索尼 imx274 datesheet
imx274 datesheet，可以对接Hi3519V101，4K，分享一下SONYIMX274LQC-CAbsolute Maximum RatingsItemSymbolRatingsUnitSupply voltage(Analog)1ADD0.3to+3.3VSupply voltage(Digital 1)-0.5to+2.0Supply voltage(Digital 2)DDD20.5to+3.3VInput voltage(Digital)0.3toV。Dp+0.3VOutput voltage(Digital)-0.3toVD2+0.3Guaranteed operating temperature TOPR-30to+75°CStorage guarantee temperatureTSTG30to+80CPerformance guarantee temperature TsPEC10to+60Recommended Operating ConditionsItemSymbolRatingSupply voltage(Analog)VADD2.8±0.1Supply voltage(Digital 1)1.2±0.1VSupply voltage(Digital 2)1.8±0.1Input voltage(Digital)-0.1 to Vopp2+0.11 VADD: VDDSUB, VoDHCM, VoDHPX, VDDHDA, VDDHCP (2.8V power supplyVDDD1: VDDLCN, VDDLSC1 to 2, VDDLPA, VDDLPL1, VoDLPL2 to 3. VDDLIF (1.2V power supply)VDDD2: VDDMIO, VDDMIF (1.8V power supply)SONYIMX274LQC-CUSE RESTRICTION NOTICEThis USE RESTRIC TION NOTICE (Notice )is for customers who are considering or currently using theimage sensor products("Products")set forth in this specifications book. Sony Corporation Sony")mayat any time, modify this Notice which will be available to you in the latest specifications book for theProducts. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has itsown use restriction notice on the Products, such a use restriction notice will additionally apply betweerou and the subsidiary or distributor. You should consult a sales representative of the subsidiary ordistributor of sony on such a use restriction notice when you consider using the ProductsUse restrictionsThe Products are intended for incorporation into such general electronic equipment as office productscommunication products, measurement products, and home electronics products in accordance withthe terms and conditions set forth in this specifications book and otherwise notified by sony from timeYou should not use the Products for critical applications which may pose a life-or injury-threateningrisk or are highly likely to cause significant property damage in the event of failure of the products. Youshould consult your sales representative beforehand when you consider using the products for suchcritical applications. In addition, you should not use the products in weapon or military equipmentSony disclaims and does not assume any liability and damages arising out of misuse improper usemodification, use of the Products for the above-mentioned critical applications, weapon and militaryequipment, or any deviation from the requirements set forth in this specifications booklesign for SafetySony is making continuous efforts to further improve the quality and reliability of the products howeverfailure of a certain percentage of the products is inevitable. Therefore, you should take sufficient careto ensure the sate design of your products such as component redundancy, anti-contlagration featuresand features to prevent mIs-operation in order to avoid accidents resulting in injury or death fire orother social damage as a result of such failureExport ControlIf the Products are controlled items under the export control laws or regulations of various countriesapproval may be required for the export of the products under the said laws or regulationsYou should be responsible for compliance with the said laws or regulationsNo License Impliedo The technical information shown in this specifications book is for your reference purposes only. theavailability of this specifications book shall not be construed as giving any indication that sony and itscensors will license any intellectual property rights in such information by any implication or otherwiseSony will not assume responsibility for any problems in connection with your use of such information orfor any infringement of third-party rights due to the same. It is therefore your sole legal and financialresponsibility to resolve any such problems and infringementGoverning lawThis notice shall be governed by and construed in accordance with the laws of Japan, without referenceto principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relatingto this Notice shall be submitted to the exclusive jurisdiction of the Tokyo district Court in Japan as thecourt of first instanceOther Applicable Terms and ConditionsThe terms and conditions in the Sony additional specifications, which will be made available to you whenyou order the Products, shall also be applicable to your use of the Products as well as to thisspecifications book. You should review those terms and conditions when you consider purchasingand/or using the ProductsGeneral-0.0. 8SONYIMX274LQC-CContentsDescription---FeaturesDevice structureOptical Black Array and Readout Scan Direction---Absolute Maximum Ratings2233Recommended Operating Conditions---------------USE RESTRICTION NOTICEContentsOptical CePin Configuration------------------Pin description-------------------------458899hen using csl-2When using Sub-LVDS1210 Equivalent Circuit Diagram15Peripheral Circuit19System OutlineWhen using CSl-2When using Sub-LVDSElectrical Characteristics when using cs1-2--------------------------m---------------------------------21. DC Characteristics(CS1-2)a.8..4Current Consumption and Gain Variable Range(CSl-2Supply Voltage and l/O Voltage(CS1-2)2. AC Characteristics(CS1-222INCK, XCLR(CSl-2)22XHS, XVS(Output)(CSI-2)22IC Communication (CSI-2)23DMCKP/DMCKN, DMO(CSl-2Electrical Characteristics When Using Sub-LVDs-------------------m--------------------------1. DC Characteristics(Sub-LVDs)……Current Consumption and gain Variable Range sub-LVDS24Supply Voltage and l/o Voltage(Sub-LVDSLVDS Output DC Characteristics(Sub-LVDS2. AC Characteristics ( Sub-LVDS).........25INCK, XCLR, XVS(input), XHS (input)(Sub-LVDS25Serial Communication(Sub-LVDS)Sub-LVDS Output(Sub-LVDS)26Spectral Sensitivity Characteristics(CS1-2 and Sub-LVDS27Image Sensor Characteristics(CSl-2 and Sub-LVDS)-281. Zone Definition of Image Sensor Characteristics28mage Sensor Characteristics Measurement Method(CSl-2 and Sub-LVDS)1. Measurement conditions2. Color Coding of this Image Sensor and Readout..293. Definition of Standard Imaging Conditions29Setting Registers Using I"C Communication(When Using CSl-2Description of Setting Registers When Using I C communication31Pin Connection of Serial Communication Operation Specifications When Using I"C CommunicationRegister Communication Timing When Using I-C Communication12C Communication Protocol32Register Write and Read33Single Read from Random Location33Single read from current location; iidaiaii:;aaaa“Sequential Read Starting from Random LocationSequential Read Starting from Current Location34Single Write to Random Location35Sequential Write Starting from Random Location35Register Value Reflection Timing to Output Data(CSl-2)36SONYIMX274LQC-CSetting Registers Using Serial Communication (When Using Sub-LVDS)----------------37Setting Registers Using Serial Communication(Sub-LVDS).37Register Value Reflection Timing to Output Data( Sub-LVDS38Register Map…391. Description of Register2. Register Setting for Each Readout Drive Modeeadout Drive Modes( csl-2 and Sub-LVDS)---------------------551. Readout drive modes552. Relationship between Arithmetic Processing and the Number of Output bits in Each Readout Drive ModeImage Data Output Format When Using CSI-2--------------------------58Frame Format (CSI-2)58Frame Structure(CSl-258Embedded Data Line(CSl-2)59CSl-2 serial Output Setting(CSl-2)MIPI Transmitter(CSl-2)62Detailed Specification of Each Mode(CSl-2)---------------631. Horizontal/ Vertical Operation Period in Each Readout Drive Mode(CSl-22. Frame Rate Adjustment(CSl-23. Image Data Output Format CSl-265Vertical Arbitrary Cropping Function(CSl-2)-69Horizontal Arbitrary Cropping Function(CSl-272Electronic Shutter Timing When Using CSI-2------741. SHR, SVR, SMD Setting When Using CSl-2741-1. SHR, SVR Setting(CSl-2)741-2. Electronic Shutter Drive Mode(Csl-2)752. Integration Time in Each Readout Drive Mode and Mode Changes When Using CSl-2762-1. Integration Time in Each Readout Drive Mode(CSl-2762-2. Operation when Changing the Readout Drive Mode(CSl-2772-3. Low Power Consumption Drive in Integration Time When Using Roll ing Shutter Operation(CSl-2)78Image Data Output Format When Using Sub-LVDS--791. Sync Signals and Data Output Timing(Sub-LVDS)““792. Output Range of LVDS Output Data(Sub-LVDS)Detailed Specification of Each Mode(Sub-LVDS)删mHorizontal/Vertical Operation Period in Each Readout Drive Mode(sub-LVDs)..........2. Frame Rate Adjus咖ment(Sub-LVDS)……3. Image Data Output Format ( Sub-LVDS)Vertical Arbitrary Cropping(Sub-LVDS)Horizontal arbitrary cropping function(Sub-LVDS)----m94Electronic Shutter Timing When Using Sub-LVDS961. SHR, SVR Setting(Sub-LVDS)...962. SVR Operation (Sub-LVDS3. Electronic Shutter Drive Mode( Sub-LVDS)974. Integration Time in Each Readout Drive Mode and mode changes When Using Sub-LVDS984-1. Integration Time in Each Readout Drive Mode(Sub-LVDS984-2. Operation when Changing the Readout Drive Mode(Sub-LVDS994-3. Recommended Global Reset Shutter Operation Sequence(Sub-LVDS)1004-4. Interruptive Mode Change(Sub-LVDS4-5. Low Power Consumption Drive in Exposure Time (Sub-LVDS)…102Power-on/off Sequence when using CSI-2---1031. Power-on Sequence(CS2)……1032. Slew Rate Limitation of Power-on Sequence( CSI-21033. Power-off Sequence(CSl-2104Standby cancel sequence when using csl-2--------------------------105Power-on/off Sequence when using Sub-LVDS1161. Power-on Sequence(Sub-LVDS)1062. Slew Rate Limitation of Power-on Sequence(Sub-LVDS).........1063. Power-off Sequence(Sub-LVDS)107Standby Cancel Sequence(Sub-LVDs)------------108SONYIMX274LQC-CSpot Pixel specifications--109Spot Pixel Zone Definition109Notice on White Pixels SpecificationsMeasurement Method for Spot Pixels1111. Black or white pixels at high light1112. White pixels in the dark.3. Black pixels at signal saturated111Spot Pixel Pattern Specifications----------------m---------------------------------------------------112Stain Specifications---113Stain Zone definition113Stain Measurement method.113Relation between Image height and target Cra-----Marking---------mm---------------115Notes on Handling116Package outline ---118List of Trademark Logos and Definition Statements-------------119SONYIMX274LQC-COptical Center(Top View)Package outline10.70±0.1mmPKG lpinM1A1Optical centerM1010See page TBD Package Outl ine" for detailsOptical CenterPin ConfigurationBottom View)lpin index6666δ画δ尚画○●Bottom viewQ§③¤¤意○○○○○○○○10○o⑦A b CE F GMPin configurationSONYIMX274LQC-CPin DescriptionWhen using CS1-2Pin descriptionState inSymbolOADRemarks(CS|-2Standby modeLeave openA2TEST4ATest(No connectionA3VDDHDa Power a Analog power supply (2.8V)A4VDD SUB PowerAnalog power supply(2.8VA5VDDLSC1PowerD Digital power supply(1.2v)A6VssLSC1GNDDDigital GND(1.2V)A7VDDLPL3 Power D Digital power supply (1.2 V)A8VDDLIFowerDigital power supply(1.2v)Leave openB1TEST5ATest(No connectionB2ssHDA GND A Analog GND (2.8V)B3BIASRESResister connectionB4/BGRCapacitor connectionB5GNDD Digital GND (1B6XCLRReset pulse inputB7VssLPL3GNDDigital GND (1.2VB8 VsSLIF1 GND D Digital GND (1.2V)B9DMO4NDigital MiPl outputLow LevelData lane 4connectionB10DMO4P。DDigital MIPl outputLow LevelData lane 4connectionC1TESt3TestLeave open(No connectionC2XCECannect to 1.8 V power supplyLeave openC3TEST1D(No connectionC4TEST2estLeave open(No connectionC5VDDLPAPowerDDigital power supply(1.2v)C6 VDDLPL2 Power D Digital power supply (1.2V)C7 VssLPL2 GND D Digital GND(1.2V)c9DMO2NDigital MIPl outputLow LevelData lane 2connectionData lane 2C10DMO2PDigital MIPl outputLow LevelconnectionD1XHSDDDDHorizontal sync signal outputIf unused xHsleave openD2SDOlest outputLow Leve/ Leave openNo connectionVertical sync signal outpuf unusedⅩVSDleave openD9DMCKND Digital MIPl outputLow LevelClock laneconnectionD10DMCKPDigital MIPl outputLow levelClock LaneconnectionE1SCLDDDc communication clock inputC communication dataE2SDAOinput/outputSONYIMX274LQC-CPinPin descriptionSymbolADState inRemarksNoCS-2Stand by modeE3VSSLCBGNDDigital GND(1.2 V)E8VssLlF2GNDDigital GND(1.2 V)E9DMO1NE10DMO1POFVDDLSC2 PowerF2VssLSC3 PowerDDDDDDADData lane 1Digital MIPl outputLow LevelconnectionData lane 1Digital MIPI outputLow LevelconnectionDigital power supply (1.2 V)Digital power supply (1.2 v)F3VopHCMPowerAnalog power supply(2.8 V)F8INCKInput clockDMO3NDigital MIPl outputData lane 3Low LevelconnectionF10 DMO3PData lane 3Digital MIPI outputLow LevelconnectionG3VssHCPGNDAAnalog GND (2.8V)G8VssLSC2 GND D Digital GND(1.2V)G9VssMIF2 GNDD Digital GND (1.8VG10VoDMIFPowerDDigital power supply (1.8V)H1VDDLCN GND D Digital GND(1.2V)VsSLCNGNDDigital GND (1.2 VH3VopHCPPowerAnalog power supply(2.8VDLO2P( Pin for Sub-LVDS)Leave open(No connectionH9DLO2M000(Pin for Sub-LVDS)Leave open(No connectiH10DLOOP(Pin for Sub-LVDS)Leave open(No connection)VssHPX3 GND AAnalog GND(2.8 V)J3VoDHPXPowerDLO3PADDDAADDAnalog power supply(2.8 V)(Pin for Sub-LVDS)Leave open(No connectionDLO3MO00(Pin for Sub-LVDS)Leave open(No connection)J10DLOOMD(Pin for Sub-LVDS)eave open(No connection)K2VssLPL 1GNDDDigital GND(1.2V)K3 VDDLPL1 Power D Digital power supply(1.2V)K4VoDMIO Power D Digital power supply(1.8V)K5DLO1M(Pin for Sub-LVDS)Leave open(No connectionDLCKM0b「(Pin for Sub-LVDS)Leave open(No connection)Leave openK7DLCKPD(Pin for Sub-LVDS(No connectionLeave openK8DLO9PD(Pin for Sub-LVDS)(No connectionLeave openK9DLO9M(Pin for Sub-LVDS)(No connectionK10DLO5P(Pin for Sub-LVDS)Leave openNo connection
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《Zemax激光光学设计实例应用——自学案例汇编》之<Zemax光纤输出光斑整形光源的选择问题（非序列模式）>
简介：这份材料是作者自学Zemax光学设计及在实践中应用的案例汇编，提供初学者使用软件作光学系统设计练习，整个过程需要Zemax光学系统设计软件。使用的软件版本为比较常见的2005或2009。因两个版本在某些菜单列表和窗口形式上的些许差异，读者需自行对比测试。最开始的一些例子是基于目前比较常见的教材和习作而进行的细化论述，以丰富本文内容同时对初学者入门更有帮助。作者才疏学浅，不保证该文本的科学性和有效性，其主要作用在于帮助自己对知识进行积累、回顾和追溯。文中会对各个实例的关键位置进行尽量详细的叙述，以达到尽可能全面地掌握知识的目的。本文基于理论与实践的结合，不仅描述如何设计一套光学系统，并且讨Zemax激光光学设计实例应用—自学案例汇编FN∏A TWUZ图18-43D光路结构图(混合序列模式)为了减少麻烦,用不着重新在非序列模式中编辑所有组件;我们可以将上述例子直接转换到非序列模式下。步骤为,主菜单 Tools→ MIsce1 aneous→ Convert to NsC Group,在弹出的对话框中,选择要转换的序列范围,比如,这里是从 Surface2到 Surface13,同时注意勾选 Convert file to non- sequenti al mode,确定后即可转换为非序列模式,透镜元件都在。不过,你会发现,原来已有的非序列组件不能转换过来,自动消失了。不过没关系,重新编辑缺失的组件即可。如图18-5所示,添加一个圆柱体(光纤)组件,再添加若干个探测器(方便自己观察的位置即可)BI Non-Sequential Component EditorEdit Solves Errors Detectors Database Tools ViEW Helpobject Typecomment2P351t1hMaterial Front FZ LengthBack rinder volume.050standard I erF1510.70N-5F64R.00冂.000.250standard LerF1511.820N一LAKs.50n6250Toroid a Lers surfaces00Q2.530standard Lerssurfaces45,440D.00Qtandard Lers surfaces4,3200。000standard Lers surfaces47.3z0BA/.0005,350Detector民ect116.000Detector Fect5.200200图18-5非序列光学组件列表接下米,我们米重点说一说光源的选择问题。因为光源的选择会明显影响仿真的实际效果。这里,我们需要个发散型的光源,发散角基本要和光纤的数值孔径相同,光源放在光纤前端——入射端。非序列光源组件有多种类型叫选,包括椭圆形光源 Source e1 lipse半导体光源 Source diode等等。这些可改置发散角的光源是否都满足要求呢,我们要看《 Matlab辅助激光光学分析与应用》作者出品Zemax激光光学设计实例应用—自学案例汇编看这些光源通过光纤组件之后输出一段距离光线的分布情况和聚焦的情况。我们首先选择椭圆形光源 Source e11ipse作为输入光源,放在光纤输入端。表面上看,椭圆形光源 Source e11ipse是一个面光源,可以分别设置两个半轴长度,但实际也是无穷远点光源。要设置光源的发散角,则需要改变发光源的位置,从无穷远改为有限距离。obiectcomment z Position Material*LayoutSourcepie50.020500000Power (wat.. wavenumber color# x Half wi.. Y Half wi.source Di..1.0000.0200.0200.100图18-6椭圆光源参数设置如图18-6所示设置光源参数,类型 object Type选择 Source e11ipse,位置zPoSItion设为-50.02,绘图光线数目 Layout rays设为50,分析光线数目 AnalysisRayS改为500000,半轴长度(相当于光阑) X Half width、 Y Half width均设为0.02(小于光纤半径),光源距离 Source distance设为0.1,其他参数默认即可。如此设置,光源距离和光阑尺寸的配合,恰好获得数值孔径NA为0.2的光源。然后在光纤输岀端、距离光纤端面0.5mm的位置放置一个探测器,检测输出光线分布情况,探测器像素500,尺寸要比预测光斑尺寸略大一些(一般2倍即可)设置完华,打开3D光路结构图,如图18-7所示。可见与图18-4所示的混合序列模式没有明显区别,除了绘图光线均匀性的区别,非序列模式中绘图光线为随机分布方式,而序列模式中绘图光线为均匀分布方式将图像局部放大,观察光纤输入端和输出端,注意光线是否有溢出或者发散角与设想的是否一致等等,分别如图18-8和18-9所示。因为,笔者实测发现一个问题,减小光纤直径,到一定程度之后,就会影响输出端的光线数值孔径,似乎一部分发散角大的光线被消去,输出的光线数值孔径变小了。但是,这时如果将光纤长度缩短到一定程度后,输出光线的数值孔径又能恢复正常。这个问题具体是由什么原理、原因造成的,口前还不知道。也就是说,用这个圆柱体cy1 inder yo lume来模拟光纤,需要注意育径-长度比例,否则丢失信息,读者注意。《 Matlab辅助激光光学分析与应用》作者出品Zemax激光光学设计实例应用—自学案例汇编图18-73D光路结构图(非序列模式图18-83D光路结构图-光纤前端(非序列模式)《 Matlab辅助激光光学分析与应用》作者出品Zemax激光光学设计实例应用—自学案例汇编图18-93D光路结构图-光纤出端(非序列模式)接着,打开探测器观察窗口,再打开光线追迹控制器,追迹所有探测器光线。这里,我们放置了两个探测器,分别在光线输出端口和光线聚焦位置。先看光纤输出端的光线分布,如图18-10所示为相干模式下,光纤输出端附近的光斑形状及光线密度分布情况,从图上看,分布不是很均匀,但大体还是可以看出光斑整体轮廓效果:;再切换到非相干模式下,如图18-11所示,我们看到这时光线分布严重不均匀,甚至光斑轮廓都看不到了,这显然已经和实际经验相去甚远了。133,S1l5宁,四了了4:1F315宁,H4,529,总92H,3屮DETEC T0R工MRGE: COHEEENT工RRFD工FNCED: YHG旺 AM BELTVERT SIST日正,屮日國翼的,题 H NILLLHETERXELS 500WX 591 H. TOTAL HITS =499993FHc:1,用92《 Matlab辅助激光光学分析与应用》作者出品Zemax激光光学设计实例应用—自学案例汇编图18-10探测器光线分析-光线输出端(相干模式)291625222三51292H1DETECTOR工HGE: INCOHERENT RR工HNE正囚,"HM工ET防.PIEs5EW5〗H.卫THT=曾們EF工RRR工RNCE40TE+004 HATTSCH 2TOTHL POWERi 9 9998E-00L HTT5图18-11探测器光线分析-光线输出端(非相干模式)121,5L,2272,55四DETE匚TDR工NRGE: COHERENT工 =EDLNCEND: HG BERM ELTWERY STSTEMTUE MAY正 ETECTOR 9. NSCG SLRFRCE正EW2@H山工TE,FE§5W5H,TfHT=2PEF TRRAOTFNCE i 12785E+00L ATTSCH"?OTAL POWER2.5占5E-2 MATTS图18-12探测器光线分析-聚焦光斑(相干模式)《 Matlab辅助激光光学分析与应用》作者出品Zemax激光光学设计实例应用—自学案例汇编r94:15屮714,72535,32555,123827E58 8317ETEGTUE工MRGE: INCOHEENT RRH工RNCELD: YAG BERM DELIVERY SYSTE1RCE 1SLZE 4I LX 21DE5 H MILLLHE TER PLNELS 59 5X 505 H. OTAL HTs =197978CE::60:m2TOTHL FILER图18-13探测器光线分析-聚焦光斑(非相干模式)再看另外一个探测器,光线经过透镜光学系统整形聚焦后的光斑形状和光线分布情况,相干模式和非相干模式分别如图18-12和18-13所示。同样,相干模式虽然分布也不均匀但基本还能看出光斑轮廓为以椭圆光斑;而非相干模式下,光线分别很不均匀,看上去光斑形状也不是椭圆形,而是一个变形了的菱形。于是,笔者怀疑光源的选择和设置可能不人合理。可能是由于光源本质还是一个点光源,即使通过光纤(圆柱体)后光线也没能有效匀化所致。那么,换一个光源类型,比如半导体光源 Source diode会不会更好一些。如图18-14所示,光源类型选择 Source diode,位置 z Postion设为-50.02,绘图光线数目Layout rays设为50,分析光线数目 Analysis Rays设为500000,发散角X- Di vergence、Y- DI vergence均设为12(匹配光纤数值孔径),其他参数默认即可。如此设置,获得的数值孔径NA差不多也为0.2的光源ε然后同样在光纤输出端、距离光纤端面0.5mm的位置放置一个探测器,检测输岀光线分布情况,探测器像素500,尺寸要比预测光斑尺寸略大一些(一般2倍即可)。更新3D光路结构图,放大观察光纤入射端和输出端的光线情况,分别如图18-15和18-16所示,可见都还比较正常,没有溢出光线,输出发散角也比较合理。《 Matlab辅助激光光学分析与应用》作者出品Zemax激光光学设计实例应用—自学案例汇编object TypeComment Position Material+ I ayout.*Analysi.Source diode0,U∠0object Type Astigmatismx-Diver ge.X-superGa.Y-Diverge.Y-superGasource D1 odel0.0D012.000.0112.0000.01图18-14导体光源参数设置图18-153D光路结构图-光纤前端图18-163D光路结构图-光纤输出端《 Matlab辅助激光光学分析与应用》作者出品Zemax激光光学设计实例应用—自学案例汇编311,忌HL428,总5732屮9,"F31之18,28187,1H6」5s.92712,3白占2,3日318H1JE TEG TOR工MRGE:Cu仨RENT工 CERO LHNGELD: YAG BERM DELIVERY SYSTE1灯T职R1, NSCE RFACE L江正区W翼四,HM工能防,PXL5E的日H.ILHT=8工RRRL工FNCE:3,1L8HE+2H^2TOTHL PERB,5551E-图18-17探测器光线分析-光线输出端(相干模式)H⑦13屮131忌3L7s叫sDETECTOR工MRGE:工 COHEZET工RRR囗工FCEHG BERM DELIVERY SYSTE正 TECTOR10. NSCG EURFACE LX,啦H工能TE,PX555H而HT=第83工 H:z:22SrCH+图18-18探测器光线分析-光线输出端(非相干模式)《 Matlab辅助激光光学分析与应用》作者出品
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