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fenpei
一对一分配
匈牙利算法
无人机目标分配
目标静止(One-to-one assignment)
- 2020-10-24 16:30:01下载
- 积分：1
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random4
(一) 模拟产生一个正态随机序列X(n)，要求自相关函数满足
画出产生的随机序列波形。
((A) simulation to generate a normal random sequence X (n), required to meet the autocorrelation function of random sequences generated by the waveform plot.)
- 2011-05-07 11:27:33下载
- 积分：1
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Computational-Mechanics01
计算力学基础，中国科技大学精品教材，王秀喜，吴恒安编著(The basis of Computational Mechanics, University of Science and Technology of China, boutique textbook series)
- 2012-11-08 10:17:08下载
- 积分：1
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lqrcontrol
control souce code with LQR
- 2007-06-16 17:28:58下载
- 积分：1
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MATLAB
平面波与涡旋光束干涉的干涉图样，可以用来制作全息图，从而产生涡旋光束(Interference pattern of plane wave and vortex beam interference, can be used to produce hologram, resulting in vortex beam)
- 2013-12-27 09:19:34下载
- 积分：1
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elwave-master
弹性波数值模拟，可以修改模型，可以做波场模拟，做面波的地震记录((Numerical simulation of seismic surface waves, you can modify the model, you can do the wave field snapshots do surface wave seismograms))
- 2017-09-29 15:14:45下载
- 积分：1
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PSO-lssvm
用于优化最小二乘支持向量机的Matlab程序代码，可直接实用。(Used to optimize the least squares support vector machine in Matlab code can be directly useful.)
- 2012-06-10 11:02:30下载
- 积分：1
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HEAT
matlab编写的流体计算和传热程序(很不错的哦)(matlab prepared and heat transfer fluid calculation procedures)
- 2013-10-15 19:44:22下载
- 积分：1
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matlab
己知一些离散的点，使用matlab利用最小二乘法拟合(Had a number of discrete points, with linear least squares fitting)
- 2013-10-14 15:05:47下载
- 积分：1
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zhaomingdagonglvfaguanerjiguan
根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电
银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) .
采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选
择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)
- 2012-10-25 13:22:30下载
- 积分：1
