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SolidSAP
说明： berkeley加州大学SAP系列软件之SolidSAP，由Edward L.Wilson教授开发的三维结构源程序，功能强大，代码清晰，含学习手册。(SolidSAP, a three-dimensional structure source program developed by Professor Edward L. Wilson, is a software of the SAP series at the University of California, Berkeley. It has powerful functions, clear code and learning manual.)
- 2020-06-16 05:40:02下载
- 积分：1
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mxuliedejisuanjichengcheng
伪随机序列（N=4的M序列）的C语言编程实现，可以应用于相关分析法和最小二乘辨识的输入信号。(Pseudo-random sequence (N = 4 M-sequence) of the C programming language, can be used in correlation analysis and least squares identification of the input signal.)
- 2009-04-09 10:25:13下载
- 积分：1
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zfft
FFT+FT连续细化傅立叶变换分析校正法
还请各位多多指教。
参考自丁康老师《离散频谱校正技术》
(FFT+ FT for Fourier transform analysis of detailed correction method is also called upon the exhibitions. Ding Kang reference from the teacher, " Discrete Spectrum Correction" )
- 2009-06-30 22:41:50下载
- 积分：1
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matlabFunctions
说明： 在matlab实现基于Schmidt的QR分解，共轭梯度法等(QR decomposition based on Schmidt in MATLAB)
- 2020-01-13 11:19:51下载
- 积分：1
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Famous-Numerical-Iteration-Algorithm
提供几种著名的大型线性方程组迭代算法，包括CG、PCG、Lanczos、MINRES(Several well-known large-scale linear equations iterative algorithm, including CG, PCG, Lanczos, MINRES)
- 2012-11-26 16:41:41下载
- 积分：1
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EMCP21511
利用BLT方程求解平面波对双线结构传输线的终端响应。(BLT equation for solving the plane wave transmission line on two-lane structure of the terminal response.)
- 2012-07-11 18:54:29下载
- 积分：1
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sisal_demo
高光谱解混合方法，变分增强拉格朗日线性解混合方法。(A Variable splitting Augmented Lagragian Approach to Linear Spectral Unmixing)
- 2012-07-06 17:31:31下载
- 积分：1
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vasp.5.4.1.05Feb16.tar
vasp，功能强大的第一性原理计算软件，请注意版权(The Vienna Ab initio Simulation Package (VASP) is a computer program for atomic scale materials modelling, e.g. electronic structure calculations and quantum-mechanical molecular dynamics, from first principles.)
- 2021-01-13 18:08:47下载
- 积分：1
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MD
说明： 从别的网上下来的，是一个简单又经典的分子动力学模拟程序，很适合初级使用。(for molecular simulation)
- 2010-06-08 14:55:11下载
- 积分：1
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zhaomingdagonglvfaguanerjiguan
根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电
银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) .
采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选
择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)
- 2012-10-25 13:22:30下载
- 积分：1
