CMW500的资料不多,这是非常不错的参考资料R&s CMW 500Contents overviewContents overview1 Preparing the Instrument for Use2 Getting Started3 System Overview4 Basic Instrument functions5 Remote Control6 System Command Reference7 General Purpose RF Applications8 GSM Applications9 WCDMA Applications10 WiMAX Applications11 AnnexesNote about Faceless InstrumentsChapter 1 of this manual gives an overview of the front panel controls and connectorsof the R&s CMW 500 Wideband Radio Communication Testers with display and givesall information that is necessary to put the instrument into operation and connectexternal devices. The application examples in Chapter 2 and the following chapters arealso based on a r&S CMW 500 with displayThe measurement functionality of the two instrument types is identical. You can test allmeasurement examples reported in this manual using an r&S CMW 500 withoutdisplay that is controlled from the Graphical User Interface displayed on an externalmonitor or pcFor specific information concerning faceless instruments refer to your quick start guide.Operating Manual 1202. 3986.32-03R&s CMW 500ContentsContents1 Preparing for Use…日日画1.1 Front Panel Tour1.1.1 Utility Keys…1.1.2 Status LEDs and Standby Key1.1.3 Display…1.1.4 Softkeys and Hotkeys1.1.5 Setup Keys1.1.6 Data Entry Keys223334561.1.7 Rotary Knob and Navigation Keys1.1.8 Front panel connectors1.1.8. 1 RF Connectors1.1.8.2 LAN Connector1.183 SENSOR Connector1.184 USB Connectors1.1.8.5 AF Connectors888881.2 Rear panel tour:::::B:1.3 Putting the Instrument into Operation1.3.1 Unpacking the instrument and checking the shipment1.3.2 Instrument Setup...............001.3.3 Bench Top Operation1.3.4 Mounting in a 19 Rack121.3.5 EMI Protective measures131.3.6 Connecting the Instrument to the AC Supply131.3.7 Power on and off…131.3.8 Replacing Fuses141.3.9 Standby and ready state141.4 Maintenance15Operating manual 1202.3986.32-03R&s CMW 500Contents1.4.1 Storing and Packing151.5 Connecting External Accessories…………,…,…,…,…,…,…,………,……….151.5.1 Connecting a mouse161.5.2 Connecting a Keyboard161.5.3 Connecting a Printer1.5. 4 Connecting a monitor1.5.5 Connecting a LAN Cable788916 Starting the R&scMW500 and Shutting D。wn…,.....,.,…,,,191.7 Remote Operation in a LAN...........-.201.7.1 Assigning an IP Address201.7.2 Remote Desktop Connection221.8 Windows xP国国国面1.9 Firmware Update…,,…,,,,,,,,,",…,…222 Getting Started,…,…,…252.1 Basic tasks.…252.1.1 Accessing Dialogs252.1.2 Using Keyboard Shortcuts272.1.3 Data entr272.14 Using Front Panel Keys.……282.1.5 Using an External Keyboard2.1.6 Task bar302.2 Sample Session…312.2.1 Generating an rf signal312.2.1.1 GPRF Generator2.2.2 Measuring an RF Signal332.2.2.1 GPRE Power333 System Overview…363.1 Generators363.1.1 Generator Control363.1.2 RF Path Settings(Generators)37Operating manual 1202.3986.32-03R&s CMW 500Contents3.2 Measurements383.2.1 Measurement control383.2.2 Connection Control(Measurements393.2.3 Statistical Settings3. 2. 4 Statistical Results3.2.4.1 Statistics Type423.2.4.2 Detectors433.2.4.3Peak∨ alues.433244 Averaging…443.245 Standard deviation143.2.5 Trigger Settings453.2.6 TX Measurements453.2.6.1 Power results463.2.6.2 Modulation accuracy3.2.6.3 Adjacent Channel Power(Spectrum)493.2.6.4 Spectrum Emission Mask493.2. 6.5 Code domain power503.2.6.6 Multi-Evaluation measurements4 Basic Instrument Functions534.1.1 Startup Dialog534.2 Utility Dialogs544.2.1 Reset Dialog..4.2.2 Print Dialog554.2.3 Save/Recall Dialog564.3 Setup Dialog…,,,,…574.3.1 Activating Options584.3.2 Selftests…594.3.2.1 General test features604.3.2.2 Board Tests614.3.23 System Tests…62Operating Manual 1202.3986.32-03R&s CMW 500Contents4.3.2.4 Performing Selftests24.3.25 Selftest Parameters634.3.3 Reference Frequency654.3.3.1 Reference Frequency Settings654.3.4 Measurement Controller Dialog664.3.5 Generator Controller Dialog665 Remote Control685.1 Remote Control Operation685.1.1 Establishing and Testing a LAN Connection705.1.2 Switchover to remote control5.1.3 Return to Manual Operation715.2 Messages国国国面…725.2.1 VXI-11 Interface Messages725.2.2 GPIB Bus Interface Messages..725.2.3 Device Messages(Commands and Device Responses)735.2. 4 SCPl Command structure and syntax735.2.4.1 Common commands745.2.4.2 Instrument-Control Commands5.2.4,3 Structure of a command line765.2.4.4 Responses to Queries5.2.45 SCPI Parameters,775.2.4.6 Use of SCPl Subsystems95.3 R&s CMW Software and command structure5.3.1 General command structure5.3.2 Firmware applications815.3.3 Measurement Contexts and views5.4 Control of the instrument825.4.1 Measurement Control825.4.1.1 Measurement states and measurement control commands835.4.1.2 INITiate: : MEASurement84Operating manual 1202.3986.32-03R&s CMW 500Contents5.4.1.3 ABORt: MEASurement 8554.14sTOP:< Application> MEASurement>.,……855.4.1.5 Measurement substates855.4.2 Statistical Settings865.4.3 Retrieving Measurement Results885.4,3. FEtCh.? Command885.4.3.2 READ.? Command∴8954.33 Retrieving Single∨ alues and traces.…5.4.4 Reliability Indicator5.4.4.1 Common Reliability Indicator……5.4.5 Multi-Evaluation Measurements5.4.6 Generator control925. 4.7 RF Path Settings945.4.8 Resource and path Management∴945.4.8. 1 Basic RPM Principles5.4.8.2 Queuing of Measurements∴9654.83 Causes for task Conflicts5.4.8.4 Monitoring Measurement and Generator States995.5 Command Processing...:::::B:995.5.1 Input Unit1005.5.2 Command Recognition1005.5.3 Data base and instrument hardware1015.5.4 Status Reporting System1015.5.5 Output Un1025.6 Status Reporting System1025.6.1 Overview of status Registers1035.6.2 Structure of an SCPl Status Register…1035.6.2.1 Description of the five status register parts1045.6.3 Contents of the Status Registers1055.6.3.1 STB and sre.105Operating manual 1202.3986.32-03R&s CMW 500Contents5.6.3.2 IST Flag and pPe.1065.6. 3.3 EsR and ese∴1075.6.3 4 STATus: OPERation1085.6.3.5 STATus QUEStionable1085.6.4 Application of the status reporting s ystem1085.6.4.1 Service Request1085.6.4.2 Serial poll1095.6.4.3 Parallel poll1095.6.4.4 Query of an Instrument Status1105.64.5 Error queue.….115.6.5 Reset Values of the Status Reporting System1116 Command reference∴∴11361 Special Terms and Notation…,…………,…,…,………,…,…,,…,………………1136.2 Common commands1156.3 Instrument-Control commands.117631 MMEMory Commands…..,,,…,,……1176.3.2 Ref Frequency Commands1206.3.3 STATus Commands1216.3.4 SYSTem Commands1256.3.5 LAN Services1256.3.6 Miscellaneous Instrument Settings1286. 4 Alphabetical List of Commands System)1317 GPRF Applications1337.1 GPRF Measurements and generators1337.1.1 General Purpose RF Generato.1337.1.1.1 GPRF Generator(Constant Frequency)1337.1.1.2 Arbitrary RF Generator(Option R&S CMW-B110 A)1347.1.13 List Mode∴1357.1.2 Power measurement1357.1.2.1 Test Setup…135Operating manual 1202.3986.32-03
imx274 datesheet,可以对接Hi3519V101,4K,分享一下SONYIMX274LQC-CAbsolute Maximum RatingsItemSymbolRatingsUnitSupply voltage(Analog)1ADD0.3to+3.3VSupply voltage(Digital 1)-0.5to+2.0Supply voltage(Digital 2)DDD20.5to+3.3VInput voltage(Digital)0.3toV。Dp+0.3VOutput voltage(Digital)-0.3toVD2+0.3Guaranteed operating temperature TOPR-30to+75°CStorage guarantee temperatureTSTG30to+80CPerformance guarantee temperature TsPEC10to+60Recommended Operating ConditionsItemSymbolRatingSupply voltage(Analog)VADD2.8±0.1Supply voltage(Digital 1)1.2±0.1VSupply voltage(Digital 2)1.8±0.1Input voltage(Digital)-0.1 to Vopp2+0.11 VADD: VDDSUB, VoDHCM, VoDHPX, VDDHDA, VDDHCP (2.8V power supplyVDDD1: VDDLCN, VDDLSC1 to 2, VDDLPA, VDDLPL1, VoDLPL2 to 3. VDDLIF (1.2V power supply)VDDD2: VDDMIO, VDDMIF (1.8V power supply)SONYIMX274LQC-CUSE RESTRICTION NOTICEThis USE RESTRIC TION NOTICE (Notice )is for customers who are considering or currently using theimage sensor products("Products")set forth in this specifications book. Sony Corporation Sony")mayat any time, modify this Notice which will be available to you in the latest specifications book for theProducts. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has itsown use restriction notice on the Products, such a use restriction notice will additionally apply betweerou and the subsidiary or distributor. You should consult a sales representative of the subsidiary ordistributor of sony on such a use restriction notice when you consider using the ProductsUse restrictionsThe Products are intended for incorporation into such general electronic equipment as office productscommunication products, measurement products, and home electronics products in accordance withthe terms and conditions set forth in this specifications book and otherwise notified by sony from timeYou should not use the Products for critical applications which may pose a life-or injury-threateningrisk or are highly likely to cause significant property damage in the event of failure of the products. Youshould consult your sales representative beforehand when you consider using the products for suchcritical applications. In addition, you should not use the products in weapon or military equipmentSony disclaims and does not assume any liability and damages arising out of misuse improper usemodification, use of the Products for the above-mentioned critical applications, weapon and militaryequipment, or any deviation from the requirements set forth in this specifications booklesign for SafetySony is making continuous efforts to further improve the quality and reliability of the products howeverfailure of a certain percentage of the products is inevitable. Therefore, you should take sufficient careto ensure the sate design of your products such as component redundancy, anti-contlagration featuresand features to prevent mIs-operation in order to avoid accidents resulting in injury or death fire orother social damage as a result of such failureExport ControlIf the Products are controlled items under the export control laws or regulations of various countriesapproval may be required for the export of the products under the said laws or regulationsYou should be responsible for compliance with the said laws or regulationsNo License Impliedo The technical information shown in this specifications book is for your reference purposes only. theavailability of this specifications book shall not be construed as giving any indication that sony and itscensors will license any intellectual property rights in such information by any implication or otherwiseSony will not assume responsibility for any problems in connection with your use of such information orfor any infringement of third-party rights due to the same. It is therefore your sole legal and financialresponsibility to resolve any such problems and infringementGoverning lawThis notice shall be governed by and construed in accordance with the laws of Japan, without referenceto principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relatingto this Notice shall be submitted to the exclusive jurisdiction of the Tokyo district Court in Japan as thecourt of first instanceOther Applicable Terms and ConditionsThe terms and conditions in the Sony additional specifications, which will be made available to you whenyou order the Products, shall also be applicable to your use of the Products as well as to thisspecifications book. You should review those terms and conditions when you consider purchasingand/or using the ProductsGeneral-0.0. 8SONYIMX274LQC-CContentsDescription---FeaturesDevice structureOptical Black Array and Readout Scan Direction---Absolute Maximum Ratings2233Recommended Operating Conditions---------------USE RESTRICTION NOTICEContentsOptical CePin Configuration------------------Pin description-------------------------458899hen using csl-2When using Sub-LVDS1210 Equivalent Circuit Diagram15Peripheral Circuit19System OutlineWhen using CSl-2When using Sub-LVDSElectrical Characteristics when using cs1-2--------------------------m---------------------------------21. DC Characteristics(CS1-2)a.8..4Current Consumption and Gain Variable Range(CSl-2Supply Voltage and l/O Voltage(CS1-2)2. AC Characteristics(CS1-222INCK, XCLR(CSl-2)22XHS, XVS(Output)(CSI-2)22IC Communication (CSI-2)23DMCKP/DMCKN, DMO(CSl-2Electrical Characteristics When Using Sub-LVDs-------------------m--------------------------1. DC Characteristics(Sub-LVDs)……Current Consumption and gain Variable Range sub-LVDS24Supply Voltage and l/o Voltage(Sub-LVDSLVDS Output DC Characteristics(Sub-LVDS2. AC Characteristics ( Sub-LVDS).........25INCK, XCLR, XVS(input), XHS (input)(Sub-LVDS25Serial Communication(Sub-LVDS)Sub-LVDS Output(Sub-LVDS)26Spectral Sensitivity Characteristics(CS1-2 and Sub-LVDS27Image Sensor Characteristics(CSl-2 and Sub-LVDS)-281. Zone Definition of Image Sensor Characteristics28mage Sensor Characteristics Measurement Method(CSl-2 and Sub-LVDS)1. Measurement conditions2. Color Coding of this Image Sensor and Readout..293. Definition of Standard Imaging Conditions29Setting Registers Using I"C Communication(When Using CSl-2Description of Setting Registers When Using I C communication31Pin Connection of Serial Communication Operation Specifications When Using I"C CommunicationRegister Communication Timing When Using I-C Communication12C Communication Protocol32Register Write and Read33Single Read from Random Location33Single read from current location; iidaiaii:;aaaa“Sequential Read Starting from Random LocationSequential Read Starting from Current Location34Single Write to Random Location35Sequential Write Starting from Random Location35Register Value Reflection Timing to Output Data(CSl-2)36SONYIMX274LQC-CSetting Registers Using Serial Communication (When Using Sub-LVDS)----------------37Setting Registers Using Serial Communication(Sub-LVDS).37Register Value Reflection Timing to Output Data( Sub-LVDS38Register Map…391. Description of Register2. Register Setting for Each Readout Drive Modeeadout Drive Modes( csl-2 and Sub-LVDS)---------------------551. Readout drive modes552. Relationship between Arithmetic Processing and the Number of Output bits in Each Readout Drive ModeImage Data Output Format When Using CSI-2--------------------------58Frame Format (CSI-2)58Frame Structure(CSl-258Embedded Data Line(CSl-2)59CSl-2 serial Output Setting(CSl-2)MIPI Transmitter(CSl-2)62Detailed Specification of Each Mode(CSl-2)---------------631. Horizontal/ Vertical Operation Period in Each Readout Drive Mode(CSl-22. Frame Rate Adjustment(CSl-23. Image Data Output Format CSl-265Vertical Arbitrary Cropping Function(CSl-2)-69Horizontal Arbitrary Cropping Function(CSl-272Electronic Shutter Timing When Using CSI-2------741. SHR, SVR, SMD Setting When Using CSl-2741-1. SHR, SVR Setting(CSl-2)741-2. Electronic Shutter Drive Mode(Csl-2)752. Integration Time in Each Readout Drive Mode and Mode Changes When Using CSl-2762-1. Integration Time in Each Readout Drive Mode(CSl-2762-2. Operation when Changing the Readout Drive Mode(CSl-2772-3. Low Power Consumption Drive in Integration Time When Using Roll ing Shutter Operation(CSl-2)78Image Data Output Format When Using Sub-LVDS--791. Sync Signals and Data Output Timing(Sub-LVDS)““792. Output Range of LVDS Output Data(Sub-LVDS)Detailed Specification of Each Mode(Sub-LVDS)删mHorizontal/Vertical Operation Period in Each Readout Drive Mode(sub-LVDs)..........2. Frame Rate Adjus咖ment(Sub-LVDS)……3. Image Data Output Format ( Sub-LVDS)Vertical Arbitrary Cropping(Sub-LVDS)Horizontal arbitrary cropping function(Sub-LVDS)----m94Electronic Shutter Timing When Using Sub-LVDS961. SHR, SVR Setting(Sub-LVDS)...962. SVR Operation (Sub-LVDS3. Electronic Shutter Drive Mode( Sub-LVDS)974. Integration Time in Each Readout Drive Mode and mode changes When Using Sub-LVDS984-1. Integration Time in Each Readout Drive Mode(Sub-LVDS984-2. Operation when Changing the Readout Drive Mode(Sub-LVDS994-3. Recommended Global Reset Shutter Operation Sequence(Sub-LVDS)1004-4. Interruptive Mode Change(Sub-LVDS4-5. Low Power Consumption Drive in Exposure Time (Sub-LVDS)…102Power-on/off Sequence when using CSI-2---1031. Power-on Sequence(CS2)……1032. Slew Rate Limitation of Power-on Sequence( CSI-21033. Power-off Sequence(CSl-2104Standby cancel sequence when using csl-2--------------------------105Power-on/off Sequence when using Sub-LVDS1161. Power-on Sequence(Sub-LVDS)1062. Slew Rate Limitation of Power-on Sequence(Sub-LVDS).........1063. Power-off Sequence(Sub-LVDS)107Standby Cancel Sequence(Sub-LVDs)------------108SONYIMX274LQC-CSpot Pixel specifications--109Spot Pixel Zone Definition109Notice on White Pixels SpecificationsMeasurement Method for Spot Pixels1111. Black or white pixels at high light1112. White pixels in the dark.3. Black pixels at signal saturated111Spot Pixel Pattern Specifications----------------m---------------------------------------------------112Stain Specifications---113Stain Zone definition113Stain Measurement method.113Relation between Image height and target Cra-----Marking---------mm---------------115Notes on Handling116Package outline ---118List of Trademark Logos and Definition Statements-------------119SONYIMX274LQC-COptical Center(Top View)Package outline10.70±0.1mmPKG lpinM1A1Optical centerM1010See page TBD Package Outl ine" for detailsOptical CenterPin ConfigurationBottom View)lpin index6666δ画δ尚画○●Bottom viewQ§③¤¤意○○○○○○○○10○o⑦A b CE F GMPin configurationSONYIMX274LQC-CPin DescriptionWhen using CS1-2Pin descriptionState inSymbolOADRemarks(CS|-2Standby modeLeave openA2TEST4ATest(No connectionA3VDDHDa Power a Analog power supply (2.8V)A4VDD SUB PowerAnalog power supply(2.8VA5VDDLSC1PowerD Digital power supply(1.2v)A6VssLSC1GNDDDigital GND(1.2V)A7VDDLPL3 Power D Digital power supply (1.2 V)A8VDDLIFowerDigital power supply(1.2v)Leave openB1TEST5ATest(No connectionB2ssHDA GND A Analog GND (2.8V)B3BIASRESResister connectionB4/BGRCapacitor connectionB5GNDD Digital GND (1B6XCLRReset pulse inputB7VssLPL3GNDDigital GND (1.2VB8 VsSLIF1 GND D Digital GND (1.2V)B9DMO4NDigital MiPl outputLow LevelData lane 4connectionB10DMO4P。DDigital MIPl outputLow LevelData lane 4connectionC1TESt3TestLeave open(No connectionC2XCECannect to 1.8 V power supplyLeave openC3TEST1D(No connectionC4TEST2estLeave open(No connectionC5VDDLPAPowerDDigital power supply(1.2v)C6 VDDLPL2 Power D Digital power supply (1.2V)C7 VssLPL2 GND D Digital GND(1.2V)c9DMO2NDigital MIPl outputLow LevelData lane 2connectionData lane 2C10DMO2PDigital MIPl outputLow LevelconnectionD1XHSDDDDHorizontal sync signal outputIf unused xHsleave openD2SDOlest outputLow Leve/ Leave openNo connectionVertical sync signal outpuf unusedⅩVSDleave openD9DMCKND Digital MIPl outputLow LevelClock laneconnectionD10DMCKPDigital MIPl outputLow levelClock LaneconnectionE1SCLDDDc communication clock inputC communication dataE2SDAOinput/outputSONYIMX274LQC-CPinPin descriptionSymbolADState inRemarksNoCS-2Stand by modeE3VSSLCBGNDDigital GND(1.2 V)E8VssLlF2GNDDigital GND(1.2 V)E9DMO1NE10DMO1POFVDDLSC2 PowerF2VssLSC3 PowerDDDDDDADData lane 1Digital MIPl outputLow LevelconnectionData lane 1Digital MIPI outputLow LevelconnectionDigital power supply (1.2 V)Digital power supply (1.2 v)F3VopHCMPowerAnalog power supply(2.8 V)F8INCKInput clockDMO3NDigital MIPl outputData lane 3Low LevelconnectionF10 DMO3PData lane 3Digital MIPI outputLow LevelconnectionG3VssHCPGNDAAnalog GND (2.8V)G8VssLSC2 GND D Digital GND(1.2V)G9VssMIF2 GNDD Digital GND (1.8VG10VoDMIFPowerDDigital power supply (1.8V)H1VDDLCN GND D Digital GND(1.2V)VsSLCNGNDDigital GND (1.2 VH3VopHCPPowerAnalog power supply(2.8VDLO2P( Pin for Sub-LVDS)Leave open(No connectionH9DLO2M000(Pin for Sub-LVDS)Leave open(No connectiH10DLOOP(Pin for Sub-LVDS)Leave open(No connection)VssHPX3 GND AAnalog GND(2.8 V)J3VoDHPXPowerDLO3PADDDAADDAnalog power supply(2.8 V)(Pin for Sub-LVDS)Leave open(No connectionDLO3MO00(Pin for Sub-LVDS)Leave open(No connection)J10DLOOMD(Pin for Sub-LVDS)eave open(No connection)K2VssLPL 1GNDDDigital GND(1.2V)K3 VDDLPL1 Power D Digital power supply(1.2V)K4VoDMIO Power D Digital power supply(1.8V)K5DLO1M(Pin for Sub-LVDS)Leave open(No connectionDLCKM0b「(Pin for Sub-LVDS)Leave open(No connection)Leave openK7DLCKPD(Pin for Sub-LVDS(No connectionLeave openK8DLO9PD(Pin for Sub-LVDS)(No connectionLeave openK9DLO9M(Pin for Sub-LVDS)(No connectionK10DLO5P(Pin for Sub-LVDS)Leave openNo connection