现代水电厂计算机监控技术与试验.pdf
现代水电厂计算机监控技术与试验.pdf电为斌验转花丛书丛书主編文伯姜龙华现代水电厂饼算机监控赦术与试验方辉歌主编换冲主申中力归版www.Ccepp+omm.ch内了单雄多年来赛电力试验的最验,促进道电力试水平的提,中■电力企歌食会电力式验研究分金初中国咖力出组机罩了《找术凸#》,本书电力公司电紫[9】430号文《芋鬼力工业效木些督工作意的要求1用性、先性、扰性代京唱广计算了控技术与试》是本丛书之一,是一本全河反唤我水电厂自动羊害排暂查于综耄来夜棵了技柔节技意蓝技术的全过在理论面。对:分布暴能(包找对分款功分矿等单控、开欺、国向对康、斯平白暴我等邮进行了讨论在工曇实方,购常肌水坐,还对御量水控水电厂监控技术行了嫌讨。并对教件可性与件测式及堂谁认安在等业鹭书龄简5坏环是酚鉴哥始防录了《水电厂无人值赛的着干蠣定、《水幽厂计赛祖监控电厂开设膏状工的等?小最堂事射中苹水咆厂切档内赛,以方动化、站自调化进■业术是具生套考健肾,也可你为者美于业邮训矿团书在版麴目〔CP)据现代水电厂计算机监控技术与试验/方辉钦主编.北京:中国电力出版社,2004电力试验技木丛书/文伯瑜,姜龙华丛书主编}IS75083-19427I.现Ⅱ.方,Ⅲ.水力发电站-计算机控制ITv736中國版本图书馆CP效据核字(2003)第12217号中国电力出版社出版、发行北京兰里河路6号1004hp://www,cpp,com,en)航远印刷厂印刷各地新华书店经售204年3月第一版2004年3月北京第一次印刷毫米ⅹ10y毫米16开本2T即张609千字印数01-300册定价到00元煆杈专有印必究本书如有印装质量问题,我杜发行部负责退换1998年作者于三峡大坝基坑工程工地作者简介方辉钦,教授级膏级工程师,1962年毕业于华中工学院(现华中科技大学),1965年同校研究生毕业。曾在中国水利水电科学研究院、水电部第十二工程局设计院、国电自动化研究院工作,先后担任能源部南京自动化研究所学术委员会委员,自动控制研究所副总工程师,江苏省微电脑应用协会工业控制专委会主任,《水电厂自动化》网刊主编,国家电力公司发输电运营部发电设备改造咨询专家组专家、水电厂“无人值班”(少人值守验收专家组专家等职,现为中国水力发电工程学会理事,江苏省微电脑应用协会理事,中国电机工程学会高级会员,1981年被评为南京市先进工作者,1993年开始享受中华人民共和国国务院颁发的政府特殊津贴主持或作为课题负责人完成了有关葛洲坝、三峡等多个国控和部控重大科研项目,全国试点工程和中外合作项目,已合作编写了《现代水电厂自动化》、《中国水力发电工程机电卷》、《水电厂近代技术》三本书,在国家核心期刊、重点专业期刊和国际、全国学术会议上发表中、英文学术论文50多篇,其中部分被英、俄文文摘收录。参与的项目或图书曾获得部信息成果一等奖、部科技成果二等奖、科技进步奖(科技著作)一等奖和第五届国家图书奖等。电力试验技术丛常编县会主任赵鹏主编文伯瑜副主编姜龙华委员(按姓氏笔画为序)毛兴其王启全王海林白云庆白立江冯亚民史更林朱国俊巩学海刘韶林张大国张方祁太元宋志毅张怡荣张俊生张勇刚李建勋李晨余维平苑立国杨华陈坚林韩施冲赵伟赵庆波郑松赵炳松袁日秋贾玉堂顾南峰徐润生康健傅伟潘言敏““##电力试验研究是经济建设尤其是电力工业发展中一项不可或缺的事业。中外电力事业的发展,均离不开电力试验研究人员的智慧和辛勤工作。新中国成立后,尤其是改革开放以来,随着电力工业的发展,我国电力试验研究事业取得了长足的进步,电力试验研究队伍不断扩大,试验研究成果层出不穷,极大地推动了电力工业的快速发展目前我国各地区均拥有自己的电力试验研究机构,从事电力试验研究的工程技术人员超过1000人。这支队伍的文化层次也从解放初期的以中专、大专毕业生为主,提高到今天的以大学毕业生、硕士生和博士生为主。更重要的是,这是一群热爱自己的事业、勤于钻研、勇于实践的勤奋劳动者。前后几辈人相互学习,长期工作实践,积累了大量试验研究工作经验。这是他们用汗水、心血以至生命换来的、值得用文字记录并传之于后世的宝贵经验。随着电力体制改革的不断深化,使电力试验研究事业进入了竞争激烈同时又是历史上最好的发展时期。电力试验研究同行们愿意把自己的经验无私地奉献给广大读者,就是为了促进我国电力试验研究事业的进步与飞跃,促进我国电力工业的发展与兴旺,进而促进我国国民经济的增长与繁荣。本着各取所长、共同提高的初衷,我们经过长时间的准备,编辑出版《电力试验技术丛书》,相信它一定会给读者带来启发、思考和收益。华北电力科学研胶有限煮任公司总经理和m中国电力企业联合会电力试验研究分会会长2003年12月蚕营我国目前装机总容量为3.5亿kW,居世界第二。随着三峡电站机组的分批投入运行和西电东送工程的推进,到2010年全国性的大电网将初步形成。全国性电力系统运行的动态品质、安全稳定和经济性的改善与提高成为电力科技工作者肩负的重要责任。为了总结多年来我国电力试验的经验,促进我国电力试验水平的提高,中国电力企业联合会电力试验研究分会和中国电力出版社决定组织编写一套《电力试验技术丛书》,以满足国内各电力试验研究院(所)、电厂、供用电企业、电力基建单位及大专院校、科研院所对专业技术书籍的迫切需要。本系列丛书的内容主要是根据原国家电力公司电安生[1996]430号文《关于电力工业技术监督工作规定》的要求而确定的。该文中规定,“电力技术监督工作应以质量为中心、以标准为依据、以计量为手段,建立质量、标准、计量三位一体的技术监督体系,依靠科学进步,采用和推广成熟、行之有效的新技术、新方法,不断提高技术监督的专业水平”。因此,本套丛书涵盖的内容应包括电能质量、金属、化学、绝缘、热工、电测、环保、继电保护、节能等,并对设备的健康水平及其安全、经济运行方面的重要参数、性能与指标进行监督、审查、调整和评价。本丛书共分15册。丛书具有科学性、实用性、先进性、权威性。作者在写作过程中树立了精品意识和创优信念。特别感谢中国电力企业联合会电力试验研究分会,全国三十二个试验研究院(所、技术中心)的领导,我们的分册主编主要由这些单位的技术专家担任。特别感谢中国电机工程学会在组织编写中给予的大力支持。丛书主编怕翔丛书副主编姜也坪2003年12月1日本书作者在一年前就告诉我正在写一本关于水电厂计算机监控技术方面的书,我当即就表示支持并给予肯定。现在他又希望我为此书写一序,我也欣然同意。方辉钦同志原是我校(原华中工学院,现名华中科技大学)20世纪60年代为数不多的研究生之一,当时按原苏联副博士的教学要求培养,打下了良好的专业基础。三十多年来一直在水电厂自动化领域的第一线从事科研和试制工作,经历了我国水电厂计算机监控技术走向成熟的过程。曾经参加了获得中国第五届图书奖的《中国水力发电工程》之第六卷(机电卷)等三本书的编写工作,在20世纪80年代与王金生合著的《现代水电厂自动化》一书成为我国水电厂计算机监控技术的第一本专业性高级科普读物。现在本书即将出版,我为这本全面反映我国水电厂自动化行业的迅速发展和最新成果的专著的问世表示祝贺和欣慰。该书的主要特点是内容丰富,涵盖了水电厂监控使用的各种新技术,对我国水电厂监控技术发展的主要过程、不同时期各种技术发展的情况、代表产品和现状全面地进行了介绍。除常规电站外,涉及梯级、蓄能、无人值班、综合自动化、状态检修等各个方面。作者在理论研究方面作了大量工作。书中对分布系统(包括按对象分布、按功能分布等)、分层控制、开放系统、面向对象、跨平台系统等在理论上都进行了探讨,并对监控系统内部通信、外部通信、现场总线以及We浏览等都进行了讨论,同时概括了各种常用的通信规约和多种现场总线协议及应用情况,还总结了丰富的工程实践经验,理论结合实际,对软硬件试验也进行了讨论,如软件可靠性与软件测试,监控系统环境,监控系统的试验、验收及远方诊断,以及监控系统软件开发环境等。可见,这是一本兼顾学术性、工程性、系统性、实用性和前瞻性于一体的一本不可多得的好书。21世纪待建的水电工程最多的是在中国,该书的出版为总结完善中国的水电厂监控技术作了一份有益的工作。中国工程院院士多多(2003年5月本书雹管我国水电厂计算机监控技术的发展,走过了一条曲折而不平坦的道路。新中国成立后虽然我国的水电事业有了突飞猛进的发展,水电厂自动化技术的发展仍然缓慢。我国执行改革开放政策以后,1979年“全国水电站自动化技术经验交流会”的召开,对我国水电厂自动化技术的发展起到了很好的动员和推动作用。正如本书所总结的,我国水电厂计算机监控技术的发展大体上经过了探索、试点、推广、提高四个阶段。在这次会议以前的探索阶段,当时虽进行了“巡回检测”、“成组调节”、“四遥”等装置以及计算机控制技术的研究,但由于主计算机可靠性低、系统抗干扰等问题难以解决以及监控系统功能设计、设备选配、软件组织等问题而成果甚微。水电厂自动化科学技术发展七年规划(1979~1985年)的制定开始了我国水电厂监控技术发展的试点阶段。随后四个试点工程葛洲坝、富春江、浑江梯级和永定河梯级的科研工作开始启动。在试点工作取得成功以后,1987年在南京召开的“全国水电厂自动化技术总结和规划落实工作会议”和1993年在成都召开的“全国水电厂计算机监控系统工作会议”启动和落实了推广工作,分别安排了“七五”期间14个新建水电厂和12个已运行电厂启动或实现计算机监控系统的研制工作,规定“八五”期间应有40个左右大型电厂(群)实现计算机自动经济运行及安全监视,并规划到2000年大型水电厂和集中管理的梯级电站(群)都应实现不同程度的计算机监控,预期21世纪初全国大中型水电厂总装机容量的70%左右实现不同程度的计算机监控。根据2002年的统计,全国实现计算机监控的水电厂已达300座左右。原电力部安生司主持召开的1994年太平湾会议和1996年湖南会议在推广的基础上开始了“提高”的进程,提出了水电厂实现“无人值班”(少人值守)的目标。在全国水电厂和调度中心(局)的大力支持下,截止到2002年上半年,我国已有30座水电厂通过了电力工业部或国家电力公司组织的正式验收,总装机2192万kW,约占全国水电总装机的30%。在水电厂计算机监控技术的发展中,国电自动化研究院、中国水利水电科学研究院以及其他一些教学、科研、制造单位都发挥了重要的作用。方辉钦同志20世纪60年代起从事水电厂自动化领域的研究工作,曾参加电力系统水电厂经济调度计算机系统的研制和富春江水电厂综合自动化方案的制定,来院后是我院筹建时期自动控制小组七人成员之一。他参加了水电部为制定我国20世纪70年代水电厂自
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索尼 imx274 datesheet
imx274 datesheet，可以对接Hi3519V101，4K，分享一下SONYIMX274LQC-CAbsolute Maximum RatingsItemSymbolRatingsUnitSupply voltage(Analog)1ADD0.3to+3.3VSupply voltage(Digital 1)-0.5to+2.0Supply voltage(Digital 2)DDD20.5to+3.3VInput voltage(Digital)0.3toV。Dp+0.3VOutput voltage(Digital)-0.3toVD2+0.3Guaranteed operating temperature TOPR-30to+75°CStorage guarantee temperatureTSTG30to+80CPerformance guarantee temperature TsPEC10to+60Recommended Operating ConditionsItemSymbolRatingSupply voltage(Analog)VADD2.8±0.1Supply voltage(Digital 1)1.2±0.1VSupply voltage(Digital 2)1.8±0.1Input voltage(Digital)-0.1 to Vopp2+0.11 VADD: VDDSUB, VoDHCM, VoDHPX, VDDHDA, VDDHCP (2.8V power supplyVDDD1: VDDLCN, VDDLSC1 to 2, VDDLPA, VDDLPL1, VoDLPL2 to 3. VDDLIF (1.2V power supply)VDDD2: VDDMIO, VDDMIF (1.8V power supply)SONYIMX274LQC-CUSE RESTRICTION NOTICEThis USE RESTRIC TION NOTICE (Notice )is for customers who are considering or currently using theimage sensor products("Products")set forth in this specifications book. Sony Corporation Sony")mayat any time, modify this Notice which will be available to you in the latest specifications book for theProducts. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has itsown use restriction notice on the Products, such a use restriction notice will additionally apply betweerou and the subsidiary or distributor. You should consult a sales representative of the subsidiary ordistributor of sony on such a use restriction notice when you consider using the ProductsUse restrictionsThe Products are intended for incorporation into such general electronic equipment as office productscommunication products, measurement products, and home electronics products in accordance withthe terms and conditions set forth in this specifications book and otherwise notified by sony from timeYou should not use the Products for critical applications which may pose a life-or injury-threateningrisk or are highly likely to cause significant property damage in the event of failure of the products. Youshould consult your sales representative beforehand when you consider using the products for suchcritical applications. In addition, you should not use the products in weapon or military equipmentSony disclaims and does not assume any liability and damages arising out of misuse improper usemodification, use of the Products for the above-mentioned critical applications, weapon and militaryequipment, or any deviation from the requirements set forth in this specifications booklesign for SafetySony is making continuous efforts to further improve the quality and reliability of the products howeverfailure of a certain percentage of the products is inevitable. Therefore, you should take sufficient careto ensure the sate design of your products such as component redundancy, anti-contlagration featuresand features to prevent mIs-operation in order to avoid accidents resulting in injury or death fire orother social damage as a result of such failureExport ControlIf the Products are controlled items under the export control laws or regulations of various countriesapproval may be required for the export of the products under the said laws or regulationsYou should be responsible for compliance with the said laws or regulationsNo License Impliedo The technical information shown in this specifications book is for your reference purposes only. theavailability of this specifications book shall not be construed as giving any indication that sony and itscensors will license any intellectual property rights in such information by any implication or otherwiseSony will not assume responsibility for any problems in connection with your use of such information orfor any infringement of third-party rights due to the same. It is therefore your sole legal and financialresponsibility to resolve any such problems and infringementGoverning lawThis notice shall be governed by and construed in accordance with the laws of Japan, without referenceto principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relatingto this Notice shall be submitted to the exclusive jurisdiction of the Tokyo district Court in Japan as thecourt of first instanceOther Applicable Terms and ConditionsThe terms and conditions in the Sony additional specifications, which will be made available to you whenyou order the Products, shall also be applicable to your use of the Products as well as to thisspecifications book. You should review those terms and conditions when you consider purchasingand/or using the ProductsGeneral-0.0. 8SONYIMX274LQC-CContentsDescription---FeaturesDevice structureOptical Black Array and Readout Scan Direction---Absolute Maximum Ratings2233Recommended Operating Conditions---------------USE RESTRICTION NOTICEContentsOptical CePin Configuration------------------Pin description-------------------------458899hen using csl-2When using Sub-LVDS1210 Equivalent Circuit Diagram15Peripheral Circuit19System OutlineWhen using CSl-2When using Sub-LVDSElectrical Characteristics when using cs1-2--------------------------m---------------------------------21. DC Characteristics(CS1-2)a.8..4Current Consumption and Gain Variable Range(CSl-2Supply Voltage and l/O Voltage(CS1-2)2. AC Characteristics(CS1-222INCK, XCLR(CSl-2)22XHS, XVS(Output)(CSI-2)22IC Communication (CSI-2)23DMCKP/DMCKN, DMO(CSl-2Electrical Characteristics When Using Sub-LVDs-------------------m--------------------------1. DC Characteristics(Sub-LVDs)……Current Consumption and gain Variable Range sub-LVDS24Supply Voltage and l/o Voltage(Sub-LVDSLVDS Output DC Characteristics(Sub-LVDS2. AC Characteristics ( Sub-LVDS).........25INCK, XCLR, XVS(input), XHS (input)(Sub-LVDS25Serial Communication(Sub-LVDS)Sub-LVDS Output(Sub-LVDS)26Spectral Sensitivity Characteristics(CS1-2 and Sub-LVDS27Image Sensor Characteristics(CSl-2 and Sub-LVDS)-281. Zone Definition of Image Sensor Characteristics28mage Sensor Characteristics Measurement Method(CSl-2 and Sub-LVDS)1. Measurement conditions2. Color Coding of this Image Sensor and Readout..293. Definition of Standard Imaging Conditions29Setting Registers Using I"C Communication(When Using CSl-2Description of Setting Registers When Using I C communication31Pin Connection of Serial Communication Operation Specifications When Using I"C CommunicationRegister Communication Timing When Using I-C Communication12C Communication Protocol32Register Write and Read33Single Read from Random Location33Single read from current location; iidaiaii:;aaaa“Sequential Read Starting from Random LocationSequential Read Starting from Current Location34Single Write to Random Location35Sequential Write Starting from Random Location35Register Value Reflection Timing to Output Data(CSl-2)36SONYIMX274LQC-CSetting Registers Using Serial Communication (When Using Sub-LVDS)----------------37Setting Registers Using Serial Communication(Sub-LVDS).37Register Value Reflection Timing to Output Data( Sub-LVDS38Register Map…391. Description of Register2. Register Setting for Each Readout Drive Modeeadout Drive Modes( csl-2 and Sub-LVDS)---------------------551. Readout drive modes552. Relationship between Arithmetic Processing and the Number of Output bits in Each Readout Drive ModeImage Data Output Format When Using CSI-2--------------------------58Frame Format (CSI-2)58Frame Structure(CSl-258Embedded Data Line(CSl-2)59CSl-2 serial Output Setting(CSl-2)MIPI Transmitter(CSl-2)62Detailed Specification of Each Mode(CSl-2)---------------631. Horizontal/ Vertical Operation Period in Each Readout Drive Mode(CSl-22. Frame Rate Adjustment(CSl-23. Image Data Output Format CSl-265Vertical Arbitrary Cropping Function(CSl-2)-69Horizontal Arbitrary Cropping Function(CSl-272Electronic Shutter Timing When Using CSI-2------741. SHR, SVR, SMD Setting When Using CSl-2741-1. SHR, SVR Setting(CSl-2)741-2. Electronic Shutter Drive Mode(Csl-2)752. Integration Time in Each Readout Drive Mode and Mode Changes When Using CSl-2762-1. Integration Time in Each Readout Drive Mode(CSl-2762-2. Operation when Changing the Readout Drive Mode(CSl-2772-3. Low Power Consumption Drive in Integration Time When Using Roll ing Shutter Operation(CSl-2)78Image Data Output Format When Using Sub-LVDS--791. Sync Signals and Data Output Timing(Sub-LVDS)““792. Output Range of LVDS Output Data(Sub-LVDS)Detailed Specification of Each Mode(Sub-LVDS)删mHorizontal/Vertical Operation Period in Each Readout Drive Mode(sub-LVDs)..........2. Frame Rate Adjus咖ment(Sub-LVDS)……3. Image Data Output Format ( Sub-LVDS)Vertical Arbitrary Cropping(Sub-LVDS)Horizontal arbitrary cropping function(Sub-LVDS)----m94Electronic Shutter Timing When Using Sub-LVDS961. SHR, SVR Setting(Sub-LVDS)...962. SVR Operation (Sub-LVDS3. Electronic Shutter Drive Mode( Sub-LVDS)974. Integration Time in Each Readout Drive Mode and mode changes When Using Sub-LVDS984-1. Integration Time in Each Readout Drive Mode(Sub-LVDS984-2. Operation when Changing the Readout Drive Mode(Sub-LVDS994-3. Recommended Global Reset Shutter Operation Sequence(Sub-LVDS)1004-4. Interruptive Mode Change(Sub-LVDS4-5. Low Power Consumption Drive in Exposure Time (Sub-LVDS)…102Power-on/off Sequence when using CSI-2---1031. Power-on Sequence(CS2)……1032. Slew Rate Limitation of Power-on Sequence( CSI-21033. Power-off Sequence(CSl-2104Standby cancel sequence when using csl-2--------------------------105Power-on/off Sequence when using Sub-LVDS1161. Power-on Sequence(Sub-LVDS)1062. Slew Rate Limitation of Power-on Sequence(Sub-LVDS).........1063. Power-off Sequence(Sub-LVDS)107Standby Cancel Sequence(Sub-LVDs)------------108SONYIMX274LQC-CSpot Pixel specifications--109Spot Pixel Zone Definition109Notice on White Pixels SpecificationsMeasurement Method for Spot Pixels1111. Black or white pixels at high light1112. White pixels in the dark.3. Black pixels at signal saturated111Spot Pixel Pattern Specifications----------------m---------------------------------------------------112Stain Specifications---113Stain Zone definition113Stain Measurement method.113Relation between Image height and target Cra-----Marking---------mm---------------115Notes on Handling116Package outline ---118List of Trademark Logos and Definition Statements-------------119SONYIMX274LQC-COptical Center(Top View)Package outline10.70±0.1mmPKG lpinM1A1Optical centerM1010See page TBD Package Outl ine" for detailsOptical CenterPin ConfigurationBottom View)lpin index6666δ画δ尚画○●Bottom viewQ§③¤¤意○○○○○○○○10○o⑦A b CE F GMPin configurationSONYIMX274LQC-CPin DescriptionWhen using CS1-2Pin descriptionState inSymbolOADRemarks(CS|-2Standby modeLeave openA2TEST4ATest(No connectionA3VDDHDa Power a Analog power supply (2.8V)A4VDD SUB PowerAnalog power supply(2.8VA5VDDLSC1PowerD Digital power supply(1.2v)A6VssLSC1GNDDDigital GND(1.2V)A7VDDLPL3 Power D Digital power supply (1.2 V)A8VDDLIFowerDigital power supply(1.2v)Leave openB1TEST5ATest(No connectionB2ssHDA GND A Analog GND (2.8V)B3BIASRESResister connectionB4/BGRCapacitor connectionB5GNDD Digital GND (1B6XCLRReset pulse inputB7VssLPL3GNDDigital GND (1.2VB8 VsSLIF1 GND D Digital GND (1.2V)B9DMO4NDigital MiPl outputLow LevelData lane 4connectionB10DMO4P。DDigital MIPl outputLow LevelData lane 4connectionC1TESt3TestLeave open(No connectionC2XCECannect to 1.8 V power supplyLeave openC3TEST1D(No connectionC4TEST2estLeave open(No connectionC5VDDLPAPowerDDigital power supply(1.2v)C6 VDDLPL2 Power D Digital power supply (1.2V)C7 VssLPL2 GND D Digital GND(1.2V)c9DMO2NDigital MIPl outputLow LevelData lane 2connectionData lane 2C10DMO2PDigital MIPl outputLow LevelconnectionD1XHSDDDDHorizontal sync signal outputIf unused xHsleave openD2SDOlest outputLow Leve/ Leave openNo connectionVertical sync signal outpuf unusedⅩVSDleave openD9DMCKND Digital MIPl outputLow LevelClock laneconnectionD10DMCKPDigital MIPl outputLow levelClock LaneconnectionE1SCLDDDc communication clock inputC communication dataE2SDAOinput/outputSONYIMX274LQC-CPinPin descriptionSymbolADState inRemarksNoCS-2Stand by modeE3VSSLCBGNDDigital GND(1.2 V)E8VssLlF2GNDDigital GND(1.2 V)E9DMO1NE10DMO1POFVDDLSC2 PowerF2VssLSC3 PowerDDDDDDADData lane 1Digital MIPl outputLow LevelconnectionData lane 1Digital MIPI outputLow LevelconnectionDigital power supply (1.2 V)Digital power supply (1.2 v)F3VopHCMPowerAnalog power supply(2.8 V)F8INCKInput clockDMO3NDigital MIPl outputData lane 3Low LevelconnectionF10 DMO3PData lane 3Digital MIPI outputLow LevelconnectionG3VssHCPGNDAAnalog GND (2.8V)G8VssLSC2 GND D Digital GND(1.2V)G9VssMIF2 GNDD Digital GND (1.8VG10VoDMIFPowerDDigital power supply (1.8V)H1VDDLCN GND D Digital GND(1.2V)VsSLCNGNDDigital GND (1.2 VH3VopHCPPowerAnalog power supply(2.8VDLO2P( Pin for Sub-LVDS)Leave open(No connectionH9DLO2M000(Pin for Sub-LVDS)Leave open(No connectiH10DLOOP(Pin for Sub-LVDS)Leave open(No connection)VssHPX3 GND AAnalog GND(2.8 V)J3VoDHPXPowerDLO3PADDDAADDAnalog power supply(2.8 V)(Pin for Sub-LVDS)Leave open(No connectionDLO3MO00(Pin for Sub-LVDS)Leave open(No connection)J10DLOOMD(Pin for Sub-LVDS)eave open(No connection)K2VssLPL 1GNDDDigital GND(1.2V)K3 VDDLPL1 Power D Digital power supply(1.2V)K4VoDMIO Power D Digital power supply(1.8V)K5DLO1M(Pin for Sub-LVDS)Leave open(No connectionDLCKM0b「(Pin for Sub-LVDS)Leave open(No connection)Leave openK7DLCKPD(Pin for Sub-LVDS(No connectionLeave openK8DLO9PD(Pin for Sub-LVDS)(No connectionLeave openK9DLO9M(Pin for Sub-LVDS)(No connectionK10DLO5P(Pin for Sub-LVDS)Leave openNo connection
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