动态贝叶斯网络推理学习理论及应用-肖秦琨 高嵩 高晓光.pdf
动态贝叶斯网络推理学习理论及应用；动态系统；可靠性评估；故障诊断；贝叶斯网络建模；DBN0212/642007动态贝叶斯网络推理学习理论及应用肖秦琨高嵩高晓光著所·萑宫散社北京图书在版编目(CP数据动态贝叶斯网络推理学习理论及应用/肖秦琨,高嵩,高晓光著.一北京:国防工业出版社,2007.10ISBN9787-11805323-4I.动.Ⅱ.①肖.②高.③高..Ⅲ.贝叶斯推断一研究Ⅳ.0212中国版本图书馆CIP数据核字(2007)第122784号※阍所·宫版社出版发行(北京市海淀区紫竹院南路23号邮政编码100044)京南印刷厂印刷新华书店经售开本850×1168132印张9字数233千字2007年10月第1版第1次印刷印數1-3000册定价20.00元(本书如有印装错误,我社负责调换国防书店:(010)68428422发行邮购:(010)68414474发行传真:(010)68411535发行业务:(010)68472764前言不确定性理论在人工智能、机器学习、自动控制领域已经得到越来越广泛的应用。本书以当前国际上不确定性研究领域的核心工具——动态贝叶斯网络为线索,进行了动态网络推理算法、平稳系统动态贝叶斯网络结构学习模型设计、非平稳系统动态网络变结构学习模型设计、基于概率模型进化算法的动态贝叶斯网络结构寻优算法的研究。推理算法以隐变量作为划分依据,讨论了离散、连续混合模型的推理算法,并进行了算法复杂度及应用领域的讨论;结构学习研究首先从度量体制入手,讨论了动态网络度量体制的可分解性,提出了平稳及非平稳系统网络结构学习模型,以及基于贪婪算法思想的遗传算法寻优思想;最终将推理及结构学习理论用于无人机路径规划、战场态势感知、动态数据挖掘、自主控制领域,并通过大量仿真检验。本书的研究工作得到了西安工业大学专著基金及国家自然科学基金重大研究计划(90205019)的资助。本书全面系统地介绍了动态贝叶斯网络的相关理论,重点介绍了动态网络的经典应用和国内外的新发展。全书共分9章。第1章概述了动态贝叶斯网络的产生与发展、基本操作及表达。第2章和第3章为本书的理论基础部分,首先从静态网络已经取得的理论成果及研究内容人手,由浅入深引出动态贝叶斯网络的基本概念及研究方向,确定本书将要解决的主要问题:DBN推理问题和连续变量的DBN结构学习问题。第4章在第3章基础上,详细讨论了三类动态贝叶斯网络的推理即隐变量离散、隐变量连续隐变量混合DBN推理;隐马尔科夫模型是所有离散动态网络的基础故首先介绍其表达及推理,由此派生出其他离散动态网络,并讨论了如何将复杂离散网络转化为简单HMM的方法,通过算法复杂度实验分析,明确了离散动态网络的相应属性,得出了相应结论,为合理选择DBN推理算法提供依据;在推理中,若系统参数未知或为时变系统,必然涉及参数学习,故在讨论三类网络的推理中亦涉及参数学习问题。第5章从静态网络结构度量机制入手,讨论并推导出动态贝叶斯网络结构用于网络结构度量的BC及BD度量机制;通过描述基于概率模型进化算法的构图基础,引出动态贝叶斯网络结构学习机制,即基于贝叶斯优化(BOA)的动态网络结构寻优算法,BOA算法的关键是根据优良解集学习得到动态贝叶斯网络,以及根据动态贝叶斯网络推理生成新个体,前者更为重要,按照本书提出的基于贪婪算法思想的遗传算法解决动态网络学习,然后应用动态贝叶斯网络前向模拟完成后一步。第6章在此基础上,刻画了基于BD度量体制的平稳动态系统DBN结构学习模型设计,并通过仿真验证了其有效性,针对非平稳随机系统DBN的结构学习模型,提出了一种自适应窗口法用于在线自适应学习变结构DEN结构,仿真结果可行。第7章在第4章DBN推理理论的基础上,从以往UCAV路径规划中使用的方法以及涉及的定义、术语等出发,讨论了静态路径规划、动态路进规划及空间路径规划三方面的基本问题,通过对原始 Voronoi图的改进,提出了平面改进型Voronoi图、空间改进型 Voronoi图的概念,以及平面及空间动态路径重规划区域原则等,为动态路径规划提供有力的整体构型支撑进而应用前几章理论基础,建立基于DBN的战场环境感知模型,仿真结果均表明了构图及动态决策模型的正确性。第8章在DN推理及结构学习的理论基础上,将其用于自主优化及动态数据挖掘。将BOA及基于概率模型的遗传算法的静态图形的优化机制进行推广,提出了一种动态优化的新方法,利用DBN作为t到t+1代转移网络,适时改变优化的基本条件,实时确立新的种群及优化的方向使得自主智能体在无人干预下顺利完成一系列复杂任务成为可能,将变结构DBN结构学习模型设计用于动态数据挖掘,实时确定个因素之间的关系。第9章通过两个典型的应Ⅳ用实例,将DBN推理学习理论进行融合,并用于实际模型。附录给出了与DBN结构度量相关定理、性质的证明,为读者进一步研究和学习动态贝叶斯网络提供参考。本书是作者近年来潜心学习和研究国内外不确定性算法理论、方法和应用成果的一个总结。在本书的编写过程中,得到了西安电子科技大学焦李成教授和清华大学戴琼海教授及英国BankUniversity陈大庆教授的热心指导和鼓励,新加坡南洋理工大学的王海芸博土后审阅了书稿,并提出了许多宝贵意见,特向他们表示衷心的感谢。由于涉及内容广泛及限于作者的学识水平,书中疏漏和不当之处在所难免,希望读者不吝赐教指正。作者目录第1章图模型与贝叶斯网络1.1图模型简介1.2动态贝叶斯网络…1.3动态贝叶斯网络应用研究1.3.1动态时序数据分析与挖掘157781.3.2无人机的态势感知与路径规划1.3.3.进化算法与动态贝叶斯网络混合优化………10第2章静态贝叶斯网络2.1静态贝叶斯置信网络2.2贝叶斯网络的特点与应用范围152.3贝叶斯网络的研究内容162.3.1计算复杂性162.3.2网络结构的确定问题…2.3.3已知结构的参数确定问题……182.3.4在给定结构上的概率计算…………192.3.5贝叶斯网络推理算法…19第3章动态贝叶斯网络基础283.1从静态网到动态网283.1.1概述·28Ⅵ3.1.2推导293.1.3动态贝叶斯网络表达………………313.2动态贝叶斯网络的研究内容353.2.1动态贝叶斯网络推理……………………363.2.2动态贝叶斯网络学习…39第4章动态贝叶斯网络推理…464.1隐变量离散动态网络推理……464.1.1模型数学描述464.1.2隐马尔科夫的研究内容484.1.3隐马尔科夫推理学习仿真…534.1.4隐马尔科夫其他拓扑形式…564.1.5一般离散动态网络和隐马尔科夫关系………………584.2动态贝叶斯网络推理算法性能分析604.2.1动态网络转化隐马尔科夫仿真…………614.2.2离散动态网络推理算法比较仿真…634.2.3连续动态网络推理比较仿真724.3模糊推理与隐马尔科夫结合炮火校射754.3.1概述………………………754.3.2模糊动态网络环境感知框架754.4隐变量连续动态网络推理794.4.1模型数学描述…………794.4.2卡尔曼滤波图模型推理………804.5混合隐状态动态贝叶斯网络…………834.5.1模型数学描述…834.5.2混合动态贝叶斯网络推理…864.5.3混合动态贝叶斯网络学习89第5章动态贝叶斯网络结构学习算法…………………915.1动态贝叶斯网络结构度量体制………915.1.1概述915.1.2动态网络的贝叶斯信息度量………935.1.3动态贝叶斯网络BD度量965.2动态贝叶斯网络度量分解性能分析985.3构建动态网络结构寻优算法1145.3.1基于概率模型的进化算法1155.3.2基于贝叶斯优化构造动态网络结构算法1165.3.3学习动态贝叶斯网络…1185.3.4动态臾叶斯网络推理…1275.4基于贝叶斯优化构建动态网络结构算法仿真………128第6章动态贝叶斯网络结构学习模型…1346.1平稳系统动态网络结构学习模型设计1346.1.1模型设计1356.1.2仿真试验1386.2变结构动态网络自适应结构学习模型设计………1446.2.1模糊自适应双尺度…1446.2.2动态系统非平稳程度和平稳性的测量……1516.3非平稳系统网络结构学习仿真试验153第7章基于动态贝叶斯网络的路径规划……1657.1无人机平面静态路径规划·…1657.1.1基本概念……1657.1.2基于相同威胁体的路径规划…166Ⅷ
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索尼 imx274 datesheet
imx274 datesheet，可以对接Hi3519V101，4K，分享一下SONYIMX274LQC-CAbsolute Maximum RatingsItemSymbolRatingsUnitSupply voltage(Analog)1ADD0.3to+3.3VSupply voltage(Digital 1)-0.5to+2.0Supply voltage(Digital 2)DDD20.5to+3.3VInput voltage(Digital)0.3toV。Dp+0.3VOutput voltage(Digital)-0.3toVD2+0.3Guaranteed operating temperature TOPR-30to+75°CStorage guarantee temperatureTSTG30to+80CPerformance guarantee temperature TsPEC10to+60Recommended Operating ConditionsItemSymbolRatingSupply voltage(Analog)VADD2.8±0.1Supply voltage(Digital 1)1.2±0.1VSupply voltage(Digital 2)1.8±0.1Input voltage(Digital)-0.1 to Vopp2+0.11 VADD: VDDSUB, VoDHCM, VoDHPX, VDDHDA, VDDHCP (2.8V power supplyVDDD1: VDDLCN, VDDLSC1 to 2, VDDLPA, VDDLPL1, VoDLPL2 to 3. VDDLIF (1.2V power supply)VDDD2: VDDMIO, VDDMIF (1.8V power supply)SONYIMX274LQC-CUSE RESTRICTION NOTICEThis USE RESTRIC TION NOTICE (Notice )is for customers who are considering or currently using theimage sensor products("Products")set forth in this specifications book. Sony Corporation Sony")mayat any time, modify this Notice which will be available to you in the latest specifications book for theProducts. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has itsown use restriction notice on the Products, such a use restriction notice will additionally apply betweerou and the subsidiary or distributor. You should consult a sales representative of the subsidiary ordistributor of sony on such a use restriction notice when you consider using the ProductsUse restrictionsThe Products are intended for incorporation into such general electronic equipment as office productscommunication products, measurement products, and home electronics products in accordance withthe terms and conditions set forth in this specifications book and otherwise notified by sony from timeYou should not use the Products for critical applications which may pose a life-or injury-threateningrisk or are highly likely to cause significant property damage in the event of failure of the products. Youshould consult your sales representative beforehand when you consider using the products for suchcritical applications. In addition, you should not use the products in weapon or military equipmentSony disclaims and does not assume any liability and damages arising out of misuse improper usemodification, use of the Products for the above-mentioned critical applications, weapon and militaryequipment, or any deviation from the requirements set forth in this specifications booklesign for SafetySony is making continuous efforts to further improve the quality and reliability of the products howeverfailure of a certain percentage of the products is inevitable. Therefore, you should take sufficient careto ensure the sate design of your products such as component redundancy, anti-contlagration featuresand features to prevent mIs-operation in order to avoid accidents resulting in injury or death fire orother social damage as a result of such failureExport ControlIf the Products are controlled items under the export control laws or regulations of various countriesapproval may be required for the export of the products under the said laws or regulationsYou should be responsible for compliance with the said laws or regulationsNo License Impliedo The technical information shown in this specifications book is for your reference purposes only. theavailability of this specifications book shall not be construed as giving any indication that sony and itscensors will license any intellectual property rights in such information by any implication or otherwiseSony will not assume responsibility for any problems in connection with your use of such information orfor any infringement of third-party rights due to the same. It is therefore your sole legal and financialresponsibility to resolve any such problems and infringementGoverning lawThis notice shall be governed by and construed in accordance with the laws of Japan, without referenceto principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relatingto this Notice shall be submitted to the exclusive jurisdiction of the Tokyo district Court in Japan as thecourt of first instanceOther Applicable Terms and ConditionsThe terms and conditions in the Sony additional specifications, which will be made available to you whenyou order the Products, shall also be applicable to your use of the Products as well as to thisspecifications book. You should review those terms and conditions when you consider purchasingand/or using the ProductsGeneral-0.0. 8SONYIMX274LQC-CContentsDescription---FeaturesDevice structureOptical Black Array and Readout Scan Direction---Absolute Maximum Ratings2233Recommended Operating Conditions---------------USE RESTRICTION NOTICEContentsOptical CePin Configuration------------------Pin description-------------------------458899hen using csl-2When using Sub-LVDS1210 Equivalent Circuit Diagram15Peripheral Circuit19System OutlineWhen using CSl-2When using Sub-LVDSElectrical Characteristics when using cs1-2--------------------------m---------------------------------21. DC Characteristics(CS1-2)a.8..4Current Consumption and Gain Variable Range(CSl-2Supply Voltage and l/O Voltage(CS1-2)2. AC Characteristics(CS1-222INCK, XCLR(CSl-2)22XHS, XVS(Output)(CSI-2)22IC Communication (CSI-2)23DMCKP/DMCKN, DMO(CSl-2Electrical Characteristics When Using Sub-LVDs-------------------m--------------------------1. DC Characteristics(Sub-LVDs)……Current Consumption and gain Variable Range sub-LVDS24Supply Voltage and l/o Voltage(Sub-LVDSLVDS Output DC Characteristics(Sub-LVDS2. AC Characteristics ( Sub-LVDS).........25INCK, XCLR, XVS(input), XHS (input)(Sub-LVDS25Serial Communication(Sub-LVDS)Sub-LVDS Output(Sub-LVDS)26Spectral Sensitivity Characteristics(CS1-2 and Sub-LVDS27Image Sensor Characteristics(CSl-2 and Sub-LVDS)-281. Zone Definition of Image Sensor Characteristics28mage Sensor Characteristics Measurement Method(CSl-2 and Sub-LVDS)1. Measurement conditions2. Color Coding of this Image Sensor and Readout..293. Definition of Standard Imaging Conditions29Setting Registers Using I"C Communication(When Using CSl-2Description of Setting Registers When Using I C communication31Pin Connection of Serial Communication Operation Specifications When Using I"C CommunicationRegister Communication Timing When Using I-C Communication12C Communication Protocol32Register Write and Read33Single Read from Random Location33Single read from current location; iidaiaii:;aaaa“Sequential Read Starting from Random LocationSequential Read Starting from Current Location34Single Write to Random Location35Sequential Write Starting from Random Location35Register Value Reflection Timing to Output Data(CSl-2)36SONYIMX274LQC-CSetting Registers Using Serial Communication (When Using Sub-LVDS)----------------37Setting Registers Using Serial Communication(Sub-LVDS).37Register Value Reflection Timing to Output Data( Sub-LVDS38Register Map…391. Description of Register2. Register Setting for Each Readout Drive Modeeadout Drive Modes( csl-2 and Sub-LVDS)---------------------551. Readout drive modes552. Relationship between Arithmetic Processing and the Number of Output bits in Each Readout Drive ModeImage Data Output Format When Using CSI-2--------------------------58Frame Format (CSI-2)58Frame Structure(CSl-258Embedded Data Line(CSl-2)59CSl-2 serial Output Setting(CSl-2)MIPI Transmitter(CSl-2)62Detailed Specification of Each Mode(CSl-2)---------------631. Horizontal/ Vertical Operation Period in Each Readout Drive Mode(CSl-22. Frame Rate Adjustment(CSl-23. Image Data Output Format CSl-265Vertical Arbitrary Cropping Function(CSl-2)-69Horizontal Arbitrary Cropping Function(CSl-272Electronic Shutter Timing When Using CSI-2------741. SHR, SVR, SMD Setting When Using CSl-2741-1. SHR, SVR Setting(CSl-2)741-2. Electronic Shutter Drive Mode(Csl-2)752. Integration Time in Each Readout Drive Mode and Mode Changes When Using CSl-2762-1. Integration Time in Each Readout Drive Mode(CSl-2762-2. Operation when Changing the Readout Drive Mode(CSl-2772-3. Low Power Consumption Drive in Integration Time When Using Roll ing Shutter Operation(CSl-2)78Image Data Output Format When Using Sub-LVDS--791. Sync Signals and Data Output Timing(Sub-LVDS)““792. Output Range of LVDS Output Data(Sub-LVDS)Detailed Specification of Each Mode(Sub-LVDS)删mHorizontal/Vertical Operation Period in Each Readout Drive Mode(sub-LVDs)..........2. Frame Rate Adjus咖ment(Sub-LVDS)……3. Image Data Output Format ( Sub-LVDS)Vertical Arbitrary Cropping(Sub-LVDS)Horizontal arbitrary cropping function(Sub-LVDS)----m94Electronic Shutter Timing When Using Sub-LVDS961. SHR, SVR Setting(Sub-LVDS)...962. SVR Operation (Sub-LVDS3. Electronic Shutter Drive Mode( Sub-LVDS)974. Integration Time in Each Readout Drive Mode and mode changes When Using Sub-LVDS984-1. Integration Time in Each Readout Drive Mode(Sub-LVDS984-2. Operation when Changing the Readout Drive Mode(Sub-LVDS994-3. Recommended Global Reset Shutter Operation Sequence(Sub-LVDS)1004-4. Interruptive Mode Change(Sub-LVDS4-5. Low Power Consumption Drive in Exposure Time (Sub-LVDS)…102Power-on/off Sequence when using CSI-2---1031. Power-on Sequence(CS2)……1032. Slew Rate Limitation of Power-on Sequence( CSI-21033. Power-off Sequence(CSl-2104Standby cancel sequence when using csl-2--------------------------105Power-on/off Sequence when using Sub-LVDS1161. Power-on Sequence(Sub-LVDS)1062. Slew Rate Limitation of Power-on Sequence(Sub-LVDS).........1063. Power-off Sequence(Sub-LVDS)107Standby Cancel Sequence(Sub-LVDs)------------108SONYIMX274LQC-CSpot Pixel specifications--109Spot Pixel Zone Definition109Notice on White Pixels SpecificationsMeasurement Method for Spot Pixels1111. Black or white pixels at high light1112. White pixels in the dark.3. Black pixels at signal saturated111Spot Pixel Pattern Specifications----------------m---------------------------------------------------112Stain Specifications---113Stain Zone definition113Stain Measurement method.113Relation between Image height and target Cra-----Marking---------mm---------------115Notes on Handling116Package outline ---118List of Trademark Logos and Definition Statements-------------119SONYIMX274LQC-COptical Center(Top View)Package outline10.70±0.1mmPKG lpinM1A1Optical centerM1010See page TBD Package Outl ine" for detailsOptical CenterPin ConfigurationBottom View)lpin index6666δ画δ尚画○●Bottom viewQ§③¤¤意○○○○○○○○10○o⑦A b CE F GMPin configurationSONYIMX274LQC-CPin DescriptionWhen using CS1-2Pin descriptionState inSymbolOADRemarks(CS|-2Standby modeLeave openA2TEST4ATest(No connectionA3VDDHDa Power a Analog power supply (2.8V)A4VDD SUB PowerAnalog power supply(2.8VA5VDDLSC1PowerD Digital power supply(1.2v)A6VssLSC1GNDDDigital GND(1.2V)A7VDDLPL3 Power D Digital power supply (1.2 V)A8VDDLIFowerDigital power supply(1.2v)Leave openB1TEST5ATest(No connectionB2ssHDA GND A Analog GND (2.8V)B3BIASRESResister connectionB4/BGRCapacitor connectionB5GNDD Digital GND (1B6XCLRReset pulse inputB7VssLPL3GNDDigital GND (1.2VB8 VsSLIF1 GND D Digital GND (1.2V)B9DMO4NDigital MiPl outputLow LevelData lane 4connectionB10DMO4P。DDigital MIPl outputLow LevelData lane 4connectionC1TESt3TestLeave open(No connectionC2XCECannect to 1.8 V power supplyLeave openC3TEST1D(No connectionC4TEST2estLeave open(No connectionC5VDDLPAPowerDDigital power supply(1.2v)C6 VDDLPL2 Power D Digital power supply (1.2V)C7 VssLPL2 GND D Digital GND(1.2V)c9DMO2NDigital MIPl outputLow LevelData lane 2connectionData lane 2C10DMO2PDigital MIPl outputLow LevelconnectionD1XHSDDDDHorizontal sync signal outputIf unused xHsleave openD2SDOlest outputLow Leve/ Leave openNo connectionVertical sync signal outpuf unusedⅩVSDleave openD9DMCKND Digital MIPl outputLow LevelClock laneconnectionD10DMCKPDigital MIPl outputLow levelClock LaneconnectionE1SCLDDDc communication clock inputC communication dataE2SDAOinput/outputSONYIMX274LQC-CPinPin descriptionSymbolADState inRemarksNoCS-2Stand by modeE3VSSLCBGNDDigital GND(1.2 V)E8VssLlF2GNDDigital GND(1.2 V)E9DMO1NE10DMO1POFVDDLSC2 PowerF2VssLSC3 PowerDDDDDDADData lane 1Digital MIPl outputLow LevelconnectionData lane 1Digital MIPI outputLow LevelconnectionDigital power supply (1.2 V)Digital power supply (1.2 v)F3VopHCMPowerAnalog power supply(2.8 V)F8INCKInput clockDMO3NDigital MIPl outputData lane 3Low LevelconnectionF10 DMO3PData lane 3Digital MIPI outputLow LevelconnectionG3VssHCPGNDAAnalog GND (2.8V)G8VssLSC2 GND D Digital GND(1.2V)G9VssMIF2 GNDD Digital GND (1.8VG10VoDMIFPowerDDigital power supply (1.8V)H1VDDLCN GND D Digital GND(1.2V)VsSLCNGNDDigital GND (1.2 VH3VopHCPPowerAnalog power supply(2.8VDLO2P( Pin for Sub-LVDS)Leave open(No connectionH9DLO2M000(Pin for Sub-LVDS)Leave open(No connectiH10DLOOP(Pin for Sub-LVDS)Leave open(No connection)VssHPX3 GND AAnalog GND(2.8 V)J3VoDHPXPowerDLO3PADDDAADDAnalog power supply(2.8 V)(Pin for Sub-LVDS)Leave open(No connectionDLO3MO00(Pin for Sub-LVDS)Leave open(No connection)J10DLOOMD(Pin for Sub-LVDS)eave open(No connection)K2VssLPL 1GNDDDigital GND(1.2V)K3 VDDLPL1 Power D Digital power supply(1.2V)K4VoDMIO Power D Digital power supply(1.8V)K5DLO1M(Pin for Sub-LVDS)Leave open(No connectionDLCKM0b「(Pin for Sub-LVDS)Leave open(No connection)Leave openK7DLCKPD(Pin for Sub-LVDS(No connectionLeave openK8DLO9PD(Pin for Sub-LVDS)(No connectionLeave openK9DLO9M(Pin for Sub-LVDS)(No connectionK10DLO5P(Pin for Sub-LVDS)Leave openNo connection
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