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mie
该函数程序用于计算大气米散射中吸收、散射、衰减、后向散射。(Computation of Mie Efficiencies extinction (qext), scattering (qsca), absorption (qabs), backscattering (qb), asymmetry parameter (asy=<costeta>) and (qratio=qb/qsca).)
- 2013-06-09 10:57:31下载
- 积分：1
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AR
说明： 使用时间序列分析AR方法对油价进行分析，以及预测。采用BIC准则进行判阶，最小二乘法进行参数估计(AR time series analysis using the method of price analysis and forecasting. BIC criteria used sentence order, the least square method for parameter estimation)
- 2009-06-08 09:19:56下载
- 积分：1
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sudoku
The following is an example of how Microsoft Solver Foundation can be used to solve a constraint satisfaction problem (CSP) like generating a typical Sudoku problem.
Sudoku
http://www.codeproject.com/Articles/419389/Sudoku-using-Microsoft-solver-foundation
In this article I do not attempt to explain everything there is to know about constraint satisfaction problems, but I will go over the concepts in the hope that even if you have never heard of CSP you will still get the idea.
- 2012-07-30 16:59:24下载
- 积分：1
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GM(11)
gm模型 gm模型 gm模型 gm模型 gm模型 GM(1,1)(gm model gm model gm model gm model gm model GM (1,1))
- 2006-05-28 09:24:05下载
- 积分：1
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第19章 离散相模型 - 副本
FLUENT中离散相粒子追踪设置及相关计算，设计用户自定义相关内容(Discrete phase particle tracking in FLUENT)
- 2020-06-20 19:40:02下载
- 积分：1
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MalmquistLuenberger
基于R程序的malmquist-luenberger 指数的计算源代码。(Malmquist- luenberger index calculation based on R program source code.)
- 2020-08-23 14:07:46下载
- 积分：1
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zhaomingdagonglvfaguanerjiguan
根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电
银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) .
采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选
择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)
- 2012-10-25 13:22:30下载
- 积分：1
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adi
说明： matlab的adi方法求解偏微分方程，精确度较高(ADI method of MATLAB for solving partial differential equations)
- 2021-04-17 17:38:52下载
- 积分：1
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chebfun-svd
求解O-S方程特征值，可以适用于多种条件下的O-S方程特征值计算(To solving OS Equation characteristic value, can be applied to a variety of conditions OS equation eigenvalue calculation)
- 2013-03-12 00:27:14下载
- 积分：1
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line_guiyi
数据归一化处理，对数据进行一个标准化处理，将各个不同单位的变量，转换成无量纲的量(Data normalization, a standardization of data processing, will be different units of variables, into dimensionless quantities)
- 2019-04-17 17:36:24下载
- 积分：1
