与NSA介绍-20180623
5G技术与标准介绍----第6部分：5G组网考虑之SA与NSA介绍-201806235G技术与标准介绍----第6部分：5G组网考虑之SA与NSA介绍-20180623网络架构选项:NR独立组网与非独立组网EPCEPCEPCSCG split bearerNR NSAMCG Split bearerSCG bearer(EPC Connected)闼 Option3Option 3xOption 3aNR NSA(NGC Connected)Option 7Option 7a郾 Option7xOption 5PNR SAOption 4pttion 4a郾 Option2标准化方案分类■标准化制定的SA和NSA多种子选项,NSA早于SA半年时间完成·SA组网更多依赖NGC和5GNR空口,双连接带来的数据分流非必选技术要求NSA依赖LTE/eLTE空口,双连接分流是NSA组网的必选技术要求标准化架构核心网核心网控制面数据分流点标准化完成时间Option2NGCNR2018.6Option 4NGCNRNR2018.12SAOption 4aNGCNRNGC2018.12Option 5NGCelte2018.6Option 3EPCLTELTE2017.12Option 3aEPCLTEEPC2017.12Option 3xEPCLTENR2017.12NSAOption 7NGCelteeLtE2018.6OptionalNGCeLtENGO2018.6Option/xNGCelteNR2018.6注:后续分析SA主要以 Option2为基础,NSA以 Option3系列为基础5G网络架构-SANR接入NGC控制面数据面Option 2Option 4Option 4aNGC((RI)(g)5G NReLTESG NReLTtE5G NReLTE接入NGC-Option 5eLTE5G网络架构—NSALTE接入EPC控制面数据面Option 3Option 3aOption 3X(RI)(y)LTE5G NRLTESG NRLTE5G NReLTE接入NGCOption 7Option 7aOption /XeLtE5G NReLTE5G NReLTE5G NR目录、什么是SA&NSA二、SA&NSA方案考虑三、小结SA(独立组网)和NSA(非独立组网)技术背景:为满足部分运营商快速部署5G需求,标准新引入一种新的组网架构-NSA非独立组网,而传统2/3/4G网络均采用SA独立组网的架构SA(独立组网):5G无线网与核心网之间的NAS信令(如注册,鉴权等)通过4G基站传递,5G可以独立工作选项2选项4系列NSA(非独立组网):5G依附于4G基站工作的网络架构,5G无线网与核心网之间的NAs信令(如注册,鉴权等)通过4G基站传递5G无法独立工作EPCEPC=NAS信令数据选项3系列选项7系列蓝色4G,绿色5G网络架构-SA架构 Option2类似于2/3/4G,5G与前代系统相互独立的网络架构原理■5G核心网与5G基站直接相连,5G核心网与5G基站通过NG接口直接相连,传递NAS信令和数据■5G无线空口的RRC信令、广播信令、数据都通过5GNR传递—■终端连接方式:只接入5G或4G(单连接),手机终端可以在NR侧上行双发与4G互操作:类似4G与3G/2G跨核心网互操作模式业务支持能力:可使用5G核心网能力,便于拓展垂直行业新增配置N26接口:NG、Ⅺn、N26(4/5G间互操作5GNR→LTE■4G与5G间互配邻区Option 2网络架构-NSA架构 Option3系列■NSA:4/5G紧耦合,5G依附于4G基站工作的网络架构,无法独立组网,存在多种子架构■原理:■同时沿用4G核心网,5G类似4G载波聚合中的辅载波,用于高速传输数据,NAS信令则由4G承载MME/SGWMME/S-GW5G无线空口的RRC信令、广播等信令可由4G传递,数据通过5GNR和4GLTE传递■终端连接方式:与5G和4G连接(双连接),受限功耗、散热,手机终端很难在双连接状态下,NR侧上行双发enB(P)en-gNB与4G互操作:无■业务支持能力:仅支持大带宽业务■新增配置LTEX2口升级,支持4G配置双连接5G目标小区和流控,与配置邻区类似NSA子架构■ Option3:数据面通过4G空口接入4G核心网,数据分流点在LtE enB,大量5G流量导入至4GeNB涉及硬件改造Option3a:通过4G空口接入4G核心网,数据分流点在LTE(R)(g)(R)EPCLTE5G NRLTE5G NRLTE5G NR■ Option3X:通过4G空口接入4G核心网,数据分流点在NROption 3Option 3aOption 3XgNB■ Option3涉及4G基站硬件改造,本材料主要介绍对NSA的 option3x和3a系列
- 2020-12-05下载
- 积分：1
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surf的matlab实现
SURF: Speeded Up Robust Features的matlab实现，内附实例
- 2020-12-02下载
- 积分：1
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课程设计--简易心电图仪设计
包含了设计过程及测试分析，20多页本系统利用高精度通用运算放大器AD620对输入的心电信号进行放大，再进行高通滤波,滤去高频生物电，同时采用右脚屏蔽驱动电路，消除50Hz生物电和机器信号的影响，最后在数字示波器上得到清晰的心电波形。
- 2021-05-06下载
- 积分：1
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利用Matlab绘制正弦信号的频谱图并做相关分析
进行频谱分析程序，用matlab编程实现
- 2020-12-10下载
- 积分：1
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python3+Tkinter+GUI界面+pyserial+串口+串口调试助手
一个用python3的Tkinter模块和pyserial模块写的串口调试助手,想学习上位机串口编程的要参考一下,Tkinter做的界面不够qt炫酷,但也够用
- 2020-12-06下载
- 积分：1
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flash 抽奖程序改进版(附带源文件)
这是一款改进版的flash抽奖程序，通过调用外部txt抽奖名单进行抽奖。适用于很多场合（如：活动配套抽奖）。按回车键开始抽奖，按空格键停止抽奖。抽奖的名单在namelist.txt文件里面，每抽奖一次程序会自动删除已抽奖过的名单。如果需要打包成exe文件请自行打包，打包后的exe的使用说明见“使用帮助.txt”文档。欢迎大伙下载。
- 2021-05-07下载
- 积分：1
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基于C#的FTP服务器、客户端设计
采用FTP PASV模式设计一个FTP服务器程序和一个FTP客户机程序，具有文件夹内容浏览和文件下载功能，服务器程序能够接受多个客户机的FTP请求并且能够对客户机身份进行验证。
- 2020-12-10下载
- 积分：1
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Labview视觉检测&数据库读写&串口通讯&事件应用&状态机应用
基于LABVIEW的相机检测灰尘的项目，此代码框架：电机转一个角度，相机拍照，照片分析，判别NG、OK,写入数据库，电机转一个角度，以此循环。里面应用了事件，状态机，生产消费结构等等结构。打开程序前先安装获取相机图片驱动、视觉模块、IO驱动。
- 2020-12-03下载
- 积分：1
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microTCA规范
PICMG microTCA.0 Specification RC1.0ContentsIntroduction and objectives1.1 Overview1.2 Introduction1.2.1S1.2.2 MicroTCa implementation options1画1-21.2.3 Design goals1-21.2.4 Elements of microtca1-312.5 Theory of operation……着1国面1面日正1-81.3 Micro TCA enclosure types191.3.1 Single Shelf implementation191.3.2 TWo Tier mⅸ ed Width Shelf implementation.…….….….….….….….…....1-101.3.3 Two-Tier fixed Single Width Shelf implementation ....................1-101.3.4 Back-to-Back Shelf implementation.1-101.3.5 Cube Shelf implementation..1-101.3.6 Pico Shelf implementations1111.3.7 Other implementation options1111.4 Application examples1-1114.1 Base station…1-111.42 Router1-121.4.3∨ olP node.….1-121.4.4 Other Telecom Network applicationsE画1-121.4.5 Enterprise applications1-131.4.6 Other applications.....1-131.4.7 Consumer applications1-131.5 Special word usage1-131.6 Conformance1-141.7 Dimensions1-141.8 Regulatory guidelines1-141.9 Reference specifications1.10 MicroTCA0 Specification contributor……1-151-161.11 Name and logo usage1-161.12 Intellectual property……1-171.12.1 Necessary claims1,,面,国国,,国面正∴1-181.12.2 Unnecessary claims11181.12. 3 Third party disclosures1-181.13 Glossary1-192Mechanical2-12.1 Mechanical overview∴………….2-12.1.1 Terminology…2-22.1.2 Typical arrangement examples2-22.2 Dimensions, tolerances, drawing symbols, and nomenclature2-62.3 Mechanical concept2-82.4 AdvancedMC Module orientation, location, and positioning2-1624.1 Module orientation.2-162.4.2 Module positioning, horizontal--mandatory2-172.4.3 Module positioning, vertical-mandatoryU.882-192. 4. 4 Module positioning, depth--mandatory,.42-21PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification2.5 Slot detail dimensions2-222.5.1S|ot..2-222.5.2 Slot configurations, subdividing Slots2-222.5.3 Card guide, Strut, and Card Guide Support Plate(CGSP)…………2232.5.4 Optional Subrack attachment plane2-322.5.5 AdvancedMC Module--optional locking………………………2-342.6 Backplane2-3627 Subrack dimensions2-412.7.1 Mandatory Subrack2-422.8 Shelf2-472.8. 1 Shelf types.2-482.8.2 Shelf width and height…...…2-492.8.3 Shelf depth2-492.8.4 Air filter provision2-502.8.5 ESD wrist strap interface2-502.8.6 Shelf alarm LEDs2-512.9 Cable management2-522. 10 Power entry /Power Module2-562.10.1 Power Module pcb dimensions2-582.10.2 Power Module component height1·面2-632.10.3 Power module face plate2-642.10. 4 Power Module handle/Latch mechanism.2672.10.5 Power module lEDs2-672. 10.6 Power Module EMc gasketing2-672.10.7 Power Module satety covers2-672.10 8 Power module labels2-682.10. 9 Power Module Backplane Connector2-682.11 MCH Module2-692.11.1 Module types2-692.11.2 MCH PCB dimensions.2-702.11.3 MCH Subrack slot details2-772.11. 4 Plug Connector.2-792.11.5 Sequencing and contact area2-812.11.6 MCH positioning2-812. 12 Air flow management面2-822.13 Auxiliary Connector(Zone 2 and zone 3)keying2-832.13.1 Component keep- in height2-842.13.2 Connector keep-in height2-842.133 Keying block…2-852.13.5 AMC0 electrically compatible keying block2.13. 4 Keying block with electrical connections2-86.2-872.14 MicroTCa cube2892.15 MicroTCA Pico2.16 Microtca filler pane的∵面1面面,面2-902-902.17 Cooling Units(CUs)2-912.18 Subrack/Shelf/Cube/Pico performance.2922. 18.1 Load carrying2-922.18.2 Insertion cycles2922.18.3ESD2-922.18.4EMC2-93PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification2. 18.5 Safety2-932.18.6 Physical Slot and Tier numbering2932.19 Subrack/Shelf environmental2-962.19. 1 Subrack shock and vibration2-962.19.2 Earthquake.........2-962.19.3 Flammability2-962.19.4 Atmospheric2-962. 19.5 Thermal2-972.19.6 Acoustic∴…………………2972.19.7 Surface temperatures2-972.20 References2-973 Hardware platform management3-13.1 Overview3.1.1 Micro Tca Carrier model3-13.1.3 Relationship with IPMI, AdvancedMC, and AdvancedTCA.3.1.2 MicroTCA management architecture3-23-73.1.4 Key differences from PICMG 3.0 and AMC.0 specifications..........3-73.1.5 PICMG properties and FRU Device ID assignments3-93.2 Management-related interconnects3-113.2.1 AdvancedMc interconnects3-113.2.2 Power Module and Cooling Unit interconnects3.2.3 Guidelines for OEM Module interconnects and management3-133-143.2.4 Carrier FRU Information device requirements.3-153.25 Microtca carrier interconnects3-193.3 Carrier Manager.…….…..…...…3-203.3.1 MCH Face Plate indicators3-223.3.2 Payload Interface3-223.3.3 Carrier Manager IP address3-223.3.4 IPM event support∴3-243.3.5 Redundant MCH operation3-253.3.6 Addressing3-263.3.7 Carrier number3-293.3.8 Location information34 Shelf Manager…3-383. 4.1 Shelf Manager configuration options383.4.2 Differences from the AdvancedTca shelf Manager3-403.4.3 Shelf-Carrier Manager Interface翻套国画1面,国面,1面D国画面国3-423.4.4 Shelf Manager IP addre3-433.5 MCMC requirements3453.6 EMMC requirements3-463.7 Operational state management3-483.7.1 Carrier Manager start up……….….….….………..……3483.7.2 Shelf Manager actions on Carrier detection3-483.7.3 Normal Shelf operation1B面面国B3-483.7.4 Abnormal situation handling3-4938 Power management.……3-493.8.1 Power clapping国面3-503.8.2 Micro T CA Carrier Power Management records.3-513.8.3 Early power management356PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification3.8.4 Normal power management.3-573.8.5 Power management commands and sensors3-593.8.6 Abnormal power condition handling3-673.9 Cooling management3-693.9.1 Fan geography.…3-703.9.2 Cooling control…3-713.9.3 Normal cooling operation3-723.9.4 Abnormal cooling operation3-733.9.5 Fan tachometer sensors3-733.9.6 Temperature sensors翻画1国翻B1B…3-733.10 Electronic Keying3-743.10.1 Micro TCA Carrier point-to-point connectivity information3-753.10.2 Module point-to-point connectivity information.3-773.10.3 AMC Port state commands3-783.10.4 Clock b- Keying……3-783.11 Telco alarm management3-73. 12 System Event log…………3-863.13 Sensor management3-863.13.1 Guidelines and requirements for fru sensor events3-863.13.2 MCMC SDR requirements.3-873.13.3 EMMC SDR requirements3-883.13.4 Carrier Manager SDR requirements3-883.14 fru Information.3-913. 14.1 EMMC FRU Information3-913. 14.2 MCMC FRU Information3-913.143 Carrier FRu Information3-923. 14.4 Shelf fru information面国面国面3-923.15 PMI message bridging……….3-933.15.1 Message bridging process3-933.16 PMI functions and command3-943. 16.1 Required IPMI functions..3-953.16.2 Command assignments3-973.17 FRU records, sensors and entity Ids∴3-1084 Power…4-14.1 Overview4-14.2 Loads on the Power Subsystem4-24.2.1 Microtca carrier hub(MCH),………,………………………24-24.2.2 Cooling Units4-74.2.3 Advanced mezzanine cards4-104.3 Power architecture4-134.3.1 Basic functionality4-134.3.2 Partitioning of the Power Subsystem:.::a:.4-154.3.3 Power sources4-154.3. 4 Power Subsystem redundancy4-164.3.5 System Grounding considerations4-214.3.6 Power distribution and backplane considerations4-234.4 Control and monitoring of the Power Subsystem4-2444.1 PM-EMMCs4-244.4.2 Geographic Address4-24PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification4.4.3|PMB-04-2444.4Ps1[S|o#4-254.4.5EN[Slof]#,…4-2544.6 PWRON_[Sot]…4-254.4.7PSPM#4-2644.8 PM-EMMC watchdog timer……4264.4.9 Power Module oK4-2744.10 Power module reset4-274.4.11 System power-up4-274.4.12 Input voltage sensors1国面面量面1国面4-294.4.13 Temperature sensors4-294414 Power module extraction switch4-304,415 Blue lED4-304.4.16LED14-314 4.17 Other leds4-314.5 Connectors4-314.5. 1 Power Module Output Connector4-324.5.2 Power Module Input Connectors81国面面4-324.6 Single-Width,Fu‖- Height Power Module…∴4-334.6.1 Inputs4-344.6.2 Outputs4-354.6.3 Bulk supply current limit4-384.6.4 Control and monitoring………………………4-384.6.5 Redundancy4-384.6.6 Mechanical4-4546.7 Thermals.8...8.88.84-45画·面4.6.8 Regulatory.4-4547 Other mechanical considerations…4-464.7.1 Double-Width form factor4-464.7.2 Form factors other than Full-Height4-464.8 Power source considerations.4-464.8.1 DC power feeds4-474.8.2 AC power feeds4-554.9 References4-605 Thermal5.1 Overview5-15.2 AMC. 0 Modules and microtCa国着画5-15.3 AMC.0 Carriers and microtca5.4 Subrack slot5-25.5 Airflow path5.6 AMC.0 Modules and power dissipation.5-35-35.7 MicroTCA system cooling configuration……….….….…....545. 8 Air distribution in a slot5-45.9 Air inlet and exhaust5-55. 10 Slot cooling capability5-55. 11 Module cooling requirements●5.12 Standard air.5-75.12.1 Derivatie5.122 Barometric changes due to weather....…...……….57PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification5.13 Slot impedance curve.5-85.14 Slot fan flow curve5.15 Cooling Unit failure5-85.16 Filters5.17 System sensors….…….….……5-95.18 Thermal and operating environment5-105.19 Thermal and cabling5-105.20 Simulation and impedance testing5-105.20.1 AdvancedMC/MCH reference Module..5-115.20.2 Power Unit reference module∴5-125.21 Simulation environment5.22 Thermal dynamic modeling5-135.23 Fluid networking modeling5.24 Acoustic noise5-135.25 Surface temperature5-145.26 Design recommendations5-155.27 Cooling limitations and examples..5-175.28 References1面5-226 Interconnect6-16.1 Introduction.…6-16.2 Fabric interface6.2.1 Backplane fabric interface support requirements6-26.2.2 MCH fabric interface support requirements6.3 MCH Specific Interfaces6-46.3.1 MCH update Channel interface6-46.3.2 MCH cross-over Channel interface.6-56. 3. 3 MCH PWR ON interface6-66.3.4 Inter-MCH IPMB-L interface6.4 Synchronization clock interface6.4.1 Signal descriptions6-86. 4.2 Clock architectures6-96.4.3 Non-Telecom and Telecom clocks6-136.5 JTAG interface.…6-136.5.1 JSM Overview6-146.5.2 JSM Signaling Overview6-166.5.3 JSM Interface to mch16.54 JSM Interface to mch2.……6-186.5.5 JSM Interface to Advancedmcs.6-196.5.6 JSM Interface to Power modules.6-226.5.7 JSM Master mode selection6-236.5.8 JSM Interface to External tester..6-246.5.9 MCH JTAG6-266.5. 10 Power module jtAG6-276.6 MicroTCA Interface topologies1画6-276.6. 1 Topology models6-286.6.2 Correlation to AdvancedMc fabric regions6-296.7 MCH Connector pin allocation6-306.7.1 Pin naming conventions6-316.7.2 Fabric interface naming conventions6-31PICMG MicroTCA. 0 Specification Draft RC1.o, May 26, 2006Do not specify or claim compliance with this Draft Specification6.7.3 Synchronization clock interface naming convention6-316.7.4 MCH Connector pin list……………6-326.8 System examples.6-386.8. 1 Redundant MicroTCA system6-386.8.2 Variant redundant microtca interconnect6-416.8.3 Non-redundant MicroTCA system6-45Connectors7-17.1 General information7-17.2 AdvancedMC Backplane Connectors7-17.2.1 AdvancedMC Backplane Connector pin list7-27.2.2 AdvancedMC Backplane Connector dimensions7-27.2.3 Advancedmc backplane connector pcb layout∴7-67. 2. 4 AdvancedMC Backplane Connector electrical characteristics7-107.2.5 AdvancedMC Backplane Connector high-speed characteristics7-147.2.6 AdvancedMC Backplane Connector mechanical characteristics7-187.3 Micro TCa Carrier hub connectors7-197.3.1 Micro TCA Carrier Hub Connector pin list7-197.3.2 Micro TCA Carrier Hub mating interface design7-207.3.3 Micro TCA Carrier Hub backplane connector7-227.3. 4 Micro TCA Carrier Hub Connector Backplane PCB layout7-237. 3.5 Micro tca Carrier Hub connector electrical characteristics7-247.3.6 Micro TCA Carrier Hub Connector high-speed characteristics7-2573.7 Micro tCa Carrier hub connector mechanical characteristics7-297.4 Power Module Output Connector7.4.1 Power Module Output Connector pin list and mating sequence7-317.4.2 Power Module Output Connector dimensions7-327. 4.3 Power Module Output Connector Backplane PCb layout7-347.4.4 Electrical characteristics for power Module output connector.7-367.4.5 Power Module Output Connector mechanical characteristics7-397.5 Power Module Input Connector7.5.1 Power Module Input Connector pin list and mating sequence7-417.5.2 Power Module Input Connector dimensions7-427.5.3 Electrical characteristics for Power Module Input Connector7-477.5.4 Power Module Input Connector mechanical characteristics7-517.6 AdvancedMC Auxiliary Connector7-537.7 Test schedule7-547.7.1 Specimen measurement arrangements7-547.7.2 Test schedule tables.7-647. 8 References.7-798 Regulatory requirements and industry standard guidelines8-18.1 Regulatory……8-18.1.1 Safety8-18.1.2 Electromagnetic compatibility..……………8-28.1.3 Ecology standards.8-28.2 Telecommunications industry standards requirements8-38. 2. 1 EMC/safety requirements for the telecommunications industry.......8-38.2.2 Environmental requirements for the telecommunications industry ..............8-48.3 Reliability/MTBF standards8-7PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification8.4 Cross reference list8.5 FRU test guidelines∴8-78.5. 1 FRU safety test8-88.5.2 FRU EMC testing.8-88.5.3 FRU environmental testing8-9a Module mis-insertion considerationsA-1A 1 MCH Module mis-insertion combinationsA-2A 2 AdvancedMc module mis-insertion combinationsA-5A3 Power management implicationsA-8A 4 System management implicationsA-8A.4.1 Optional MMC instance on MCH ModuleA-9A.4.2 Using an AdvancedMC in an MCH SlotA-13A.4.3 Using an mch in an AdvancedMc SlotA-15A.4.4 Detecting mis-insertionsA-16A.5 Hardware implicationsA-1A. 5. 1 GNd pins at same locations........A-20A.5.2 PSO# and PS1# pins at same locationsA-23A.5.3 PWR and MP pins at same locationsA27A.5. 4 PWR ON pinA-29A.5.5 Ga[2: 0] pins at same locations道1面4…A-31A.5.6 ENABLE# pin at same locationA-35A.5.7 SDA L and SCL L pinsA-37A 5.8 JTAG pinsA-38A 5.9 Cross-over pinsA-39A.5. 10 TMREQ#, 12C SDA, and I2C SCL pins…A-39B Requirement list….B-1PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification
- 2020-06-05下载
- 积分：1
